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  1. general description the TEA5880TS stereo fm radio ic dramatically reduces the printed-circuit board area (only 100 mm 2 ) needed to integrate fm radio functionality into portable devices. this makes it invaluable for any application where space is at a premium. relying on a system host processor for radio tuning, the TEA5880TS is ideally suited for powerful devices such as pdas, notebooks, portable cd and mp3 players. 2. features n no alignments necessary n complete adjustment-free stereo decoder; no external crystal required n fully integrated mpx vco circuit n fully integrated low if selectivity and demodulation n the full integration level means no or few external components required n no external fm discriminator needed due to full integration n built-in adjacent channel interference total reduction (no 114 khz, no 190 khz) n the level of the incoming signal at which the radio must lock is software programmable n due to new tuning concept, the tuning is independent of the channel spacing n very high sensitivity due to integrated low noise rf input ampli?er n rf automatic gain control (agc) circuit n standby mode for power-down, no power switch circuitry required n 2.7 v minimum supply voltage n mpx output for rds n 3-wire bus n in combination with the host, fast, low power operation of preset mode, manual search, automatic search and automatic store are possible n host can be in sleep mode after tuning; a minute retuning is recommended to compensate for temperature and voltage ?uctuations n covers all japanese, european and us bands. TEA5880TS integrated fm stereo radio ic for host processor tuning in handheld applications rev. 02 26 april 2004 preliminary data sheet
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 2 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 3. quick reference data table 1: quick reference data v cca = v ccd symbol parameter conditions min typ max unit v cca analog supply voltage 2.7 3.0 5.0 v v ccd digital supply voltage 2.7 3.0 5.0 v i cca analog supply current operating - 17 22 ma standby - 1 100 m a i ccd digital supply current operating - 250 500 ma standby - 1 100 m a i led optional stereo led - 1 2 ma f fm(ant) fm input frequency 76 - 108 mhz t amb ambient temperature v cca = v cc(vco) = v ccd = 3 v - 10 - +75 c v cca = v cc(vco) = v ccd = 5 v - 40 - +85 c fm overall system parameters v i(rf) rf sensitivity input voltage f rf = 76 mhz to 108 mhz; d f = 22.5 khz; f mod = 1 khz; (s+n)/n = 26 db; de-emphasis = 75 us; b af = 300 hz to 15 khz; left = right -13 m v sup pilot pilot suppression d f pilot = 6.75 khz; d f = 68.5 khz 40 db ip3 in in-band 3rd order intercept point at lna input -95-db m v ip3 out out-band 3rd order intercept point at lna input -95-db m v s - 300 low side 300 khz selectivity d f = - 300 khz; f rf = 76 mhz to 108 mhz - 40 - db s +300 high side 300 khz selectivity d f = 300 khz; f rf = 76 mhz to 108 mhz - 50 - db s - 200 low side 200 khz selectivity d f = - 200 khz; f rf = 76 mhz to 108 mhz - 30 - db s +200 high side 200 khz selectivity d f = 200 khz; f rf = 76 mhz to 108 mhz - 40 - db ir image rejection f rf = 76 mhz to 108 mhz - 26 - db v audl ; v audr left and right audio output voltage v rf = 1 mv; left = right; d f = 22.5 khz; f mod = 1 khz - 100 - mv (s+n)/n maximum signal plus noise-to-noise ratio v rf = 1 mv; left = right; d f = 22.5 khz; f mod = 1 khz de-emphasis = 75 m s; b af = 300 hz to 15 khz 48 56 - db a cs stereo channel separation v rf = 1 mv; right = 1 and left = 0 or right = 0 and left = 1; f mod = 1 khz; d f pilot = 6.75 khz; d f left = 68.5 khz and d f right = 0 or d f right = 68.5 khz and d f left = 0 15 25 - db
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 3 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 4. ordering information thd total harmonic distortion v rf = 1 mv; left = right; d f = 75 khz; f mod = 1 khz; b af = 300 hz to 15 khz - 0.7 1.5 % v rf = 1 mv; left = right; d f = 22.5 khz; f mod = 1 khz; b af = 300 hz to 15 khz - 0.2 0.7 % deem integrated de-emphasis - 50/75 - m s table 1: quick reference data continued v cca = v ccd symbol parameter conditions min typ max unit table 2: ordering information type number package name description version TEA5880TS ssop24 plastic shrink small outline package; 24 leads; body width 5.3 mm sot340-1
