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the m pc2753gr is a monolithic ic designed as if down-converter for gps receivers. this if down-converter ic features high gain and the gc (gain control) function, and operates on 3 volts typ. therefore, this ic is suitable for enhancing the performance and reducing the power consumption of users application sets. this ic is packaged in a 20-pin shrink sop that enables high-density surface mounting. the m pc27 series is manufactured using nec original silicon bipolar process technology called nesat tm iii (f t = 20 ghz). this process technology includes direct silicon nitride film and gold electrode structure. semiconductor chips produced with this technology have excellent moisture resistivity, anticorrosion, current characteristics, and high-frequency performance. as a result, this ic features excellent reliability and electrical characteristics. features ? low power operation: power supply v cc = 3.0 v typ. ? low power consumption: i cctotal = 6.5 ma typ. ? high gain of 79 db in total: 38 db typ. in down-converter block (v gc 12 v), and 41 db typ. in 2nd if amplifier block ? gc function: gc dynamic range (d gc ) = 19 db typ. ? available in 20-pin shrink sop : enabling high-density surface mount ordering information part number package packing style m pc2753gr-e1 20-pin plastic shrink sop embossed tape 12-mm wide. (225 mil) no. 1 pin is in pull-out direction. 2500 pieces/reel m pc2753gr-e2 20-pin plastic shrink sop embossed tape 12-mm wide. (225 mil) no. 1 pin is in roll-in direction. 2500 pieces/reel remark to order evaluation samples, please contact local nec sales representative, mentioning m pc2753gr. bipolar analog integrated circuit m pc2753gr if down-converter ic for 3 v gps receiver caution electro-static sensitive device the mark shows major revised points. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. document no. p14501ej2v0ds00 (2nd edition) (previous no. ic-3490) date published october 1999 n cp(k) printed in japan 1995, 1999 data sheet
2 m pc2753gr data sheet p14501ej2v0ds00 f in (ghz) 0.1 - 2.0 dc - 0.4 product line-up (t a =+ 25 c, v cc = 3.0 v) remark typical values of major parameters. for test conditions, refer to electrical characteristics tables. note v gc = 0 to 2.4 v pin configuration and block diagram (top view) type rf down-converter if down-converter i cc (ma) 6 6.5 gain (db) 14 60 to 79 note ssb nf (db) 12 12 part number m pc2756t m pc2753gr 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 mix out 2 gnd l oin 1 l oin 2 gc v cc (downcon) v cc (2nd if-amp) 2nd ifamp out gnd nc mix out 1 gnd 1st if in 1st if in 2nd if out 2nd if-amp in 2nd if-amp in bypass gnd nc
3 m pc2753gr data sheet p14501ej2v0ds00 pin function pin no. 3 4 5 6 7 8 13 equivalent circuit symbol 1st if in 1st if in 2nd if out 2ndif-amp in 2ndif-amp in bypass 2ndif-amp out pin voltage (v) 2.5 2.5 1.1 2.1 2.1 2.1 1.4 description no. 3 pin is the input pin of the 1st if amplifier. no. 4 pin should be connected to gnd via a bypass capacitor. no. 5 pin is the output pin of the 2nd if. the output signal comes from the mixer unit via the gc amplifier. this output pin features low impedance because of its emitter-follower output port. no. 6 and 7 pins are the input pins of the 2nd if amplifier. these two inputs are internally connected to each base of the pair transistors of the differential amplifier. no.6 pin should be connected to gnd via a bypass capacitor. no. 8 pin is connected to the feedback loop of the 2nd if amplifier. this pin should be connected to gnd via a bypass capacitor to stabilize the dc bias. no. 13 pin is the output pin of the 2nd if amplifier. this output pin features low impedance because of its emitter-follower output port. 3 4 v cc to mix to mix 5 v cc mix gc amp 13 8 7 6 v cc
4 m pc2753gr data sheet p14501ej2v0ds00 pin function description no. 16 pin is the gain control pin for the gc amplifier. the gain of the gc amplifier is controlled by the applied voltage of this pin. this gc amplifier functions as a reverse gc. no. 17 and 18 pins are the local input pins of the mixer. the l o 2 pin should be connected to gnd via a bypass capacitor. no. 15 pin is the v cc supply pin for the if down-converter block. this pin is independent of the v cc pin for the if amplifier. apply 3 v to the no. 15 pin. no. 14 pin is the v cc supply pin for the 2nd if amplifier. this pin is independent of the v cc pin for the if down-converter unit. apply 3 v to the no. 16 pin. this pin is the ground