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dac900 1 dac900 dac900 dac900 ? 1999 burr-brown corporation pds-1446b printed in u.s.a. may, 2000 international airport industrial park ? mailing address: po box 11400, tucson, az 85734 ? street address: 6730 s. tucson bl vd., tucson, az 85706 ? tel: (520) 746-1111 twx: 910-952-1111 ? internet: http://www.burr-brown.com/ ? cable: bbrcorp ? telex: 066-6491 ? fax: (520) 889-1510 ? i mmediate product info: (800) 548-6132 for most current data sheet and other product information, visit www.burr-brown.com 10-bit, 165msps digital-to-analog converter features l single +5v or +3v operation l high sfdr: 5mhz output at 100msps: 68dbc l low glitch: 3pv-s l low power: 170mw at +5v l internal reference: optional ext. reference adjustable full-scale range multiplying option applications l communication transmit channels wll, cellular base station digital microwave links cable modems l waveform generation direct digital synthesis (dds) arbitrary waveform generation (arb) l medical/ultrasound l high-speed instrumentation and control l video, digital tv description the dac900 is a high-speed, digital-to-analog converter (dac) offering a 10-bit resolution option within the speedplus family of high-performance converters. featuring pin compatibility among family members, the dac908, dac902, and dac904 provide a component selection option to an 8-, 12-, and 14-bit resolution, respectively. all models within this family of d/a converters support update rates in excess of 165msps with excellent dynamic performance, and are especially suited to fulfill the demands of a variety of applications. the advanced segmentation architecture of the dac900 is optimized to provide a high spurious-free dynamic range (sfdr) for single-tone, as well as for multi-tone signals essential when used for the transmit signal path of communica- tion systems. the dac900 has a high impedance (200k w ) current output with a nominal range of 20ma and an output compliance of up to 1.25v. the differential outputs allow for both a differential, or single-ended analog signal interface. the close matching of the current outputs ensures superior dynamic performance in the differential configuration, which can be implemented with a transformer. utilizing a small geometry cmos process, the monolithic dac900 can be operated on a wide, single-supply range of +2.7v to +5.5v. its low power consumption allows for use in portable and battery operated systems. further optimization can be realized by lowering the output current with the adjustable full-scale option. for noncontinuous operation of the dac900, a power-down mode results in only 45mw of standby power. the dac900 comes with an integrated 1.24v bandgap refer- ence and edge-triggered input latches, offering a complete converter solution. both +3v and +5v cmos logic families can be interfaced to the dac900. the reference structure of the dac900 allows for additional flexibility by utilizing the on-chip reference, or applying an external reference. the full-scale output current can be adjusted over a span of 2ma to 20ma, with one external resistor, while maintaining the specified dynamic performance. the dac900 is available in so-28 and tssop-28 packages. tm current sources lsb switches segmented switches +1.24v ref. latches 10-bit data input d9...d0 dac900 fsa bw +v d +v a agnd clk dgnd ref in int/ext i out i out byp pd sbas093
dac900 2 specifications at t a = full specified temperature range, +v a = +5v, +v d = +5v, differential transformer coupled output, 50 w doubly terminated, unless otherwise specified. the information provided herein is believed to be reliable; however, burr-brown assumes no responsibility for inaccuracies or o missions. burr-brown assumes no responsibility for the use of this information, and all use of such information shall be entirely at the users own risk. pr ices and specifications are subject to change without notice. no patent rights or licenses to any of the circuits described herein are implied or granted to any third party. burr-brown does not authorize or warrant any burr-brown product for use in life support devices and/or systems. dac900u/e parameter conditions min typ max units resolution 10 bits output update rate (f clock ) 4.5v to 5.5v 165 200 msps output update rate 2.7v to 3.3v 125 165 msps full specified temperature range, operating ambient, t a C40 +85 c static accuracy (1) t a = +25 c differential nonlinearity (dnl) f clock = 25msps, f out = 1.0mhz C0.5 0.3 +0.5 lsb integral nonlinearity (inl) C1.0 0.5 +1.0 lsb dynamic performance t a = +25 c spurious free dynamic range (sfdr) to nyquist f out = 1.0mhz, f clock = 25msps 70 76 dbc f out = 2.1mhz, f clock = 50msps 75 dbc f out = 5.04mhz, f clock = 50msps 68 dbc f out = 5.04mhz, f clock = 100msps 68 dbc f out = 20.2mhz, f clock = 100msps 62 dbc f out = 25.3mhz, f clock = 125msps 62 dbc f out = 41.5mhz, f clock = 