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? semiconductor components industries, llc, 2002 february, 2002 rev. 7 1 publication order number: mc33275/d mc33275 300 ma, 2.5 v, low dropout voltage regulator the mc33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, dpak, sot223, and sop8 surface mount packages. these devices feature a very low quiescent current and are capable of supplying output currents up to 300 ma. internal current and thermal limiting protection are provided by the presence of a short circuit at the output and an internal thermal shutdown circuit. the mc33275 is available as a mc33375 which includes an on/off control. due to the low inputtooutput voltage differential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable. features: ? low quiescent current (125 a) ? low inputtooutput voltage differential of 25 mv at i o = 10 ma, and 260 mv at i o = 300 ma ? extremely tight line and load regulation ? stable with output capacitance of only 0.33 f for 2.5 v output voltage ? internal current and thermal limiting simplified block diagram v in thermal & anti-sat protection 54 k rint this device contains 41 active transistors 1.23 v v. ref. v out gnd low dropout micropower voltage regulator ordering information plastic d suffix case 751 plastic st suffix case 318e 1 3 4 8 1 1 3 4 plastic dt suffix case 369a gnd v in v out 4 123 mc33375 gnd input gnd gnd gnd output gnd gnd n/c 1 2 3 4 8 7 6 5 mc33375 pins 4 and 5 not connected gnd v in v out 4 12 3 mc33275 gnd see detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. http://onsemi.com
mc33275 http://onsemi.com 2 maximum ratings (t a = 25 c, for min/max values t j = 40 c to +125 c) rating symbol value unit input voltage v cc 13 vdc power dissipation and thermal characteristics t a = 25 c maximum power dissipation case 751 (sop8) d suffix thermal resistance, junctiontoambient thermal resistance, junctiontocase case 369a (dpak) dt suffix thermal resistance, junctiontoair thermal resistance, junctiontocase case 318e (sot223) st suffix thermal resistance, junctiontoair thermal resistance, junctiontocase p d r q ja r q jc r q ja r q jc r q ja r q jc internally limited 160 25 92 6.0 245 15 w c/w c/w c/w c/w c/w c/w output current i o 300 ma maximum junction temperature t j 150 c operating junction temperature range t j 40 to +125 c storage temperature range t stg 65 to +150 c electrical characteristics (c l = 1.0 m f, t a = 25 c, for min/max values t j = 40 c to +125 c, note 1) characteristic symbol min typ max unit output voltage i o = 0 ma to 250 ma 2.5 v suffix t a = 25 c, v in = [v o + 1] v 3.0 v suffix 3.3 v suffix 5.0 v suffix 2.5 v suffix v in = [v o + 1] v, 0 < i o < 100 ma 3.0 v suffix 2% tolerance from t j = 40 to +125 c 3.3 v suffix 5.0 v suffix v o 2.475 2.970 3.267 4.950 2.450 2.940 3.234 4.900 2.50 3.00 3.30 5.00 e e e e 2.525 3.030 3.333 5.05 2.550 3.060 3.366 5.100 vdc line regulation v in = [v o + 1] v to 12 v, i o = 250 ma, all suffixes t a = 25 c reg line 2.0 10 mv load regulation v in = [v o + 1] v, i o = 0 ma to 250 ma, all suffixes t a = 25 c reg load 5.0 25 mv dropout voltage i o = 10 ma t j = 40 c to +125 c i o = 100 ma i o = 250 ma i o = 300 ma v in v o e e e e 25 115 220 260 100 200 400 500 mv ripple rejection (120 hz) v in(peakpeak) = [v o + 1.5] v to [v o + 5.5] v e 65 75 e db output noise voltage c l = 1 fi o = 50 ma (10 hz to 100 khz) c l = 200 f v n e e 160 46 e e vrm s current parameters characteristic symbol min typ max unit quiescent current on mode v in = [v o + 1] v, i o = 0 ma i q e 125 200 a quiescent current on mode sat v in = [v o 0.5] v, i o = 0 ma, note 2 2.5 v suffix 3.0 v suffix 3.3 v suffix 5.0 v suffix i q e e e e 1100 1500 1500 1500 1500 2000 2000 2000 a current limit v in = [v o + 1] v, v o shorted i limit e 450 e ma thermal shutdown characteristic symbol min typ max unit thermal shutdown e e 150 e c note: 1. low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. note: 2. quiescent current is measured where the pnp pass transistor is in saturation. v in = [v o 0.5] v guarantees this condition.