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x 9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 4 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 5. block diagram depending on the antenna design the ?lter components at pins 1 and 2 may not be necessary. the only two remaining coils connected to pin 17 to 20 can be replaced by printed-circuit board traces that will ?t underneath the TEA5880TS resulting in a design without an y external components; see section 14 for details on the printed-circuit board coils. fig 1. block diagram. 001aaa665 quadrature mixer stabilisator quadrature oscillator tuning system selectivity demodulator power switch stereo decoder de-emphasis 50/75 m s digital interface microcontroller de-emphasis 15 khz mixer level voltage generator 10 TEA5880TS 11 9 5 68 7 21 17 18 19 20 1 2 4 3, 13, 24 v cca rfin rfgnd lr1 v cc1 v cc1 ll1 reserved r/w clock audl audr mpx data v ccd gnd led n.c. 12 14, 15, 16, 22, 23
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x 9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 5 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning fig 2. block diagram (no external components). 001aaa666 stabilisator quadrature oscillator tuning system selectivity demodulator power switch stereo decoder de-emphasis 50/75 m s digital interface microcontroller de-emphasis 15 khz mixer level voltage generator 10 TEA5880TS 11 9 5 68 7 21 17 18 19 20 4 3, 13, 24 v cca lr1 v cc1 v cc1 ll1 reserved r/w clock audl audr mpx data v ccd gnd led n.c. 12 14, 15, 16, 22, 23 quadrature mixer rfin rfgnd
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 6 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 6. pinning information 6.1 pin description table 3: pin description symbol pin description rfin 1 rf input rfgnd 2 rf ground gnd 3 ground v ccd 4 digital supply voltage v cca 5 analog supply voltage r/w 6 digital read/write command input data 7 bidirectional digital data line clock 8 digital data clock line input mpx 9 fm mpx signal output audl 10 audio left channel output audr 11 audio right channel output led 12 stereo led output gnd 13 ground n.c. 14 not connected n.c. 15 not connected n.c. 16 not connected lr1 17 coil right v cc1 18 internal analog voltage v cc1 19 internal analog voltage ll1 20 coil left reserved 21 reserved for testing use n.c. 22 not connected n.c. 23 not connected gnd 24 ground
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 7 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 7. functional description 7.1 fm quadrature mixer the fm quadrature mixer converts fm rf (76 mhz to 108 mhz) to an if of 110 khz. the fm quadrature mixer provides inherent image rejection. 7.2 quadrature oscillator the internally tuned lc vco provides the local oscillator (lo) signal for the fm quadrature mixer. the vco frequency range is 150 mhz to 217 mhz. 7.3 selectivity fully integrated i and q channel if ?lter. 7.4 demodulator the fm quadrature demodulator is an integrated pll demodulator. 7.5 level voltage generator and analog-to-digital converter the level voltage is analog-to-digital converted with 3 bits and output via the data line. 7.6 if counter the if counter outputs a 16-bit count result via the data line. 7.7 mute the digital interface controls the audio mute and output level. fig 3. pin con?guration. TEA5880TS rfin gnd rfgnd n.c. gnd n.c. v ccd reserved v cca ll1 r/w v cc1 data v cc1 clock lr1 mpx n.c. audl n.c. audr n.c. led gnd 001aaa667 1 2 3 4 5 6 7 8 9 10 11 12 14 13 16 15 18 17 20 19 22 21 24 23