125msps 53 dbc f out = 27.4mhz, f clock = 165msps 59 dbc f out = 54.8mhz, f clock = 165msps 53 dbc spurious free dynamic range within a window f out = 5.04mhz, f clock = 50msps 2mhz span 78 dbc f out = 5.04mhz, f clock = 100msps 4mhz span 78 dbc total harmonic distortion (thd) f out = 2.1mhz, f clock = 50msps C74 dbc f out = 2.1mhz, f clock = 125msps C73 dbc two tone f out1 = 13.5mhz, f out2 = 14.5mhz, f clock = 100msps 60 dbc output settling time (2) to 0.1% 30 ns output rise time (2) 10% to 90% 2 ns output fall time (2) 10% to 90% 2 ns glitch impulse 3 pv-s dc-accuracy full-scale output range (3) (fsr) all bits high, i out 2.0 20.0 ma output compliance range C1.0 +1.25 v gain error with internal reference C10 1 +10 %fsr gain error with external reference C10 2 +10 %fsr gain drift with internal reference 120 ppmfsr/ c offset error with internal reference C0.025 +0.025 %fsr offset drift with internal reference 0.1 ppmfsr/ c power supply rejection, +v a C0.2 +0.2 %fsr/v power supply rejection, +v d C0.025 +0.025 %fsr/v output noise i out = 20ma, r load = 50 w 50 pa/ ? hz output resistance 200 k w output capacitance i out , i out to ground 12 pf reference reference voltage +1.24 v reference tolerance 10 % reference voltage drift 50 ppmfsr/ c reference output current 10 m a reference input resistance 1m w reference input compliance range 0.1 1.25 v reference small signal bandwidth (4) 1.3 mhz digital inputs logic coding straight binary latch command rising edge of clock logic high voltage, v ih +v d = +5v 3.5 5 v logic low voltage, v il +v d = +5v 0 1.2 v logic high voltage, v ih +v d = +3v 2 3 v logic low voltage, v il +v d = +3v 0 0.8 v logic high current , i ih (5) +v d = +5v 20 m a logic low current, i il +v d = +5v 20 m a input capacitance 5pf
dac900 3 specifications (cont.) at t a = +25 c, +v a = +5v, +v d = +5v, differential transformer coupled output, 50 w doubly terminated, unless otherwise specified. dac900u/e parameter conditions min typ max units electrostatic discharge sensitivity this integrated circuit can be damaged by esd. burr-brown recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. package specified drawing temperature package ordering transport product package number range marking number (1) media dac900u so-28 217 C40 c to +85 c dac900u dac900u rails """"" dac900u/1k tape and reel dac900e tssop-28 360 C40 c to +85 c dac900e dac900e rails """"" dac900e/2k5 tape and reel note: (1) models with a slash (/) are available only in tape and reel in the quantities indicated (e.g., /2k5 indicates 2500 de vices per reel). ordering 2500 pieces of dac900e/2k5 will get a single 2500-piece tape and reel. package/ordering information demo board product ordering number comment dac900u dem-dac90xu populated evaluation board without d/a converter. order sample of desired dac90x model separately. dac900e dem-dac900e populated evaluation board including the dac900e. demo board ordering information absolute maximum ratings +va to agnd ........................................................................ C0.3v to +6v +vd to dgnd ........................................................................ C0.3v to +6v agnd to dgnd ................................................................. C0.3v to +0.3v +va to +vd .............................................................................. C6v to +6v clk, pd to dgnd ...................................................... C0.3v to vd + 0.3v d0-d9 to dgnd .......................................................... C0.3v to vd + 0.3v i out , i out to agnd ............................................................ C1v to va + 0.3v bw, byp to agnd ....................................................... C0.3v to va + 0.3v refin, fsa to agnd .................................................. C0.3v to va + 0.3v int/ext to agnd ........................................................ C0.3v to va + 0.3v junction temperature .................................................................... +150 c case temperature ......................................................................... +100 c storage temperature ..................................................................... +125 c power supply supply voltages +v a +2.7 +5 +5.5 v +v d +2.7 +5 +5.5 v supply current (6) i va 24 30 ma i va , power-down mode 1.1 2 ma i vd 815ma power dissipation +5v, i out = 20ma 170 230 mw +3v, i out = 2ma 50 mw power dissipation, power-down mode 45 mw thermal resistance, q ja so-28 75 c/w tssop-28 50 c/w notes: (1) at output i out , while driving a virtual ground. (2) measured single-ended into 50 w load. (3) nominal full-scale output current is 32x i ref ; see application section for details. (4) reference bandwidth depends on size of external capacitor at the bw pin and signal level. (5) typicall y 45 m a for the pd pin, which has an internal pull-down resistor. (6) measured at f clock = 50msps and f out = 1.0mhz.
