www.dynexsemi.com 1 thyristor and diode pressure contact modules
www.dynexsemi.com 2 introduction dynex semiconductor is one of the world s leading designers and manufacturers of industrial high power semiconductors. the company s unique capabilities permit the manufacture of both standard bipolar semiconductors and new generation insulated-gate bipolar transistors. the company s power products are used to improve the efficiency, reliability and quality of the electric power in: power transmission and distribution alternative power generation marine and rail propulsion aerospace medical equipment heavy industries such as metal smelting and mining telecommunications electric vehicles dynex offers a comprehensive range of isolated base-plate water and air cooled dual thyristor (scr), dual diode, and thyristor/diode modules with industry standard footprints. the diode and thyristor chips within the modules are available in several combinations to make different circuit configurations easily realisable. isolation is achieve without the use of beryllium oxide, thus avoiding any potential health hazards in the event of a major current fault causing structural damage to the module. all the dynex bipolar modules are of a pressure contact construction for maximum life under duties with a high degree of temperature cycling. in addition all the modules are recognised under the recognised components program of underwriters laboratories inc. usa, ul file no. e15069 or have applications pending . nomenclature example: mp03hbt360-12 mp03 - outline type code. hbt - circuit configuration. (please see circuit configurations on page 5). 360 - average current rating per arm or welding rating rms current. 12 - voltage grade / 100 the dynex line of pressure contact isolated modules includes air and liquid cooled base plate variants and are available in dual thyristor (scr) and/or diode combinations 1800v mp04 water cooled thyristor module with w3 baseplate 1800v mp03 dual thyristor module with air cooled baseplate.
www.dynexsemi.com 3 thyristor (scr) modules air cooled thyristor (scr) modules water cooled thyristor (scr) modules r e b m u n t r a p v = * * m r d 0 0 1 / v m r d v / m r r i ) v a ( t t t a m r a r e p e s a c d e i f i c e p si m s t @ t j v i 2 t t @ j v t d / v d. p e r - n o n t d / i d e g a k c a p e n i l t u o e p y t e d o c e g a k c a p . s m i d / e t a l p e s a b t h g i e h ) v ( @ c ? 5 7 ) a ( @ c ? 0 8 ) a ( @ c ? 5 8 ) a ( @ c ? 0 9 ) a ( @ c ? 5 9 ) a ( @ c ? 0 0 1 ) a () a k (a ( 2 0 1 x s 3 )/ v ( ) s/ a ( ) s) m m ( * * - 0 9 1 x x x 2 0 p m 0 0 2 1 - 0 0 8 0 9 1 3 7 1 8 5 1 1 4 1 5 2 1 7 0 1 5 . 5 1 5 1 0 0 0 1 0 0 5 2 0 p m 0 3 / 4 3 x 4 9 * * - 0 9 1 x x x 3 0 p m0 0 2 1 - 0 0 80 9 13 7 18 5 11 4 15 2 17 0 15 . 51 5 10 0 0 10 0 53 0 p m2 5 / 0 5 x 2 9 * * - 0 3 3 x x x 3 0 p m 0 0 2 1 - 0 0 8 4 3 3 0 1 3 6 8 2 2 6 2 6 3 2 9 0 2 6 . 