triquint semiconductor, inc ? phone +1-503-615-9000 ? fax: +1-503-615-8900 ? e-mail: info-sales@tqs.com ? web site: www.triquint.com page 1 of 5 july 2009 ag606 push-pull catv amplifier product features ? 50 ? 1000 mhz ? 0.7 db gain flatness ? +20 dbm p1db ? +37 dbm output ip3 ? +73 dbm output ip2 ? -68 dbc ctb +34 dbmv/channel, 79 channels ? -80 dbc cso +34 dbmv/channel, 79 channels ? matched amplifiers for a push-pull configuration ? +7v single positive supply ? mttf > 1000 years applications ? catv head end equipment ? catv line amplifiers ? ftth repeaters product description the ag606 is a dual amplifier containing two internal matched amplifiers optimal for a push-pull configuration. the internal amplifiers employ ingap hbt technology for a cost-effective low-distortion solution. the ag606 is ideal for drop amplifiers, splitters, and other low to moderate power outside plant catv applications. the amplifier can also be useful in low power headend applications such as linear laser drivers. the ag606 has excellent vswr when used in a 75 push-pull configuration. it is provided in a low-cost environmentally-friendly lead-free/green/ rohs-complia nt soic-8 package. functional diagram function pin no. amp 1 input 1 amp 2 input 4 amp 2 output 5 amp 1 output 8 ground 2, 3, 6, 7, backside paddle single-ended device specifications (1) parameter units min typ max test frequency mhz 800 gain db 13.2 14.3 15.5 output ip3 (2) dbm +33.5 +36 device current ma 76 82.5 90 device voltage v 5.25 1. test conditions unless otherwise noted: t = 25 oc, 800 mhz on each individual single-branch amplifier in a 50 test fixture using a +7v supply and a 20.5 dropping resistor. 2. 3oip measured with two tones at an output power of +5 dbm/tone separated by 1 mhz. the suppression on the largest im3 product is used to c alculate the 3oip using a 2:1 rule. 3. typical parameters reflect performance in a push -pull application circuit. 4. balun, board, and connector losses have not bee n extracted, but typically account of 0.4 db loss midband and 1.1 db loss at 860 mhz. 5. measured at +34 dbmv/channel, 79 channels flat loading. 6. oip2 is measured at f1 + f2 at +5 dbm / tone. absolute maximum rating parameter rating storage temperature -55 to +125 c supply voltage +7 v rf input power (continuous) +13dbm thermal resistance, rth 63 c/w max junction temperature, t j for 10 6 hours mttf 177 c operation of this device above any of these paramet ers may cause permanent damage. typical performance (3) parameter units typical frequency mhz 50 250 450 860 gain (4) db 14.3 14.2 13.9 12.9 input r. l. db 21 28 18 11 output r. l. db 17 18 16 18 ctb (5) dbc -69 -67 -67 cso (5) dbc -81 -87 -80 xmod (5) dbc -60 -61 -60 output p1db dbm +20.7 +20.5 +20.3 +22 output ip2 (6) dbm +73.6 +76.1 +76.4 +76.6 output ip3 (2) dbm +37.5 +37.5 +37.3 +39.2 noise figure (4) db 5 5 5.3 5.9 device bias v +5.25 v @ 165 ma ordering information part no. description ag606-g push-pull catv amplifier (lead-free /green/ rohs-compliant soic8 pkg) AG606-PCB fully assembled catv evaluation board standard t/r size = 500 pieces on a 7? reel. 1 2 3 4 8 7 6 5
triquint semiconductor, inc ? phone +1-503-615-9000 ? fax: +1-503-615-8900 ? e-mail: info-sales@tqs.com ? web site: www.triquint.com page 2 of 5 july 2009 ag606 push-pull catv amplifier typical device data ? 50 ? z 0 s-parameters (v dev = +5.25 v, i cc = 82.5 ma, t = 25 c, unmatched 50 ohm system, calibrated to device le ads) these represent a single-ended amplifier in the ag6 06, with there being two matched amplifiers inside the package. freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 -12.03 178.56 14.61 177.32 -18.85 -0.01 -17.45 1 78.57 100 -12.09 174.32 14.61 175.28 -18.74 -1.56 -17.08 178.23 150 -11.81 172.20 14.62 173.13 -18.76 -2.21 -17.28 176.63 200 -11.81 169.91 14.59 170.74 -18.81 -3.25 -16.86 176.45 250 -11.64 168.30 14.62 168.67 -18.77 -3.74 -17.24 173.88 300 -11.79 166.47 14.63 165.71 -18.81 -4.12 -17.00 174.14 350 -11.76 164.70 14.68 163.24 -18.79 -4.96 -17.20 172.40 400 -12.02 162.35 14.59 161.23 -18.84 -5.99 -16.85 173.24 450 -11.92 