dac900 4 current sources lsb switches segmented msb switches +1.24v ref. latches 10-bit data input d9.......d0 dac900 fsa bw +v d +v a r set agnd clk dgnd ref in 0.1 f int/ext i out i out byp pd 20pf 50 50 20pf 1:1 0.1 f 0.1 f +5v +5v bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 bit 8 bit 9 bit 10 nc nc nc nc clk +v d dgnd nc +v a byp i out i out agnd bw fsa ref in int/ext pd 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 dac900 pin designator description 1 bit 1 data bit 1 (d9), msb 2 bit 2 data bit 2 (d8) 3 bit 3 data bit 3 (d7) 4 bit 4 data bit 4 (d6) 5 bit 5 data bit 5 (d5) 6 bit 6 data bit 6 (d4) 7 bit 7 data bit 7 (d3) 8 bit 8 data bit 8 (d2) 9 bit 9 data bit 9 (d1) 10 bit 10 data bit 10 (d0), lsb 11 nc no connection 12 nc no connection 13 nc no connection 14 nc no connection 15 pd power down, control input; active high. contains internal pull-down circuit; may be left unconnected if not used. 16 int/ext reference select pin; internal ( = 0) or external ( = 1) reference operation. 17 ref in reference input/ouput. see applications section for further details. 18 fsa full-scale output adjust 19 bw bandwidth/noise reduction pin: bypass with 0.1 m f to +v a for optimum performance. 20 agnd analog ground 21 i out complementary dac current output 22 i out dac current output 23 byp bypass node: use 0.1 m f to agnd 24 +v a analog supply voltage, 2.7v to 5.5v 25 nc no connection 26 dgnd digital ground 27 +v d digital supply voltage, 2.7v to 5.5v 28 clk clock input pin descriptions pin configuration top view so/tssop typical connection circuit
dac900 5 timing diagram t 2 t pd t set t h t s t 1 clk d9 - d0 i out symbol description min typ max units t 1 clock pulse high time 6.25 ns t 2 clock pulse low time 6.25 ns t s data setup time 2 ns t h data hold time 2 ns t pd propagation delay time (t 1 +t 2 )+1 ns t set output settling time to 0.1% 25 ns
dac900 6 typical performance curves, v d = v a = +5v at t a = +25 c, differential i out = 20ma, 50 w double-terminated load, sfdr up to nyquist, unless otherwise specified. dac code typical dnl error (lsbs) 1.00 0.75 0.50 0.25 0 ?.25 ?.50 ?.75 ?.00 0 100 200 300 400 500 600 700 800 900 1000 1024 dac code typical inl error (lsbs) 1.00 0.75 0.50 0.25 0 ?.25 ?.50 ?.75 ?.00 0 100 200 300 400 500 600 700 800 900 1000 1024 sfdr vs f out at 25msps frequency (mhz) sfdr (dbc) 90 85 80 75 70 65 60 2.0 4.0 6.0 8.0 10.0 12.0 0 0dbfs ?dbfs sfdr vs f out at 100msps frequency (mhz) sfdr (dbc) 85 80 75 70 65 60 55 50 45 10.0 20.0 30.0 40.0 50.0 0 0dbfs ?dbfs sfdr vs f out at 50msps frequency (mhz) sfdr (dbc) 85 80 75 70 65 60 55 5.0 10.0 15.0 20.0 25.0 0 ?dbfs 0dbfs sfdr vs f out at 125msps frequency (mhz) sfdr (dbc) 85 80 75 70 65 60 55 50 45 10.0 20.0 30.0 50.0 40.0 60.0 0 0dbfs ?dbfs
dac900 7 typical performance curves, v d = v a = +5v (cont.) at t a = +25 c, differential i out = 20ma, 50 w double-terminated load, sfdr up to nyquist, unless otherwise specified. sfdr vs temperature at 100msps, 0dbfs temperature ( c) sfdr (dbc) 85 80 75 70 65 60 55 50 45 ?0 0 25 70 50 85 ?0 2.1mhz 10.1mhz 40.4mhz x x x x x x x thd vs f clock at f out = 2.1mhz f clock (msps) thd (dbc) ?0 ?5 ?0 ?5 ?0 ?5 ?00 25 50 100 125 150 0 2hd 3hd sfdr vs i outfs and f out at 100msps, 0dbfs i outfs (ma) sfdr (dbc) 80 75 70 65 60 55 50 45 40 51020 2 x x x x 2.1mhz 10.1mhz 5.04mhz 40.4mhz * * * * sfdr vs f out at 165msps frequency (mhz) sfdr (dbc) 80 75 70 65 60 55 50 45 40 20.0 10.0 30.0 40.0 50.0 70.0 60.0 80.0 0 ?dbfs 0dbfs sfdr vs f out at 200msps frequency (mhz) sfdr (dbc) 80 75 70 65 60 55 50 45 40 20.0 10.0 30.0 40.0 50.0 70.0 60.0 90.0 80.0 0 ?dbfs 0dbfs differential vs single-ended sfdr vs f out at 100msps frequency (mhz) sfdr (dbc) 85 80 75 70 65 60 55 50 45 10.0 20.0 30.0 40.0 50.0 0 diff (0dbfs) i out (?dbfs) i out (0dbfs) diff (?dbfs) x x x x x x x
dac900 8 typical performance curves, v d = v a = +5v (cont.) at t a = +25 c, differential i out = 20ma, 50 w double-terminated load, sfdr up to nyquist, unless otherwise specified. dual-tone output spectrum frequency (mhz) magnitude (dbm) 0 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?00 5 101520253035404550 f clock = 100msps f out1 = 13.5mhz f out2 = 14.5mhz sfdr = 60dbc amplitude = 0dbfs four-tone output spectrum frequency (mhz) magnitude (dbm) 0 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?00 510152025 f clock = 50msps f out1 = 6.25mhz f out2 = 6.75mhz f out3 = 7.25mhz f out4 = 7.75mhz sfdr = 66dbc amplitude = 0dbfs
