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| ! " # $ % #& # ' ( ) % * + # $ % ' ( ) % , % - - ./ - 0! ! 1 ! ! 23. 4 5 $& - - 5 3 . 6/ .76* - - - 8 ## 3 , 9 - :;; - 3 - 9 clamping voltage 0.001 0.01 0.1 1 10 100 1000 26 28 30 32 34 36 38 ST70-27F typ 10 1000 m s clamping voltage v cl [v] peak current i p [a] breakdown voltage 24 25 26 27 28 29 30 31 32 0 50 100 150 ST70-27F typ i r = 1ma junction temperature tj [ c] breakdown voltage v br [v] reverse current 0.01 0.1 1 10 100 0 50 100 150 ST70-27F typ v r = 23v junction temperature tj [ c] reverse current i r [ m a] peak surge reverse current 10 100 1000 0.1 1 10 ST70-27F i rsm t p i rsm /2 0 pulse width t p [ms] peak surge reverse current i rsm [a] current waveform non-repetitive tj=25 c junction capacitance 100 1000 10 4 1 10 100 ST70-27F typ v r = 23v frequency f [khz] junction capacitance cj [pf] junction capacitance 100 1000 10 4 0.1 1 10 ST70-27F typ f = 100khz applied voltage v r [v] junction capacitance cj [pf] 0 1 2 3 4 5 6 0 20 40 60 80 100 120 140 160 ST70-27F derating curve glass-epoxy substrate soldering land 11 11mm 45 45 1.6mm lead temperature tl [ c] forward power dissipation p f [a] 0 1 2 3 4 5 6 0 20 40 60 80 100 120 140 160 ST70-27F derating curve sine wave r-load free in air glass-epoxy substrate soldering land 11 11mm 45 45 1.6mm ambient temperature ta [ c] forward power dissipation p f [a] transient thermal impedance 0.01 0.1 1 10 100 ST70-27F 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 0.05 0.5 0.2 20 50 5 2 200 500 2000 5000 0.02 0.05 0.5 0.2 20 5 2 0.005 0.002 q ja q jl glass-epoxy substrate soldering land 11 11mm 45 45 1.6mm time t [s] transient thermal resistance q ja q jl [ c/w] 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 ST70-27F forward power dissipation sin dc tj = 150 c average rectified forward current i o [a] forward power dissipation p f [w] |
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