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 8 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 7.8 stereo decoder the pll stereo decoder is adjustment free. the stereo decoder can be switched to mono via the digital interface. 8. digital interface (3-wire bus) the TEA5880TS has a 3-wire bus with read/write, clock and data line. the register set of the TEA5880TS can be accessed via the digital interface. the pins given in t ab le 4 are de?ned for the digital interface of the TEA5880TS. table 4: digital interface pins pin number name type description remark pin 6 r/w input low is read from TEA5880TS; high is write to TEA5880TS pin 8 clock input clock rising edge pin 7 data input/output bidirectional data fig 4. digital interface block diagram. 001aaa668 output source selector control register a address decoder control register b control register c rest of the registers status register 15 bits sipo (serial in parallel out) stereo led stereo clock if osc r/w fm osc clock data counter 1 (16 bits) 16 bits piso (parallel in serial out) r/w 11 bits data 4 bits data 16 bits data 16 bits data clock r/w r/w enable counter 1 control bits control bits control bits control bits 1-bit data
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 9 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 8.1 register description [1] the application should write logic 0 to this register at start-up to ensure that the device functions correctly. table 5: TEA5880TS registers description address register name access operation data width clocks 0000b vadc write only vadc register 11 bits 15 0001b ctrl_c write only control register c 11 bits 15 0010b ctrl_a write only control register a 11 bits 15 0011b osc_stereo write only oscillator stereo decoder clock 11 bits 15 0100b ctrl_b write only control register b 11 bits 15 0101b cap_fm write only capacitor bank fm 11 bits 15 0110b osc_if write only oscillator if 11 bits 15 0111b osc_fm write only oscillator fm 11 bits 15 - status read only status register 16 bits 15 - counter read only counter register 16 bits 15 table 6: vadc - (address 0h) bit description bit symbol description 14 to 11 - address bits 10 to 6 vadc2[4:0] controls the width ?lter 5 - not applicable; should be written to logic 0 4 to 0 vadc1[4:0] controls the center ?lter table 7: ctrl_c - (address 1h) bit description [1] bit symbol description 14 to 11 - address bits 10 and 9 - reserved for production test; should be written to logic 0 8 - reserved for swapping counters1 and 2; should be written to logic 0 7 to 4 - not applicable; should be written to logic 0 3 to 1 - reserved for time delay selection (counter 2); application should keep bits 3 to 1 at logic 0; see t ab le 8 0 - reserved for enable counter 2; should be written to logic 0 table 8: time delay selection value decimal stop value 000b 0 count 2 001b 1 count 8 010b 2 count 32 011b 3 count 128 100b 4 count 512 101b 5 count 2048 110b 6 count 8192 111b 7 count 32768
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 10 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning [1] the frequency is decreased when increasing the content of this register. table 9: ctrl_a - (address 2h) bit description bit symbol description 14 to 11 - address bits 10 to 7 output_ select[3:0] selects an internal circuit as output for measurement purpose; see t ab le 10 6 ste_pmute mutes the stereo pll when set to logic 1 ; this bit should be set during calibration of the stereo decoder clock and should be cleared during normal operation 5 dem_pmute mutes the demodulator pll when set to logic 1 ; this bit should be set during calibration of the if frequency and should be cleared during normal operation 4 ste_int_off# turns off the stereo integrator loop when set to logic 0 3 en_meas# enables measurement when set to logic 0 2 amute mutes the audio when set to logic 1 1 fm enables the fm circuitry when set to logic 1 0 - reserved for am circuitry; should be written to logic 0 table 10: description of output_select bits symbol value decimal output selected os-none 0000b 0 no output selected os_fm_osc 0001b 1 fm oscillator os_na2 0010b 2 not de?ned os_cnt2_rdy_na 0011b 3 reserved for counter 2 ready output os_na4 0100b 4 not de?ned os_stereo_dec 0101b 5 stereo decoder clock os_na6 0110b 6 not de?ned os_stereo_led 0111b 7 stereo led os_na8 1000b 8 not de?ned os_if_osc 1001b 9 if oscillator os_interrupt_na 1010b 10 reserved for interrupt output os_piso 1011b 11 piso output (reading status / counter register) os_na12 1100b 12 not de?ned os_rds_na 1101b 13 reserved for rds output os_na14 1110b 14 not de?ned os_na15 1111b 15 not de?ned table 11: osc_stereo - (address 3h) bit description [1] bit symbol description 14 to 11 - address bits 10 to 0 so[10:0] 11-bit digital-to-analog converter for adjusting the stereo decoder clock