dac900 9 typical performance curves, v d = v a = +3v at t a = +25 c, differential i out = 20ma, 50 w double-terminated load, sfdr up to nyquist, unless otherwise specified. sfdr vs f out at 25msps (3v) frequency (mhz) sfdr (dbc) 85 80 75 70 65 60 55 2.0 4.0 6.0 8.0 10.0 12.0 0 0dbfs ?dbfs differential vs single-ended sfdr vs f out at 100msps (3v) frequency (mhz) sfdr (dbc) 85 80 75 70 65 60 55 50 45 10.0 20.0 30.0 40.0 50.0 0 diff (0dbfs) i out (?dbfs) i out (0dbfs) diff (?dbfs) x x x x x x x sfdr vs f out at 165msps (3v) frequency (mhz) sfdr (dbc) 80 75 70 65 60 55 50 45 40 20.0 10.0 30.0 40.0 50.0 70.0 60.0 80.0 0 ?dbfs 0dbfs sfdr vs f out at 125msps (3v) frequency (mhz) sfdr (dbc) 85 80 75 70 65 60 55 50 45 10.0 20.0 30.0 50.0 40.0 60.0 0 0dbfs ?dbfs sfdr vs f out at 100msps (3v) frequency (mhz) sfdr (dbc) 85 80 75 70 65 60 55 50 45 10.0 20.0 30.0 40.0 50.0 0 ?dbfs 0dbfs sfdr vs f out at 50msps (3v) frequency (mhz) sfdr (dbc) 85 80 75 70 65 60 55 5.0 10.0 15.0 20.0 25.0 0 ?dbfs 0dbfs
dac900 10 typical performance curves, v d = v a = +3v (cont.) at t a = +25 c, differential i out = 20ma, 50 w double-terminated load, sfdr up to nyquist, unless otherwise specified. sfdr vs temperature at 100msps, 0dbfs (3v) temperature ( c) sfdr (dbc) 80 75 70 65 60 55 50 45 40 ?0 0 25 70 50 85 ?0 2.1mhz 10.1mhz 40.4mhz x x x x x x x thd vs f clock at f out = 2.1mhz (3v) f clock (msps) thd (dbc) ?0 ?5 ?0 ?5 ?0 ?5 ?00 25 50 100 125 150 0 2hd 3hd i outfs (ma) sfdr (dbc) 80 75 70 65 60 55 50 45 40 51020 2 x x * * * * x x sfdr vs i outfs and f out at 100msps (3v) 2.1mhz 5.04mhz 10.1mhz 40.4mhz dual-tone output spectrum frequency (mhz) magnitude (dbm) 0 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?00 5 101520253035404550 f clock = 100msps f out1 = 13.5mhz f out2 = 14.5mhz sfdr = 61.5dbc amplitude = 0dbfs four-tone output spectrum frequency (mhz) magnitude (dbm) 0 0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?00 510152025 f clock = 50msps f out1 = 6.25mhz f out2 = 6.75mhz f out3 = 7.25mhz f out4 = 7.75mhz sfdr = 62.5dbc amplitude = 0dbfs
dac900 11 application information theory of operation the architecture of the dac900 uses the current steering technique to enable fast switching and a high update rate. the core element within the monolithic d/a converter is an array of segmented current sources, which are designed to deliver a full-scale output current of up to 20ma (see figure 1). an internal decoder addresses the differential current switches each time the dac is updated and a corresponding output current is formed by steering all currents to either output summing node, i out or i out . the complementary outputs deliver a differential output signal, which improves the dynamic performance through reduction of even-order harmonics, common-mode signals (noise), and double the peak-to-peak output signal swing by a factor of two, compared to single-ended operation. the segmented architecture results in a significant reduc- tion of the glitch energy, and improves the dynamic perfor- mance (sfdr) and dnl. the current outputs maintain a very high output impedance of greater than 200k w . the full-scale output current is determined by the ratio of the internal reference voltage (1.24v) and an external resistor, r set . the resulting i ref is internally multiplied by a factor of 32 to produce an effective dac output current that can range from 2ma to 20ma, depending on the value of r set . the dac900 is split into a digital and an analog portion, each of which is powered through its own supply pin. the digital section includes edge-triggered input latches and the decoder logic, while the analog section comprises the cur- rent source array with its associated switches and the reference circuitry. dac transfer function the total output current, i outfs , of the dac900 is the summation of the two complementary output currents: i outfs = i out + i out (1) the individual output currents depend on the dac code and can be expressed as: i out = i outfs ? (code/1024) (2) i out = i outfs ? (1023 - code/1024) (3) where code is the decimal representation of the dac data input word. additionally, i outfs is a function of the refer- ence current i ref , which is determined by the reference voltage and the external setting resistor, r set . i outfs = 32 ? i ref = 32 ? v ref /r set (4) in most cases the complementary outputs will drive resistive loads or a terminated transformer. a signal voltage will develop at each output according to: v out = i out ? r load (5) v out = i out ? r load (6) figure 1. functional block diagram of the dac900. pmos current source array lsb switches segmented msb switches +1.24v ref latches and switch decoder logic 10-bit data input d9...d0 dac900 full-scale adjust resistor ref control amp ref buffer bw +v d +v a r set 2k clk dgnd ref input 0.1 f int/ext i out i out byp pd 20pf 50 50 20pf 1:1 v out 0.1 f 400pf 0.1 f +3v to +5v analog bandwidth control +3v to +5v digital fsa ref in agnd analog ground digital ground power down (internal pull-down) clock input note: supply bypassing not shown.