pin for the entire chip. therefore the ground of the if down-converter and 2nd if amplifier blocks are not separated. the ground pattern to be connected to this pin should be formed as wide as possible to minimize its impedance. no. 10 and 11 pins are not connected to the internal circuits. connecting these pins to gnd is recommended, though these pins may be left unconnected. no. 1 and 20 pins are the output pins of the mixer block. these pin are used to monitor the signal output from the 2nd if amplifier and to be input to the gc amplifier. when this ic is actually used, these pins should be left opened. equivalent circuit C C C C C symbol gc l o 2 l o 1 v cc (downcon) v cc (2nd if-amp) gnd nc mix out 1 mix out 2 pin voltage (v) 0 to 2.4 2.5 2.5 C C C C C pin no. 16 17 18 15 14 2 9 12 19 10 11 1 20 (supply voltage) 5 v cc mix gc amp rf 16 l o 18 17 v cc to mix to mix
5 m pc2753gr data sheet p14501ej2v0ds00 recommended operating conditions parameter symbol min. typ. max. unit supply voltage v cc 2.7 3.0 3.3 v operating ambient temperature t opt C40 +25 +85 c lo input level p loin C20 C 0 dbm electrical characteristics (unless otherwise specified, t a = +25 c, v cc = 3.0 v, z s = zo = 50 w ) * for reference only parameter supply voltage gain control voltage power dissipation operating ambient temperature storage temperature symbol v cc v gc p d t opt t stg conditions t a = +25 c t a = +25 c when mounted on double-sided copper clad epoxy glass board of 50 x 50 x 1.6 mm, t a = +85 c rating 4.0 4.0 34 C40 to +85 C55 to +150 unit v v mw c c parameter circuit current (1) if down-converter block 1st if input frequency 2nd if output frequency conversion gain noise figure input vswr lo leak to 2nd if ouput pin lo leak to 1st if input pin gain control voltage gain control dynamic range (2) 2nd if amplifier block input frequency output voltage gain conditions no signal, v gc = gnd within C3 db from cg at f 1st ifin = 50 mhz f 1st ifout = 4 mhz, v gc = gnd within C3 db from cg at f 1st ifin = 200 mhz f 1st ifin = 200 mhz, v gc = gnd f 1st ifin = 200 mhz, f 2nd ifout = 4 mhz v gc = gnd f 1st ifin = 200 mhz, f 2nd ifout = 20 mhz v gc = gnd f 1stif 400 mhz f lo = 1 to 400 mhz f lo = 1 to 500 mhz voltage at cg = max. f 1st ifin = 200 mhz, f 2nd ifout = 4 mhz v gc = 1.2 v to 2.4 v within C3 db from the gain at f = 4 mhz f = 4 mhz, zo = 1 m w //27 pf f = 4 mhz symbol i cc total f 1st ifin f 2nd ifout c.g ssb nf vswr1 l o 2nd ifout l o 1st ifin v gc d gc f ampin v ampout s 21 min. typ. max. unit 4.7 6.9 8.5 ma dc 400 mhz dc 20 mhz 35 38 42 db C1215db 1.5 : 1 C62 dbm C25 dbm 1.2 v 15 19 db dc 20 mhz 350 450 550 mv p-p 38 41 45 db electrical specifications absolute maximum ratings * * *
6 m pc2753gr data sheet p14501ej2v0ds00 test circuit footprint of test circuit legends (*1) double-sided patterning with 35- m m- thick copper on polyhimid board siz- ing 50 50 0.4 mm (*2) gnd pattern on backside (*3) solder coating over patterns (*4) indicate through-holes parts number value c 1 to c 11 1 000 pf 1 10 2 3 4 5 6 7 8 9 20 11 19 18 17 16 15 14 13 12 sg c 1 1 000 pf 1 000 pf c 2 sg 1 000 pf c 11 1 000 pf c 10 sa 1 000 pf c 3 1 000 pf c 4 sg 1 000 pf c 5 1 000 pf c 6 c 9 1 000 pf v gc c 8 1 000 pf v cc = 3 v oscillo- scope c 7 1 000 pf sa or 1 meg 27 pf c 3 c 4 c 7 c 9 c 8 c 11 c 6 c 5 c 1 v gc v cc l oin 2nd ifamp out 1st if in 2nd if out 2nd if-amp in pc2753gr m c 2 c 10
7 m pc2753gr data sheet p14501ej2v0ds00 characteristic curves (unless otherwise specified, t a = +25 c, v cc = 3 v) C entire ic C C if down-converter block C 15 10 5 no signal v gc = gnd circuit current vs. supply voltage 0 12345 suppl y volta g e v cc ( v ) circuit current i cc total (ma) 15 10 5 circuit current vs. temperature C40 operatin g temperature t opt ( ?c ) circuit current i cc total (ma) no signal v gc = gnd C20 0 +20 +40 +60 +80 +100 15 conversion gain and ssb noise figure vs. input frequency 1st if input frequency (mh z ) 50 conversion gain vs. 2nd if output frequency 0 2nd if output frequency f 2nd ifout (mh z ) conversion gain cg (db) 20 5 10 f 2nd ifout = 4 mh z (low-side local) v gc = gnd 50 30 40 20 nf cg conversion gain cg (db) sbb noise figure ssb nf (db) 100 200 300 400 500 600 700 800 900 1000 20 40 60 80 100 40 30 20 10 v gc = gnd p 1st ifin = C70 dbm p loin = C10 dbm f 1st ifin = 200 mh z 50 conversion gain vs. lo input power lo input level (dbm) 50 conversion gain vs. agc voltage 0 agc voltage (v) conversion gain cg (db) 0 conversion gain cg (dbm) C80 40 30 20 10 C60 C40 C20 0 C70 C50 C30 C10 10 v gc = gnd 40 30 20 10 0 C10 0.5 1 1.5 2 2.5 3 3.5 v cc = 2.7 v v cc = 3.3 v v cc = 3.0 v v cc = 3.0 v v cc = 2.7 v v cc = 3.3 v v cc = 2.7 v v cc = 3.3 v v cc = 3.0 v