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 11 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning [1] the frequency is decreased when increasing the content of this register (more capacitors). table 12: ctrl_b - (address 4h) bit description bit symbol description 14 to 11 - address bits 10 l_cnt latch counter: a transition from logic 1 to logic 0 will latch the counter register into the piso (reading the piso hereafter will read the counter register) 9 l_sts latch status: a transition from logic 1 to logic 0 will latch the status register into the piso (reading the piso hereafter will read the status register) 8 to 6 - reserved for output level control; should be written with 4 (100b); see t ab le 13 5 deemp de-emphasis: logic 1 is 75 m s (usa), logic 0 is 50 m s (europe, japan) 4 piso_clr a transition from logic 1 to logic 0 will clear the piso; the piso should be clear before reading the status/counter register 3 cnt_rst a transition from logic 1 to logic 0 will clear both counter 1 and counter 2 2 cnt1_en counter 1 enabled (counting mode) when set to logic 1 1 - should be written to logic 0 0 mono mono mode when set to logic 1, stereo mode when set to logic 0 table 13: description of output level control register bits value decimal output level 0000b 0 12 mv 0001b 1 20 mv 0010b 2 35 mv 0011b 3 60 mv 0100b 4 100 mv 0101b 5 170 mv 0110b 6 200 mv table 14: cap_fm - (address 5h) bit description [1] bit symbol description 14 to 11 - address bits 10 - reserved for capacitor extra current; this bit should be written to logic 1 by any access to the cap_fm to ensure that the device functions properly 9 to 8 - reserved, should be written to logic 0 7 to 0 fc[7:0] fm capacitor bank switches for adjusting the fm (rf) frequency in big steps. every bit, when set, will switch on a capacitor with a weight according to its position i.e. bit 0 has weight 1, bit 1 has weight 2, bit 2 has weight 4 etc, bit 6 has weight 64, except for bit 7, which also has the same weight as bit 6; there is thus only 7 1 2 effective bits; this means that the value range 0 to 127 will switch on different capacitors the value range 128 to 191 switches on the same capacitors as range 64 to 127, the value range 192 to 255 will switch on different capacitors (an overlapped range of 64 values caused when fc[7:6] = 01b or 10b)
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 12 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning [1] the frequency is decreased when increasing the content of this register. [1] the frequency is increased when increasing the content of this register. [1] this register does not have an address. to read the status register, latch its content into the piso (using l_sts bit in control register b) then read out the piso. [1] this register does not have an address. to read the counter register, latch its content into the piso (using l_cnt bit in control register b) then read out the piso. table 15: osc_if - (address 6h) bit description [1] bit symbol description 14 to 11 - address bits 10 to 0 ifo[10:0] 11-bit digital-to-analog converter for adjusting the if frequency table 16: osc_fm - (address 7h) bit description [1] bit symbol description 14 to 11 - address bits 10 to 0 fo[10:0] 11-bit digital-to-analog converter for adjusting the fm frequency in ?ne steps; this register is used in combination with the cap_fm register to set a fm frequency table 17: status - bit description [1] bit symbol description 15 to 9 fs[6:0] ?eld strength, indicated by the amount of bits set: 0 bits set = < 10 db m v 1 bit set = 10 db m v to 20 db m v 2 bits set = 20 db m v to 30 db m v 3 bits set = 30 db m v to 40 db m v 4 bits set = 40 db m v to 50 db m v 5 bits set = 50 db m v to 60 db m v 6 bits set = 60 db m v to 70 db m v 7 bits set = > 70 db m v 8 - not applicable; always read as logic 1 7 to 5 r[2:0] chip revision; the revision for TEA5880TS is 100b 4 to 3 - not applicable; always read as logic 1 2 - reserved for production test 1 - not applicable; always read as logic 1 0 - reserved for production test table 18: counter - bit description [1] bit symbol description 15 to 0 cnt[15:0] pulses counted during the period that the counter is enabled and the nr/w line the 3 wire bus is low