dac900 12 the value of the load resistance is limited by the output compliance specification of the dac900. to maintain speci- fied linearity performance, the voltage for i out and i out should not exceed the maximum allowable compliance range. the two single-ended output voltages can be combined to find the total differential output swing: (7) analog outputs the dac900 provides two complementary current outputs, i out and i out . the simplified circuit of the analog output stage representing the differential topology is shown in figure 2. the output impedance of 200k w || 12pf for i out and i out results from the parallel combination of the differ- ential switches, along with the current sources and associ- ated parasitic capacitances. i out and i out . furthermore, using the differential output configuration in combination with a transformer will be instrumental for achieving excellent distortion performance. common-mode errors, such as even-order harmonics or noise, can be substantially reduced. this is particularly the case with high output frequencies and/or output amplitudes below full-scale. for those applications requiring the optimum distortion and noise performance, it is recommended to select a full-scale output of 20ma. a lower full-scale range down to 2ma may be considered for applications that require a low power consumption, but can tolerate a reduced performance level. figure 2. equivalent analog output. the signal voltage swing that may develop at the two outputs, i out and i out , is limited by a negative and positive compliance. the negative limit of C1v is given by the breakdown voltage of the cmos process, and exceeding it will compromise the reliability of the dac900, or even cause permanent damage. with the full-scale output set to 20ma, the positive compliance equals 1.25v, operating with +v d = 5v. note that the compliance range decreases to about 1v for a selected output current of i outfs = 2ma. care should be taken that the configuration of dac900 does not exceed the compliance range to avoid degradation of the distortion performance and integral linearity. best distortion performance is typically achieved with the maximum full-scale output signal limited to approximately 0.5v. this is the case for a 50 w doubly terminated load and a 20ma full-scale output current. a variety of loads can be adapted to the output of the dac900 by selecting a suitable transformer while maintaining optimum voltage levels at output configurations the current output of the dac900 allows for a variety of configurations, some of which are illustrated below. as mentioned previously, utilizing the converters differential outputs will yield the best dynamic performance. such a differential output circuit may consist of an rf transformer (see figure 3) or a differential amplifier configuration (see figure 4). the transformer configuration is ideal for most applications with ac coupling, while op amps will be suitable for a dc-coupled configuration. the single-ended configuration (see figure 6) may be con- sidered for applications requiring a unipolar output voltage. connecting a resistor from either one of the outputs to ground will convert the output current into a ground-refer- enced voltage signal. to improve on the dc linearity an i to v converter can be used instead. this will result in a negative signal excursion and, therefore, requires a dual supply amplifier. differential with transformer using an rf transformer provides a convenient way of converting the differential output signal into a single-ended signal while achieving excellent dynamic performance (see figure 3). the appropriate transformer should be carefully selected based on the output frequency spectrum and imped- ance requirements. the differential transformer configura- tion has the benefit of significantly reducing common-mode signals, thus improving the dynamic performance over a wide range of frequencies. furthermore, by selecting a suitable impedance ratio (winding ratio), the transformer can be used to provide optimum impedance matching while controlling the compliance voltage for the converter outputs. the model shown, adt1-1wt (by mini-circuits), has a 1:1 ratio and may be used to interface the dac900 to a 50 w load. this results in a 25 w load for each of the outputs, i out and i out . the output signals are ac coupled and inherently isolated because of the transformer's magnetic coupling . input code (d9 - d0) i out i out 11 1111 1111 20ma 0ma 10 0000 0000 10ma 10ma 00 0000 0000 0ma 20ma table i. input coding vs analog output current. v v v code i r outdiff out out outfs load = = ( ) 2 1023 1024 i out i out dac900 r l r l +v a