0 1 0 6 5 0 0 0 1 0 0 5 3 0 p m 2 5 / 0 5 x 2 9 * * - 0 6 3 x x x 3 0 p m0 0 2 1 - 0 0 82 5 33 4 38 1 32 9 25 6 26 3 26 . 0 10 6 50 0 0 10 0 53 0 p m2 5 / 0 5 x 2 9 * * - 5 7 1 x x x 2 0 p m 0 0 6 1 - 0 0 0 1 5 7 1 2 5 1 8 3 1 3 2 1 8 0 1 2 9 8 . 6 1 3 2 0 0 0 1 0 0 5 2 0 p m 0 3 / 4 3 x 4 9 * * - 5 7 1 x x x 3 0 p m0 0 6 1 - 0 0 0 15 7 12 5 18 3 13 2 18 0 12 98 . 61 3 20 0 0 10 0 53 0 p m2 5 / 0 5 x 2 9 * * - 0 0 3 x x x 3 0 p m 0 0 6 1 - 0 0 0 1 2 1 3 9 8 2 5 6 2 0 4 2 4 1 2 6 8 1 6 . 0 1 0 6 5 0 0 0 1 0 0 5 3 0 p m 2 5 / 0 5 x 2 9 * * - 5 7 2 x x x 3 0 p m0 0 8 1 - 0 0 2 17 7 26 5 24 3 21 1 26 8 11 6 11 . 80 3 30 0 0 10 0 53 0 p m2 5 / 0 5 x 2 9 * * - 0 9 5 x x x 4 0 p m 0 0 8 1 - 0 0 2 1 5 9 5 9 4 5 4 0 5 6 5 4 6 0 4 3 5 3 4 1 5 7 9 0 0 0 1 0 0 5 4 0 p m 2 5 / 0 6 x 4 2 1 * * - 0 3 1 x x x 2 0 p m0 0 8 1 - 0 0 6 14 3 14 2 13 1 11 0 19 86 74 0 80 0 0 10 0 52 0 p m0 3 / 4 3 x 4 9 * * - 0 3 1 x x x 3 0 p m 0 0 8 1 - 0 0 6 1 4 3 1 4 2 1 3 1 1 1 0 1 9 8 6 7 4 0 8 0 0 0 1 0 0 5 3 0 p m 2 5 / 0 5 x 2 9 * * - h 0 6 3 x x x 3 0 p m0 0 8 1 - 0 0 6 15 5 33 3 30 1 35 8 29 5 22 3 21 . 80 3 30 0 0 10 0 53 0 p m2 5 / 0 5 x 2 9 * * - 0 9 4 x x x 4 0 p m 0 0 8 2 - 0 0 8 1 0 9 4 7 5 4 1 2 4 3 8 3 3 4 3 0 0 3 5 2 . 1 1 3 3 6 0 0 0 1 0 0 5 4 0 p m 2 5 / 0 6 x 4 2 1 notes: 1. v dsm /v rsm = v drm /v rrm + 100v respectively. 2. isolation voltage for all types is 3kv a.c. rms. 3. xxx is shown in the part number as a substitution for the circuit configuration reference code, pl ease see page 5 for standard dynex circuit configurations. 4. gate and auxiliary cathode leads are not supplied as standard but can be purchased separately. 5. voltage isolation is provided by alumina based substrates, manufactured by direct copper bonding processes. this is a non-toxic material and all modules are beryllia free. 6. the products listed are recognised under the recognised component progam of underwriters laboratories inc. usa, ul file no. e151069 or have applications pending. 7. package outline information is give on pages 6 and 7. r e b m u n t r a p v = * * m r d 0 0 1 / v m r d / v m r r ) v ( i ) v a ( t t @ r e t a w @ c ? 0 4 = . n i m r e p s e r t i l 5 . 4 ) m r a r e p ( ) a ( i m s t t @ j v ) a k ( i 2 t a ( 2 0 1 x s 3 ) t d / v d / v ( ) s . p e r - n o n t d / i d / a ( ) s e g a k c a p e n i l t u o e d o c e p y t 1 . s m i d e g a k c a p t h g i e h / e t a l p e s a b ) m m ( 2 1 w * * - 0 0 2 t t 2 0 p m 0 0 6 1 0 0 2 8 . 6 1 3 2 0 0 0 1 0 0 5 2 1 w - 2 0 p m 9 4 / 4 3 x 4 9 a 3 w * * - 0 0 3 t t 3 0 p m0 0 8 10 1 31 . 80 3 30 0 0 10 0 5a 3 w - 3 0 p m4 . 7 6 / 0 5 x 2 9 a 3 w * * - 0 0 6 t t 4 0 p m 0 0 8 1 0 8 5 4 1 5 7 9 0 0 0 1 0 0 5 a 3 w - 4 0 p m 4 . 7 6 / 0 6 x 4 2 1 a 3 w * * - 0 0 5 t t 4 0 p m0 0 8 20 8 45 2 . 1 13 3 60 0 0 10 0 5a 3 w - 4 0 p m4 . 7 6 / 0 6 x 4 2 1 notes: 1. other heatsinks are available, please contact customer services. 2. package outline information is give on pages 6 and 7.