159.27 14.48 158.25 -18.82 -5.99 -17.02 170.87 500 -11.92 156.13 14.53 156.14 -18.80 -6.63 -16.70 169.98 550 -11.77 154.71 14.48 154.05 -18.86 -7.58 -16.78 167.35 600 -11.75 151.64 14.52 151.45 -18.79 -8.02 -16.47 167.79 650 -11.67 150.04 14.45 148.59 -18.74 -9.17 -16.49 164.94 700 -11.89 147.47 14.41 146.59 -18.83 -9.41 -16.48 164.76 750 -11.72 145.07 14.43 144.30 -18.89 -10.48 -16.43 161.86 800 -11.76 143.08 14.33 141.92 -18.87 -11.22 -16.23 161.91 850 -11.56 141.20 14.36 139.40 -18.87 -11.88 -15.86 158.92 900 -11.65 138.97 14.26 137.14 -18.80 -12.23 -15.78 159.88 950 -11.57 137.28 14.28 134.86 -18.79 -13.52 -15.51 156.89 1000 -11.56 135.12 14.19 132.17 -18.86 -13.15 -15.3 4 156.79 typical device data ? 50 ? z 0 s-parameters (v dev = +5.25 v, i cc = 82.5 ma, t = 25 c, unmatched 37.5 ohm system, calibrated to device leads) these represent a single-ended amplifier in the ag6 06, with there being two matched amplifiers inside the package. freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 -34.66 173.49 14.79 177.27 -18.66 -0.06 -19.98 - 0.57 100 -33.64 133.95 14.81 175.12 -18.54 -1.71 -20.40 -3.63 150 -30.17 137.29 14.82 172.89 -18.56 -2.45 -20.15 -4.04 200 -29.21 131.02 14.80 170.45 -18.60 -3.54 -20.91 -7.28 250 -27.90 131.37 14.83 168.30 -18.57 -4.11 -20.34 -5.91 300 -28.12 124.34 14.84 165.33 -18.61 -4.51 -20.82 -9.61 350 -27.59 122.31 14.88 162.80 -18.59 -5.40 -20.57 -10.25 400 -27.52 110.86 14.79 160.77 -18.65 -6.45 -21.33 -14.80 450 -25.69 107.75 14.68 157.66 -18.62 -6.58 -21.31 -13.74 500 -24.49 101.63 14.73 155.45 -18.61 -7.32 -21.94 -15.66 550 -23.76 104.95 14.68 153.27 -18.66 -8.35 -22.13 -13.89 600 -22.84 100.16 14.72 150.61 -18.59 -8.86 -22.79 -18.83 650 -22.46 101.72 14.65 147.66 -18.53 -10.10 -23.13 -17.61 700 -22.06 95.00 14.60 145.62 -18.64 -10.38 -23.54 -19.44 750 -21.15 95.84 14.62 143.20 -18.70 -11.58 -24.06 -16.74 800 -20.79 94.07 14.53 140.77 -18.68 -12.37 -25.05 -20.60 850 -20.09 95.55 14.56 138.11 -18.67 -13.17 -26.61 -16.06 900 -19.78 92.24 14.45 135.83 -18.60 -13.53 -27.43 -23.50 950 -19.42 92.70 14.48 133.44 -18.59 -14.94 -29.28 -17.34 1000 -18.88 90.91 14.39 130.68 -18.66 -14.64 -31.32 -18.82
triquint semiconductor, inc ? phone +1-503-615-9000 ? fax: +1-503-615-8900 ? e-mail: info-sales@tqs.com ? web site: www.triquint.com page 3 of 5 july 2009 ag606 push-pull catv amplifier application circuit pc board layout circuit board material: .028? fr4, 4 - layer, 1 oz copper, microstrip line details: width = .021?, spacing = .021?. c1, c2, r3, c3, r4 and c4 are sho wn in the silkscreen but are not required in the sc hematic. typical rf performance at 25 c 1. balun, board, and connector losses have not bee n extracted, but typically account for 0.4 db loss midband and 1.1 db loss at 860 mhz. 2. cso, ctb, & xmod are measured at +34 dbmv/chann el, 79 channels flat loading. 3. oip2 is measured at f1 + f2 at 5 dbm / tone. 4. oip3 is measured at +5 dbm / tone with 1 mhz sp acing. recommended bias resistor values supply voltage r1/r2 value size 7 v 20.5 ohms 1206 8 v 32.5 ohms 1210 9 v 44.5 ohms 2010 10 v 56.5 ohms 2010 12 v 81 ohms 2010 24 v 227 ohms 2 watts 75 ? push-pull application circuit performance (vsupply = +7 v, r bias = 20.5 ? , 25 c) s21 vs. frequency 6 8 10 12 14 16 0 200 400 600 800 1000 frequency (mhz) s 2 1 (d b ) +25c -40c +85c s11 vs. frequency -40 -30 -20 -10 0 0 200 400 600 800 1000 frequency (mhz) s 11 (db) +25c -40c +85c s22 vs. frequency -40 -30 -20 -10 0 0 200 400 600 800 1000 frequency (mhz) s 2 2 ( d b ) +25c -40c +85c frequency mhz 50 250 450 860 gain (1) db 14.3 14.2 13.9 12.9 input r.l. db 21 28 18 11 output r.l. db 17 18 16 18 ctb (2) dbc -69 -67 -67 cso (2) dbc -81 -87 -80 xmod (2) dbc -60 -61 -60 output p1db dbm +20.7 +20.5 +20.3 +22 output ip2 (3) dbm +73.6 +76.1 +76.4 +76.6 output ip3 (4) dbm +37.5 +37.5 +37.3 +39.2 noise figure (1) db 5 5 5.3 5.9 device current ma 165 device voltage v +5.25 t1: m/a com etc1 - 1 - 13 t2: m/a com etc1-1-13 5. all components are 0603 in size unless otherwise noted. 6. 1% tolerance is for r1 and r2. 7. the dc resistance of l1 and l2 should be less th an 1 ohm.