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 13 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 8.2 accessing the TEA5880TS access to the TEA5880TS can be achieved via the 3-wire bus. at the host side, the r/w and clock are output signals, while the data signal is bidirectional. when powered up, the host should initialize the 3-wire bus in the host read mode as follows: 1. set (at host side) the data line into input mode 2. r/w set to low 3. clock set to low. note: use the following sequence for changing read/write mode: 1. to change from host read mode to host write mode proceed as follows: a. keep the clock signal low b. set the r/w signal to high (write mode) c. set the data pin (of the application controller) into output mode. 2. to change from host write mode to host read mode proceed as follows: a. keep the clock signal low b. set the data pin (of the application controller) into input mode c. set r/w to low (input mode). 8.3 writing to the TEA5880TS writing to the TEA5880TS is achieved with a 15-bit data pattern: ? d[14:11]: 4-bit register address ? d[10:0]: 11-bit register data. the data pattern is sent serially to the TEA5880TS as follows: 1. drive r/w pin high to set the TEA5880TS in input mode 2. drive the data pin to correct level 3. generate positive edge of clock (driving clock into low-to-high transition) 4. delay some time to meet the data hold time requirement 5. driving clock into high-to-low transition 6. repeat step (2) to (5) 15 times to shift the 15-bit data pattern into the TEA5880TS 7. drive r/w pin low; this signals the TEA5880TS to latch the data into the correct register. note: the application should shift the lsb out ?rst.
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 14 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 8.4 reading from the TEA5880TS only the status or the counter register can be read from the TEA5880TS. these are 16-bit registers and can be read serially as follow: 1. select os_piso (parallel in, serial out) as output (control register a, output_select bits) 2. clear the piso (control register b, piso_clr bit, pulse high-to-low transition) 3. latch the counter register (control register b, l_cnt bit, pulse high-to-low transition) or the status register (control register b, l_sts bit, pulse high-to-low transition) into the piso 4. drive r/w pin low to set the TEA5880TS in output mode 5. read the ?rst bit at pin data 6. generate positive clock pulse (low-to-high transition) 7. delay for a period of time to meet the data set-up time requirement 8. read the data bit at pin data 9. drive clock into high-to-low transition 10.repeat step (6) to (9) 15 times to shift the remaining 15 bits of data out of the chip note: the TEA5880TS will shift the msb out ?rst. 8.5 measuring frequency with the TEA5880TS the three frequencies: if, stereo decoder clock and fm can be measured by using the counter register and a software timing window. this is achieved as follows: 1. select the output to be measured (control register a, output_select bits, select os_stereo_dec, os_if_osc or os_fm_osc output) 2. enable measure mode (clear en_meas# bit of control register a) 3. reset the counter (control register b, cnt_rst bit, pulse high-to-low transition) 4. start the counter on the TEA5880TS (control register b, set cnt1_en bit); at the moment the r/w signal goes low the counter starts 5. wait time t 6. to stop the counter, ?rst set the r/w signal high, then disable the counter in the TEA5880TS (control register b, clear cnt1_en bit) 7. read the pulse count n from the counter register of the TEA5880TS 8. restore the measure mode 9. restore the output select bits. note: the measuring window begins at the moment the r/w signal is driven low (point 4) and ends when the r/w signal is driven high (point 6).