www.dynexsemi.com 4 thyristor (scr) modules welding rated ac switch water cooled modules r e b m u n t r a p v = * * m r d 0 0 1 / g n i d l e w g n i t a r 1 i s m r ) a ( i . t n o c s m r e n i l @ t e l n i r e t a w c ? 5 2 . n i m r e p s r t l 5 . 4 ) a ( i m s t ) a k ( i 2 t a ( 2 s0 1 x 3 ) v m r r ) v ( t d / i d / a ( ) s t d / v d / v ( ) s e g a k c a p 2 e g a k c a p . s m i d e t a l p e s a b ) m m ( 2 1 w * * - 0 0 8 t t 2 0 p m 5 0 8 0 1 5 8 . 6 1 3 2 0 0 6 1 - 0 0 3 1 0 0 5 0 0 0 1 2 1 w - 2 0 p m 4 3 x 4 9 a 3 w * * - 0 5 2 1 t t 3 0 p m8 5 2 18 9 71 . 80 3 30 0 8 1 - 0 0 2 10 0 50 0 0 1a 3 w - 3 0 p m0 5 x 2 9 a 3 w * * - 0 0 4 1 t t 4 0 p m 8 0 5 1 5 8 1 1 5 2 . 1 1 3 3 6 0 0 8 2 - 0 0 2 2 0 0 5 0 0 0 1 a 3 w - 4 0 p m 0 6 x 4 2 1 a 3 w * * - 0 5 5 1 t t 4 0 p m0 7 6 18 3 4 14 15 7 90 0 8 1 - 0 0 2 10 0 50 0 0 1a 3 w - 4 0 p m0 6 x 4 2 1 notes: 1. water inlet temperature 40 ? c, 50% duty cycle, 20 cycles. 2. alternative water connections are available, please contact customer services. 3. package outline information is given on pages 6 and 7. diode modules air cooled diode modules r e b m u n t r a p v = * * m r r 0 0 1 / v m r r i ) v a ( t t t a m r a r e p e s a c d e i f i c e p si m s f t @ j v i 2 t t @ j v e g a k c a p e p y t e n i l t u o e d o c e g a k c a p . s m i d / e t a l p e s a b t h g i e h ) v ( @ c ? 5 7 ) a ( @ c ? 0 8 ) a ( @ c ? 5 8 ) a ( @ c ? 0 9 ) a ( @ c ? 5 9 ) a ( @ c ? 0 0 1 ) a () a k (a ( 2 0 1 x s 3 )) m m ( * * - 5 7 1 x x 2 0 p m 0 0 0 2 - 0 0 8 0 7 1 1 6 1 2 5 1 3 4 1 3 3 1 3 2 1 6 . 5 8 5 1 2 0 p m 0 3 / 4 3 x 4 9 * * - 0 6 2 x x 2 0 p m0 0 6 1 - 0 0 0 17 6 23 5 29 3 25 2 21 1 26 9 11 . 88 2 32 0 p m0 3 / 4 3 x 4 9 * * - 0 6 2 x x 3 0 p m 0 0 6 1 - 0 0 0 1 7 6 2 3 5 2 9 3 2 5 2 2 1 1 2 6 9 1 1 . 8 8 2 3 3 0 p m 2 5 / 0 5 x 2 9 * * - 0 8 2 x x 2 0 p m0 0 0 2 - 0 0 4 10 8 26 6 22 5 27 3 22 2 26 0 26 0 8 12 0 p m0 3 / 4 3 x 4 9 * * - 0 8 2 x x 3 0 p m 0 0 0 2 - 0 0 4 1 0 8 2 6 6 2 2 5 2 7 3 2 2 2 2 6 0 2 6 0 8 1 3 0 p m 2 5 / 0 5 x 2 9 * * - 0 4 4 x x 3 0 p m0 0 1 2 - 0 0 6 10 4 43 2 49 9 34 7 38 4 32 2 35 2 . 1 10 3 63 0 p m2 5 / 0 5 x 2 9 * * - 0 3 1 x x 2 0 p m 0 0 5 2 - 0 0 8 1 0 3 1 3 2 1 6 1 1 9 0 1 2 0 1 4 9 2 . 2 2 4 2 2 0 p m 0 3 / 4 3 x 4 9 * * - 0 1 9 x x 4 0 p m 0 0 0 3 - 0 0 2 1 5 1 9 3 7 8 0 3 8 6 8 7 0 4 7 2 9 6 0 2 0 0 0 2 4 0 p m 2 5 / 0 6 x 4 2 1 * * - 0 8 7 x x 4 0 p m 0 0 5 4 - 0 0 0 4 2 8 7 7 4 7 2 1 7 5 7 6 6 3 6 6 9 5 5 1 5 2 1 1 4 0 p m 2 5 / 0 6 x 4 2 1 notes: 1. v rsm = v rrm + 100v respectively. 2. isolation voltage for all types is 3kv a.c. rms. 3. xx is shown in the part number as a substitution for the circuit configuration reference code, pl ease see page 5 for standard dynex circuit configurations. e.g. mp02hb175-18. 4. voltage isolation is provided by alumina based substrates, manufactured by direct copper bonding processes. this is a non-toxic material and all modules are beryllia free. 5. the products listed are recognised under the recognised component progam of underwriters laboratories inc. usa, ul file no. e151069 or have applications pending. 6. package outline information is given on pages 6 and 7.