8 m pc2753gr data sheet p14501ej2v0ds00 0 p loin = C10 dbm lo leakage at 2nd if output pin C100 1 2nd if output frequency f ifout (mh z ) lo leak level l oifout (dbm) lo leakage at 1st if output pin 1st if input frequency f ifout (mh z ) C20 C40 C60 C80 100 200 300 400 500 0 p loin = C10 dbm C100 1 C20 C40 C60 C80 100 200 300 400 500 lo leak level l oifout (dbm) 0 1st if input return loss vs. frequency 40 1 1st if input frequency f ifin (mh z ) 1st if return loss (db) 200 400 600 800 1000 external 50- w termination 10 20 30 C if down-converter block C
9 m pc2753gr data sheet p14501ej2v0ds00 C 2nd if amplifier block C 60 gain vs. responce frequency 20 0.1 2nd if amplifier input frequency f ampin (mh z ) power gain s 21 (db) lo leakage at 2nd if amplifier output pin 2nd if amplifier input frequency f ampin (mh z ) 20 40 60 80 100 0 C100 1 C20 C40 C60 C80 100 200 300 400 500 lo leak level l oampout (dbm) 50 40 30 v cc = 3.0 v v cc = 3.3 v v cc = 2.7 v 2nd if out pin and 2nd if amp in pin connected 500 output voltage vs. input power 0 C80 2nd if amplifier input level p ampin (dbm) output voltage v ampout (mv) C10 f ampin = 1 mh z 400 300 200 100 C70 C60 C50 C40 C30 C20 with oscilloscope
10 m pc2753gr data sheet p14501ej2v0ds00 caution this block diagram schematically represents the chip set product line-up only, and does not imply a detailed application circuit. for details on the related devices, refer to the latest data sheet of each device. system application examples: gps receiver schematic bpf bpf antenna 1 575.42 mh z rf amp. pc2749t m pc2756t m 1st mixer 1st if amp. lo buffer 2nd mixer 2nd if amp. 2nd if out @ 2 mh z lo2 input output buffer pc2745t m output ( + ) output (e) loop amp/filter phase detector ? 4? 2? 2? 2? 2? 2 reference oscillation tcxo 11.6 mh z 90 mh z bpf pc2753gr m gc gps receiver chip set isv210 op amplifier
11 m pc2753gr data sheet p14501ej2v0ds00 package dimensions 20 pin plastic ssop (225 mil) (unit: mm) note each lead centerline is located within 0.10 mm of its true position (t.p.) at maximum material condition. 20 detail of lead end 1.8 max. 3? +7? C3? 0.65 0.10 m 0.15 0.5 0.2 11 110 6.7 0.3 1.5 0.1 0.1 0.1 0.22 +0.10 e0.05 0.575 max. 0.15 +0.10 e0.05 6.4 0.2 4.4 0.1 1.0 0.2
12 m pc2753gr data sheet p14501ej2v0ds00 attention on using this ic (1) observe precautions for handling because of electrostatic sensitive devices. (2) the ground pattern should be designed as wide as possible to minimize its ground impedance. otherwise, undesired oscillation may occur. (3) the track length of the ground pins should be as short as possible. (4) a bypass capacitor should be inserted between the v cc pin and the v cc line. recommended soldering conditions the following conditions must be met when soldering this product. please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. m pc2753gr soldering process soldering conditions symbols infrared ray peak temperature of package surface : 235 c, ir35-00-2 reflow reflow time : 30 seconds or less (210 ?c or higher), number of reflow processes : 2, exposure limit : none note vps peak temperature of package surface : 215 c, vp15-00-2 reflow time : 40 seconds or less (200 c or higher), number of reflow processes : 2, exposure limit : none note wave soldering solder temperature : 260 c or lower, ws60-00-1 flow time : 10 seconds or less, number of reflow processes : 1, exposure limit : none note partial heating pin temperature : 300 c or lower, method time : 10 seconds or less for each pin, exposure limit : none note note exposure limit before soldering after dry-pack package is opened. storage conditions : 25 c and relative humidity of 65 % or less. caution do not apply more than one soldering method at any one time, except for the partial heating method.
13 m pc2753gr data sheet p14501ej2v0ds00 [memo]
14 m pc2753gr data sheet p14501ej2v0ds00 [memo]
15 m pc2753gr data sheet p14501ej2v0ds00 [memo]
m pc2753gr nesat (nec silicon advanced technology) is a trademark of nec corporation. attention observe precautions for handling electrostatic sensitive devices the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. nec corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated quality assurance program for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. m7 98.8

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