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 15 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning the if and stereo decoder frequency can be calculated using the equation f = n/t, and the fm frequency can be calculated using the equation f = (n/t) x 256. note: the precision of f depends on the following: ? the duration of t. 1 pulse wrong at t = 1 ms results in more deviation than at t = 32 ms ? the precision of the measuring window: calculate with t = 32 ms gives other f values than with t = 32 ms. in the application care should be taken to have an accurate measuring window t. 8.6 initialize the TEA5880TS after power-up, the TEA5880TS needs to be initialized as follows: ? control register a: ste_pmute = 1; dem_pmute = 1; amute = 1; fm = 1; other bits = 0 ? control register b: cnt_rst = 1; piso_clr = 1; mono = 1; deemp = 1 (for europe); bit [8:6] = 100b; other bits = 0 ? control register c: all bits = 0 ? vadc register: vadc1 = 26 (decimal), this value should not be changed hereafter; vadc2 = 18 (decimal), this value should not be changed hereafter ? calibrate the if frequency at 110 khz ? calibrate the stereo decoder clock at 37.5 khz (to reduce the initialization time, calibration of the stereo decoder clock can be postponed until the stereo mode is selected). 9. timing diagrams fig 5. writing data. 001aaa669 lsb msb msb lsb 1 15 11 11-bit data 4-bit address data clock r/w
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 16 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning fig 6. reading data. 001aaa670 data lsb 0 15 msb 16-bit data r/w clock fig 7. measuring sequence. 001aaa671 enable piso at output source disable 16-bit counter timing width 8 ms to 100 ms enable 16-bit counter to count reset 16-bit counter clear set 16-bit counter clear enable internet clock enable fm osc at output source selector
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 17 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 10. limiting values [1] machine model (r = 10 w , c = 200 pf, 75 m h). [2] human body model (r = 1.5 k w , c = 100 pf). 11. thermal characteristics 12. characteristics table 19: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v ccd digital supply voltage - 0.3 +5 v v cca analog supply voltage - 0.3 +8 v t stg storage temperature - 55 +150 c t amb ambient temperature v cca = v cc(vco) = v ccd = 3 v - 10 +75 c v cca = v cc(vco) = v ccd = 5 v - 40 +85 c v esd electrostatic discharge voltage for all pins [1] - 200 +200 v [2] - 2000 +2000 v table 20: thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air k/w table 21: digital input ac values symbol parameter conditions min typ max unit digital inputs v ih high-level input voltage i oh = 500 m a 1.4 - - v v il low-level input voltage - - 0.6 v digital outputs i sink (l) low-level sink current 500 - - m a v ol low-level output voltage i ol = 500 m a - - 0.6 v timing f clk clock input - - 1 mhz t clk(h) clock high time 495 - - ns t clk(l) clock low time 495 - - ns
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 18 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 13. components list no external components necessary. (1) mono signal. (2) mono noise. (3) stereo left. (4) stereo right. (5) stereo noise. fig 8. signal characteristics. thd = 30 %. fig 9. total harmonic distortion. 001aaa673 - 10 110 70 30 - 20 - 40 0 20 db - 60 (1) (2) (3) (4) (5) rfin (db m v) 001aaa674 rfin (db m v) - 10 110 70 30 2 3 1 4 5 thd (%) 0
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 19 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 14. printed-circuit board layout for ssop24 package the printed-circuit board traces from ll1 to v cc1 and from v cc1 to lr1 as shown in figure 10 , are to create two inductors, each of approximately 38 nh. these inductors, together with internal capacitors, form part of the lc oscillator to determine the fm tuning band. if the value of the inductors becomes much greater than 38 nh, the whole fm tuning band (normally from 76 mhz to 108 mhz) will be shifted lower. if the value of the inductors becomes much smaller than 38 nh, the whole fm tuning band (normally from 76 mhz to 108 mhz) will be shifted higher. if the layout of the two inductance traces is not preferred, two smd inductors can be used to replace the two printed-circuit board inductance traces as an alternative. the layout of the two smd inductors should be as close to the pins as possible. (1) width of printed-circuit board trace = 0.15 mm; spacing between printed-circuit board trace = 0.15 mm. (2) pins 14, 15, 16, 21, 22 and 23 are not connected. fig 10. printed-circuit board layout. 001aaa675 gnd rfin rfgnd v ccd audr gnd n.c. n.c. n.c. lr1 reserved n.c. n.c. gnd ll1 mpx 3.5 mm 3.5 mm r/w clock data audl led v cc1 v cc1 v cca
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 20 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 15. application information (1) optional. fig 11. application diagram. 001aaa672 fm antenna tea5880fm 1 2 3 4 5 6 7 8 9 10 11 12 ll1 lr1 100 nf (1) 100 nf (1) 24 23 22 21 20 19 18 17 16 15 14 13 rfin v cca v ccd led audl mpx clock data r/w audr v cc1 v cc1