www.dynexsemi.com 5 t i u c r i c x e n y dc e p u er is y x iex r e w o p semikron n b h t dl k r ic d m- l k k s p b h d th k r id c m1 h k k s t t / t b h t tt k r ic c m3 t k k s g -c k r i--d m k s n g -j k r ia d m- d n k s d d / b h d dd k r id d m2 d k k s diode modules water cooled diode modules notes: 1. other heatsinks are available, please contact customer services. 2. v rsm = v rrm + 100v respectively. 3. isolation voltage for all types is 3kv a.c. rms. 4. voltage isolation is provided by alumina based substrates, manufactured by direct copper bonding processes. this is a non-toxic material and all modules are beryllia free. 5. the products listed are recognised under the recognised component progam of underwriters laboratories inc. usa, ul file no. e151069 or have applications pending. 6. package outline information is given on pages 6 and 7. r e b m u n t r a p v = * * m r r 0 0 1 / v m r r ) v ( i ) v a ( f t @ r e t a w c ? 0 4 = . n i m r e p s r t l 5 . 4 @ ) m r a r e p ( ) a ( i m s f t @ j v ) a k ( i 2 t a ( 2 0 1 x s 3 ) e g a k c a p 1 . s m i d e g a k c a p t h g i e h / e t a l p e s a b ) m m ( a 3 w * * - 0 1 8 d d 4 0 p m 0 0 0 3 2 1 8 0 2 0 0 0 2 a 3 w - 4 0 p m 4 . 7 6 / 0 6 x 4 2 1 circuit configurations cross reference with major manufacturers x e n y dc e p u er is y x ix e r e w o pn o r k i m e s 2 0 p m 4 3 p tk a p - a - t n i2 # e l y t s6 d c2 k a p i m e s 3 0 p m 0 5 p tk a p - a - n g a m3 # e l y t s4 d e3 k a p i m e s 4 0 p m 0 6 p t r e p u s k a p - a - n g a m 4 # e l y t s4 d l- module package outlines cross reference with major manufacturers package outline information is given on pages 6 and 7.
www.dynexsemi.com 6 module package outlines thyristor (scr) package outlines and circuit configurations all dimensions shown in mm unless stated otherwise. module type: mp02 23 23 24 34 30 94 6 . 5 nominal weight: 350 g 35 28 . 5 38 9 2 5 . 5 32 m8 42 . 5 k 2 nominal weight: 950g 94 49 2 off water connectors 1/4 - 18 ntp ( w12 ) w ater-way plu g 23 23 24 34 6 . 5 1 nominal weight: 750g 67 4 m3 hd 50 . 8 36 . 6 1 1 / 4 - 1 8 np t nominal weight: 1800g 31 6 150 112 25 . 4 6.5 ( 4 plc e m 1 0 th d m ax. 18dp 3 35 28 . 5 38 5.5 m8 42 . 5 2 nominal weight: 1300g 92 47 2 off water connectors 1/4 - 18 ntp connection thread 6 7. 4 g 1 k 1 k 2 g 2 1 23 circuit type: tt module type: mp02-w12 module type: mp03 module type: mp03-w3a 31 6 52 150 112 m 1 0 th d max. 18dp nominal weight: 1500g module type: mp04 g 1 k 1 k 2 g 2 1 23 circuit type: tt module type: mp04-w3a g 1 k 1 k 2 g 2 1 23 circuit type: tt 12 3 k 2 g 2 g 1 k 1 12 3 g 1 k 1 12 3 k 2 g 2 circuit type: hbt circuit type: hbn circuit type: hbp 12 3 k 2 g 2 g 1 k 1 12 3 g 1 k 1 12 3 k 2 g 2 circuit type: hbt circuit type: hbn circuit type: hbp 12 3 k 2 g 2 g 1 k 1 12 3 g 1 k 1 12 3 k 2 g 2 circuit type: hbt circuit type: hbn circuit type: hbp l i s r o d o h r 5 v 7 4 g n i n r o c w o d 0 0 2 c d l i s d i v a a 0 2 0 1 e e r f q p l i o n a c i r e m a c c i b 3 1 x b o c m e r a 4 6 6 l a i n u . p m e t . x a m c ? 0 2 1 c ? 5 1 3 c ? 0 0 2 c ? 0 0 2 c ? 0 6 2 c ? 5 8 2 c ? 0 2 1 . p m e t . n i mc ? 5 6 c ? 0 5 c ? 0 4 --- c ? 0 3 y t i v i t c u d n o c l a m r e h t k . m / w 2 1 . 0 k . m / w 5 5 1 . 0 k . m / w 3 9 7 . 0 0 1 x 7 . 6 1 4 ) c ? . m c . c e s ( l a c - 0 1 x 1 3 . 3 4 ) c ? . m c . c e s ( l a c - m m / v h t g n e r t s c i r t c e l e i d0 0 0 5 1-5 2 20 0 0 5 1-00 interface compounds