dac900 13 figure 3. differential output configuration using an rf transformer. figure 4. difference amplifier provides differential to single-ended conversion and dc-coupling. figure 5. dual, voltage-feedback amplifier opa2680 forms differential transimpedance amplifier. as shown in figure 3, the transformers center tap is con- nected to ground. this forces the voltage swing on i out and i out to be centered at 0v. in this case the two resistors, r s , may be replaced with one, r diff , or omitted altogether. this approach should only be used if all components are close to each other, and if the vswr is not important. a complete power transfer from the dac output to the load can be realized, but the output compliance range should be ob- served. alternatively, if the center tap is not connected, the signal swing will be centered at r s ? i outfs /2. however, in this case, the two resistors, r s , must be used to enable the necessary dc-current flow for both outputs. differential configuration using an op amp if the application requires a dc-coupled output, a difference amplifier may be considered, as shown in figure 4. four external resistors are needed to configure the voltage-feed- back op amp opa680 as a difference amplifier performing the differential to single-ended conversion. under the shown configuration, the dac900 generates a differential output signal of 0.5vp-p at the load resistors, r l . the resistor values shown were selected to result in a symmetric 25 w loading for each of the current outputs since the input impedance of the difference amplifier is in parallel to resis- tors r l , and should be considered. the opa680 is configured for a gain of two. therefore, operating the dac900 with a 20ma full-scale output will produce a voltage output of 1v. this requires the amplifier to operate off of a dual power supply ( 5v). the tolerance of the resistors typically sets the limit for the achievable common-mode rejection. an improvement can be obtained by fine tuning resistor r 4 . this configuration typically delivers a lower level of ac performance than the previously discussed transformer solu- tion because the amplifier introduces another source of distortion. suitable amplifiers should be selected based on their slew-rate, harmonic distortion, and output swing capa- bilities. high-speed amplifiers like the opa680 or opa687 may be considered. the ac performance of this circuit may be improved by adding a small capacitor, c diff , between the outputs i out and i out , as shown in figure 4 . this will intro- duce a real pole to create a low-pass filter in order to slew- limit the dacs fast output signal steps, which otherwise could drive the amplifier into slew-limitations or into an overload condition; both would cause excessive distortion. the difference amplifier can easily be modified to add a level shift for applications requiring the single-ended output voltage to be unipolar, i.e., swing between 0v and +2v. dual transimpedance output configuration the circuit example of figure 5 shows the signal output currents connected into the summing junction of the opa2680, which is set up as a transimpedance stage, or i to v converter. with this circuit, the dacs output will be kept at a virtual ground, minimizing the effects of output impedance variations, and resulting in the best dc linearity (inl). however, as mentioned previously, the amplifier may be driven into slew-rate limitations, and produce un- wanted distortion. this may occur, especially, at high dac update rates. i out i out dac900 1:1 adt1-1wt (mini-circuits) r s 50 r s 50 r l optional r diff i out i out dac900 r l 26.1 w r l 28.7 w r 4 402 w r 3 200 w r 2 402 w r 1 200 w opa680 c diff +5v v out ?v 1/2 opa2680 1/2 opa2680 dac900 ? out = i out ?r f ? out = i out ?r f r f1 r f2 c f1 c f2 c d1 c d2 i out i out 50 w 50 w ?v +5v