triquint semiconductor, inc ? phone +1-503-615-9000 ? fax: +1-503-615-8900 ? e-mail: info-sales@tqs.com ? web site: www.triquint.com page 4 of 5 july 2009 ag606 push-pull catv amplifier 75 ? push-pull application circuit performance (cont?d) (vsupply=7v, r bias = 20.5 ? , 25 c) p1db vs. frequency 14 16 18 20 22 24 0 200 400 600 800 1000 frequency (mhz) p 1 d b ( d b m ) +25c -40c +85c noise figure vs. frequency (application board) 2 3 4 5 6 7 0 200 400 600 800 1000 frequency (mhz) n f (d b ) +25c -40c +85c noise figure vs. frequency at 25c (device) 2 3 4 5 6 7 0 200 400 600 800 1000 frequency (mhz) n f (d b ) oip3 vs. frequency 1 mhz spacing, +5dbm / tone 30 32 34 36 38 40 0 200 400 600 800 1000 frequency (mhz) o i p 3 (d b m ) +25c -40c +85c oip2 vs. frequency 1 mhz spacing, +5 dbm / tone 60 65 70 75 80 85 0 200 400 600 800 1000 frequency (mhz) oip2 (dbm) +25c -40c +85c xmod, ctb and cso vs. frequency @ 34 dbmv at 25c -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 frequency (mhz) x m o d , c t b a n d c s o (d b c ) xmod ctb cso cso vs. frequency 79 channel flat loading, 34 dbmv -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 frequency (mhz) c s o (d b c ) -40c +25c +85c ctb vs. frequency 79 channel flat loading, 34 dbmv -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 frequency (mhz) c t b ( d b c ) -40c +25c +85c xmod vs. frequency 79 channel flat loading, 34 dbmv -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 frequency (mhz) x m o d (d b c ) -40c +25c +85c cso vs. frequency 79 channel flat loading at 25c -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 frequency (mhz) c s o (d b c ) 30 dbmv 32 dbmv 34 dbmv 36 dbmv 38 dbmv ctb vs. frequency 79 channel flat loading at 25c -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 frequency (mhz) c t b (d b c ) 30 dbmv 32 dbmv 34 dbmv 36 dbmv 38 dbmv xmod vs. frequency 79 channel flat loading at 25c -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 frequency (mhz) x m o d (d b c ) 30 dbmv 32 dbmv 34 dbmv 36 dbmv 38 dbmv
triquint semiconductor, inc ? phone +1-503-615-9000 ? fax: +1-503-615-8900 ? e-mail: info-sales@tqs.com ? web site: www.triquint.com page 5 of 5 july 2009 ag606 push-pull catv amplifier ag606-g (lead-free package) mechanical information this package is lead-free /green/ rohs-compliant. the pla ting material on the leads is nipdau. it is compatible wi th both lead-free (maximum 260 c reflow temperature) and lead (maximum 245 c reflow temperature) soldering processes. outline drawing land pattern product marking the ag606 will be marked with an ?ag606g? designator with a lot code marked below the part designator. the ?y? represents the last digit of the year the part was manufactured, the ?xxx? is an auto-generated number, and ?z? refers to a wafer number in a lot batch. tape and reel specifications for this part are located on the website in the ?application notes? section. esd / msl information esd rating: class 1c value: 1000 to 2000 v test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: class iv value passes greater than 1000 v test: charge device model (cdm) standard: jedec standard jesd22-c101 msl rating: level 2 at +260 c convection reflow standard: jedec standard j-std-020a mounting config. notes 1. ground / thermal vias are critical for the prope r performance of this device. vias should use a .35mm (#80/.0135 ?) diameter drill and have a final plated through diam eter of .25mm (.010?) 2. add as much copper as possible to inner and ou ter layers near the part to ensure optimal thermal performance . 3. to ensure reliable operation, device ground pa ddle-to- ground pad solder joint is critical. 4. add mounting screws near the part to fasten the board to a heatsink. ensure that the ground / thermal via reg ion contacts the heatsink. 5. for optimal thermal performance, expose solder mask on backside where it contacts the heatsink. 6. rf trace width depends upon the pc board mater ial and construction. 7. use 1 oz. copper minimum. 8. if the pcb design rules allow, ground vias shoul d be placed under the land pattern for better rf and thermal performance. otherwise ground vias should be place d as close to the land pattern as possible. 9. all dimensions are in mm. angles are in degrees .
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