www.dynexsemi.com 7 module package outlines diode package outlines and circuit configurations all dimensions shown in mm unless stated otherwise. module type: mp02 23 23 24 34 30 94 6 . 5 nominal weight: 350 g module type: mp03 35 28 . 5 9 2 5 . 5 32 m8 42 . 5 nominal weight: 950g 67 4 m3 hd 50 . 8 36 . 6 1 1 / 4 - 1 8npt nominal weight: 1800g 31 6 150 112 25 . 4 6.5 ( 4 plc e m 1 0 th d m ax. 18dp 3 module type: mp04-w3a circuit type: dd nominal weight: 1500g 31 6 52 150 112 m 1 0 th d max. 18dp module type: mp04 12 3 12 3 12 3 12 3 circuit type: hb circuit type: g circuit type: gn 12 3 12 3 12 3 circuit type: hb circuit type: g circuit type: gn 12 3 12 3 12 3 circuit type: hb circuit type: g circuit type: gn module mounting recommendations adequate heatsinking is required to maintain the base temperature at 75 ? c if full rated current is to be achieved. power dissipation may be calculated by use of v t(to) and r t information in accordance with standard formulae. dynex can provide assistance with calculations or choice of heatsink if required. the heatsink surface must be smooth and flat; a surface finish of n6 (32 in) and a flatness within 0.05mm (0.002") are recommended. immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, scotch brite tm or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. care should be taken to ensure no foreign particles remain. an even coating of thermal compound (eg. unial) should be applied to both the heatsink and module mounting surfaces. this should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance. after application of thermal compound, place the module squarely over the mounting holes, (or t slots) in the heatsink. using a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. continue until the required torque of 6nm (55lb.ins) is reached at both ends. it is not acceptable to fully tighten one fixing bolt before starting to tighten the others. such action may damage the module.
www.dynexsemi.com 8 ? dynex semiconductor , september 2003, LF5660-1. replaces march 2001 lf5431-1. printed in united kingdom. benelux, italy & switzerland: tel: +33 (0)1 64 66 42 17 fax: +33 (0)1 64 66 42 19 france: tel: (01) 64 66 42 17, (02) 47 55 75 53 fax: (01) 64 66 42 19, (02) 47 55 75 59 germany, uk & northern europe: tel: +44 (0)1522 502 753 / 502 901 fax: +44 (0)1522 500 020 north america: eastern region, tel: (440) 259-2060. fax: (440) 259-2059 western region, tel: (949) 733-3005. fax: (949) 733-2986 rest of world: tel: +44 1522 502 753 / 502 901 fax: +44 1522 500 020 e-mail: power_solutions@dynexsemi.com website: www.dynexsemi.com these offices are supported by representatives and distributors world-wide. (see dynex website contact us section for details). contact us
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