dac900 14 figure 6. driving a doubly terminated 50 w cable directly. figure 7. internal reference configuration. the dc gain for this circuit is equal to feedback resistor r f . at high frequencies, the dac output impedance (c d1 , c d2 ) will produce a zero in the noise gain for the opa2680 that may cause peaking in the closed-loop frequency response. c f is added across r f to compensate for this noise gain peaking. to achieve a flat transimpedance frequency re- sponse, the pole in each feedback network should be set to: 1 2 4 p p r c gbp r c f f f d = (8) with gbp = gain bandwidth product of opa which will give a corner frequency f -3db of approximately: f gbp r c db f d - = 3 2 p (9) the full-scale output voltage is defined by the product of i outfs ? r f , and has a negative unipolar excursion. to improve on the ac performance of this circuit, adjustment of r f and/or i outfs should be considered. further extensions of this application example may include adding a differential filter at the opa2680s output followed by a transformer, in order to convert to a single-ended signal. single-ended configuration using a single load resistor connected to the one of the dac outputs, a simple current-to-voltage conversion can be ac- complished. the circuit in figure 6 shows a 50 w resistor connected to i out , providing the termination of the further connected 50 w cable. therefore, with a nominal output current of 20ma, the dac produces a total signal swing of 0 to 0.5v into the 25 w load. internal reference operation the dac900 has an on-chip reference circuit which com- prises a 1.24v bandgap reference and a control amplifier. grounding of pin 16, int/ext, enables the internal refer- ence operation. the full-scale output current, i outfs , of the dac900 is determined by the reference voltage, v ref , and the value of resistor r set . i outfs can be calculated by: i outfs = 32 ? i ref = 32 ? v ref / r set (10) as shown in figure 7, the external resistor r set connects to the fsa pin (full-scale adjust). the reference control amplifier operates as a v to i converter producing a refer- ence current, i ref , which is determined by the ratio of v ref and r set (see equation 10). the full-scale output current, i outfs , results from multiplying i ref by a fixed factor of 32. different load resistor values may be selected as long as the output compliance range is not exceeded. additionally, the output current, i outfs , and the load resistor, may be mutu- ally adjusted to provide the desired output signal swing and performance. using the internal reference, a 2k w resistor value results in a 20ma full-scale output. resistors with a tolerance of 1% or better should be considered. selecting higher values, the converter output can be adjusted from 20ma down to 2ma. operating the dac900 at lower than 20ma output currents may be desirable for reasons of reducing the total power consumption, improving the distortion performance, or ob- serving the output compliance voltage limitations for a given load condition. it is recommended to bypass the ref in pin with a ceramic chip capacitor of 0.1 m f or more. the control amplifier is internally compensated, and its small signal bandwidth is approximately 1.3mhz. to improve the ac performance, an additional capaci- tor (c compext ) should be applied between the bw pin and the analog supply, +v a , as shown in figure 7. using a 0.1 m f capacitor, the small-signal bandwidth and output impedance of the control amplifier is further diminished, reducing the noise that is fed into the current source array. this also helps shunting feedthrough signals more effectively, and improving the noise performance of the dac900. i out i out dac900 25 w 50 w 50 w i outfs = 20ma v out = 0v to +0.5v dac900 c compext 0.1 f c comp 400pf +1.24v ref. r set 2k w 0.1 f int/ext fsa bw +5v +v a ref in current sources i ref = v ref r set ref control amp
dac900 15 figure 8. external reference configuration. external reference operation the internal reference can be disabled by applying a logic high (+v a ) to pin int/ext. an external reference voltage can then be driven into the ref in pin, which in this case functions as an input, as shown in figure 8. the use of an external reference may be considered for applications that require higher accuracy and drift performance, or to add the ability of dynamic gain control. while a 0.1 m f capacitor is recommended to be used with the internal reference, it is optional for the external reference operation. the reference input, ref in , has a high input impedance (1m w ) and can easily be driven by various sources. note that the voltage range of the external reference should stay within the compliance range of the reference input (0.1v to 1.25v). digital inputs the digital inputs, d0 (lsb) through d9 (msb) of the dac900 accept standard positive binary coding. the digital input word is latched into a master-slave latch with the rising edge of the clock. the dac output becomes updated with the following rising clock edge (refer to the specification table and timing diagram for details). the best performance will be achieved with a 50% clock duty cycle, however, the duty cycle may vary as long as the timing specifications are met. additionally, the setup and hold times may be chosen within their specified limits. all digital inputs are cmos compatible. the logic