microsemi copyright ? 20 11 rev. 0. 1, april 2011 www. microsemi . com lx 242 32 - 32 channel back l ight led driver tm ? l l x x 2 2 3 3 0 0 4 4 www. microsemi . com p p r r o o d d u u c c t t b b r r i i e e f f lx24 2 32 description key features the lx24232 is a 32 - c hannel d isplay b acklight led c ontroller. the device is part of a chipset consisting of the lx24232 and the lx23108 a 8 - channel led driver. each controller is capable of controlling up to 32 led channels, by controlling up to four lx23108 a led drivers. each d ri ver contains eight fets and control s up to 4 x 8 led channels, where each channel is capable of driving a current of up to 200ma. the lx24232 has 32 independent, frame - by - frame controlled pwm output channel s; each output channel supports independent duty - cycle and phase delay control. it uses a v sync input for flexible synchronization schemes, including synchronization to ei ther rising or falling edges, optimal v sync jitter support, as well as single or multiple pwm cycles per frame support, and loss of v sync support. the lx24232 consists of an on - chip internal power supply control circuitry that can be used to adjust the voltage level of an external led power source. this is done by regulating the led supply voltage to the optimum level, and thus minimizing the system power loss. at the same time, accurate current regulation for each of the 32 led strings is maintained. the lx24232 includes an on - chip analog to digital converter for drain voltage (vd) measurements , for power supply control, fault detection and protecti on. the device is configured through the spi interface which speeds up communication and reduces the number of control signals between the lx24232 and the h ost system (fpga, video processor, and cpu). the lx24232 supports a daisy chain connection in case more than 32 channels are required and can detect three types of system faults on each of its 32 channels (over - temperature, open leds and short leds). after detecting the faults the unit takes the required measures to protect the system . the lx242 32 is capable of controlling up to 8 lx23108a drivers, in a special configuration where two consecutive channels are connected together for increased current support. refer to the application note for more details. ? white led or rgb back l ight driver for lar ge size display panels ? up to 32 led strings with 1.5 % precision current matching ? wide dimming ratio with pwm and led current amplitude control ? 12- bit pwm duty - cycle resolution and 8 - bit resolution for led current setting ? led power supply voltage control ? spi communication interface ? open string, short led and over - temperature protection for each individual channel ? on - chip thermal monitoring package order info t a ( c) plastic 8x8mm qfn 56 pin rohs compliant /pb free - 40 to + 85 c lx242 32ilq note : available in tape & reel. append the letters ?tr? to the part number. (i.e. lx242 32ilq - tr)
microsemi copyright ? 2011 rev. 0. 1, april 2011 www. microsemi . com lx242 32 - 32 channel back l ight led driver tm ? l l x x 2 2 3 3 0 0 4 4 www. microsemi . com c c o o m m p p a a n n y y c c o o n n f f i i d d e e n n t t i i a a l l lx242 32 pin configuration LX24232ILQ 32-channel led driver pwm28 pwm27 pwm26 pwm25 pwm24 pwm23 pwm22 pwm21 pwm20 pwm19 pwm31 pwm30 pwm29 psel_sig scan3 vref psel_clk fault_in vdmeas vcc vdd vzap atb_p atb_n clk sync_in sync_out cs_n sck sdi sdo mod0 mod1 scan0 scan1 ps_ctrl pwm12 pwm11 pwm10 pwm09 pwm08 pwm07 pwm06 pwm05 pwm04 pwm03 pwm02 pwm01 pwm00 scan2 pwm18 pwm17 pwm16 pwm14 pwm13 pwm15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 42 41 40 39 38 37 36 35 34 33 32 31 30 29 56 55 54 53 52 51 50 49 48 47 46 45 44 43 absolute maximum rat ings supply input voltage (v cc , v dd ) ?. ???????????????..??????.? - 0.5v to 4.5v all other pins ???????????????????????.??. - 0.5v to vcc+0.3 up to 4.5v operating ambient temperature range ???????????????.??????. - 40 to 85 c maximum operating junction temperature ????????????????.??????. 150 c esd protection at all i/o pins ??????????????????.??????? +/ - 2kv hbm storage temperature range ??????????????????????.??. - 65 c to 150 c package peak temperature for solder reflow (40 seconds maximum exposure) ?.? 260c ( +0/ - 5c) notes: exceeding these ratings could result in damage to the device. all voltages ar e with respect to ground. thermal data ( power consumption) 21 c/w ? according to jesd51 - 7. thermal resistance - junction to ambient junction temperature calculation: t j = t a + (p d x ja ). for support contact: sales_amsg@microsemi.com or visit our website at www.microsemi.com .
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