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 21 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 16. package outline fig 12. package outline. unit a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 1.25 7.9 7.6 0.9 0.7 0.8 0.4 8 0 o o 0.13 0.1 0.2 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.2 mm maximum per side are not included. 1.03 0.63 sot340-1 mo-150 99-12-27 03-02-19 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 112 24 13 0.25 y pin 1 index 0 2.5 5 mm scale ssop24: plastic shrink small outline package; 24 leads; body width 5.3 mm sot340-1 a max. 2
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 22 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 17. soldering 17.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. 17.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 to 270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 17.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 23 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 17.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 17.5 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. table 22: suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, uson, vfbga not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5] [6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 24 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop, tssop, vso and vsop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages.
9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 25 of 27 philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 18. revision history table 23: revision history document id release date data sheet status change notice order number supersedes tea5880_2 20040426 preliminary data sheet - 9397 750 13022 -
philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 9397 750 13022 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 02 26 april 2004 26 of 27 19. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 20. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 21. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 22. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2004 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 26 april 2004 document order number: 9397 750 13022 published in the netherlands philips semiconductors TEA5880TS integrated fm stereo radio ic for host processor tuning 23. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 6 6.1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 7 functional description . . . . . . . . . . . . . . . . . . . 7 7.1 fm quadrature mixer . . . . . . . . . . . . . . . . . . . . 7 7.2 quadrature oscillator . . . . . . . . . . . . . . . . . . . . 7 7.3 selectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.4 demodulator . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.5 level voltage generator and analog-to-digital converter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.6 if counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.7 mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.8 stereo decoder . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 digital interface (3-wire bus). . . . . . . . . . . . . . . 8 8.1 register description . . . . . . . . . . . . . . . . . . . . . 9 8.2 accessing the TEA5880TS. . . . . . . . . . . . . . . 13 8.3 writing to the TEA5880TS . . . . . . . . . . . . . . . 13 8.4 reading from the TEA5880TS . . . . . . . . . . . . 14 8.5 measuring frequency with the TEA5880TS . . 14 8.6 initialize the TEA5880TS . . . . . . . . . . . . . . . . 15 9 timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 15 10 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 11 thermal characteristics. . . . . . . . . . . . . . . . . . 17 12 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17 13 components list. . . . . . . . . . . . . . . . . . . . . . . . 18 14 printed-circuit board layout for ssop24 package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 15 application information. . . . . . . . . . . . . . . . . . 20 16 package outline . . . . . . . . . . . . . . . . . . . . . . . . 21 17 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 17.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 17.2 re?ow soldering. . . . . . . . . . . . . . . . . . . . . . . 22 17.3 wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 22 17.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 23 17.5 package related soldering information . . . . . . 23 18 revision history . . . . . . . . . . . . . . . . . . . . . . . 25 19 data sheet status. . . . . . . . . . . . . . . . . . . . . . . 26 20 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 21 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 22 contact information . . . . . . . . . . . . . . . . . . . . 26


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