thresh- olds depend on the applied digital supply voltage such that they are set to approximately half the supply voltage; vth = +vd/2 ( 20% tolerance). the dac900 is designed to operate over a supply range of 2.7v to 5.5v. power-down mode the dac900 features a power-down function which can be used to reduce the supply current to less than 9ma over the specified supply range of 2.7v to 5.5v. applying a logic high to the pd pin will initiate the power-down mode, while a logic low enables normal operation. when left uncon- nected, an internal active pull-down circuit will enable the normal operation of the converter. grounding, decoupling and layout information proper grounding and bypassing, short lead length, and the use of ground planes are particularly important for high frequency designs. multilayer pc-boards are recommended for best performance since they offer distinct advantages such as minimization of ground impedance, separation of signal layers by ground layers, etc. the dac900 uses separate pins for its analog and digital supply and ground connections. the placement of the decou- pling capacitor should be such that the analog supply (+v a ) is bypassed to the analog ground (agnd), and the digital supply bypassed to the digital ground (dgnd). in most cases 0.1uf ceramic chip capacitors at each supply pin are adequate to provide a low impedance decoupling path. keep in mind that their effectiveness largely depends on the proximity to the individual supply and ground pins. there- fore they should be located as close as physically possible to those device leads. whenever possible, the capacitors should be located immediately under each pair of supply/ground pins on the reverse side of the pc board. this layout ap- proach will minimize the parasitic inductance of component leads and pcb runs. r set +5v external reference i ref = v ref r set dac900 c compext 0.1 f c comp 400pf +1.24v ref. int/ext fsa bw +5v +v a ref in current sources ref control amp
dac900 16 further supply decoupling with surface mount tantalum capacitors (1uf to 4.7uf) may be added as needed in proximity of the converter. low noise is required for all supply and ground connections to the dac900. it is recommended to use a multilayer pc- board utilizing separate power and ground planes. mixed signal designs require particular attention to the routing of the different supply currents and signal traces. generally, analog supply and ground planes should only extend into analog signal areas, such as the dac output signal and the reference signal. digital supply and ground planes must be confined to areas covering digital circuitry, including the digital input lines connecting to the converter, as well as the clock signal. the analog and digital ground planes should be joined together at one point underneath the d/a converter. this can be realized with a short track of approximately 1/8inch (3mm). the power to the dac900 should be provided through the use of wide pcb runs or planes. wide runs will present a lower trace impedance, further optimizing the supply decou- pling. the analog and digital supplies for the converter should only be connected together at the supply connector of the pc board. in the case of only one supply voltage being available to power the dac, ferrite beads along with bypass capacitors may be used to create an lc filter. this will generate a low noise analog supply voltage, which can then be connected to the +v a supply pin of the dac900. while designing the layout, it is important to keep the analog signal traces separated from any digital line, in order to prevent noise coupling onto the analog signal path.
important notice texas instruments and its subsidiaries (ti) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. all products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. ti warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with ti's standard warranty. testing and other quality control techniques are utilized to the extent ti deems necessary to support this warranty. specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. customers are responsible for their applications using ti components. in order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. ti assumes no liability for applications assistance or customer product design. ti does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of ti covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. ti's publication of information regarding any third party's products or services does not constitute ti's approval, warranty or endorsement thereof. copyright ? 2000, texas instruments incorporated

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