mc33275 http://onsemi.com 3 definitions load regulation the change in output voltage for a change in load current at constant chip temperature. dropout voltage the input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. measured when the output drops 100 mv below its nominal value (which is measured at 1.0 v differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. output noise voltage the rms ac voltage at the output with a constant load and no input ripple, measured over a specified frequency range. maximum power dissipation the maximum total dissipation for which the regulator will operate within specifications. quiescent current current which is used to operate the regulator chip and is not delivered to the load. line regulation the change in output voltage for a change in the input voltage. the measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. maximum package power dissipation the maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 150 c. the junction temperature is rising while the difference between the input power (v cc x i cc ) and the output power (v out x i out ) is increasing. depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum current as following: pd t j t a r ja the maximum operating junction temperature t j is specified at 150 c, if t a = 25 c, then p d can be found. by neglecting the quiescent current, the maximum power dissipation can be expressed as: i out p d v cc v out the thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). then you can calculate the power dissipation by subtracting the output power from the input power. all variables are then well known: power dissipation, thermal shutdown temperature (150 c for mc33275) and ambient temperature. r ja t j t a p d
mc33275 http://onsemi.com 4 0 3.5 0 300 output voltage (v) input voltage (v) load current (ma) c l = 1.0 f v out = 3.3 v t a = 25 c v in = 4.3 v figure 1. line transient response figure 2. line transient response figure 3. load transient response figure 4. load transient response figure 5. output voltage versus input voltage output voltage change (mv) 50 100 150 200 250 400 100 -100 -200 -500 -600 -700 -0.8 -0.6 -0.4 -0.2 -1.0 0.4 0 0.2 output voltage change (v) v out change load current -750 load current (ma) c l = 33 .0 f v out = 3.3 v t a = 25 c v in = 4.3 v 0 250 300 -0.11 -0.16 -0.01 0.14 output voltage change (v) v out change load current 200 -0.06 0.04 0.09 3.0 2.5 2.0 1.5 1.0 0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 i l = 1 ma i l = 250 ma 50 100 150 1 300 dropout voltage (mv) i o , output current (ma) 10 100 1000 250 200 150 100 50 0 0 v in , input voltage (v) time ( s) 20 40 60 80 100 120 140 160 180 200 7 6 5 4 3 2 1 0 -100 -50 0 50 100 150 200 output voltage change (mv) t a = 25 c c l = 0.47 f i l = 10 ma v out = 3.3 v v in v out figure 6. dropout voltage versus output current 0 v in , input voltage (v) time ( s) 50 100 150 200 7 6 5 4 3 2 1 0 -20 -10 0 20 40 50 70 10 30 60 t a = 25 c c l = 33 f i l = 10 ma v out = 3.3 v v in v out -400 -300 0 200 300 350 0.6 0.8 1.0 -650 -550 -450 -350 -250 -150 -50 50 150 250 350 time ( s) time ( s)
mc33275 http://onsemi.com 5 figure 7. dropout voltage versus temperature figure 8. ground pin current versus input voltage figure 9. ground pin current versus ambient temperature figure 10. output voltage versus ambient temperature (v in = v out1 +1v) -40 8 0 i t a ( c) v in (volts) 23 8 10 6 4 2 0 7 5 4 3 2 1 0 -20 0 20 40 60 80 100 120 140 i l = 100 ma i l = 250 ma -40 2.5 v temperature ( c) 2.495 2.49 2.485 2.48 2.475 2.47 02585 (ma) gnd 6 i l = 50 ma (volts) out i o = 0 i o = 250 ma -40 300 temperature ( c) 250 200 150 100 50 0 02585 dropout voltage (mv) i l = 10 ma i l = 100 ma i l = 250 ma i l = 300 ma 1 8 12 i (ma) gnd i l = 300 ma i l = 100 ma i l = 50 ma 45 67
mc33275 http://onsemi.com 6 figure 11. output voltage versus ambient temperature (v in = 12 v) figure 12. ripple rejection figure 13. ripple rejection -40 2.5 v temperature ( c) 2.49 2.485 2.48 2.475 2.47 02585 (volts) out i o = 0 i o = 250 ma 2.495 2.465 0.1 70 db frequency (khz) 60 50 40 30 20 10 0 1 10 100 i l = 100 ma i l = 250 ma 0.1 70 db frequency (khz) 60 50 40 30 20 10 0 1 10 100 i l = 10 ma i l = 1 ma
mc33275 http://onsemi.com 7 applications information load c out v out v in c in gnd mc33275xx figure 14. typical application circuit the mc33275 regulators are designed with internal current limiting and thermal shutdown making them userfriendly. figure 14 is a typical application circuit. the output capability of the regulator is in excess of 300 ma, with a typical dropout voltage of less than 260 mv. internal protective features include current and thermal limiting. external capacitors these regulators require only a 0.33 f (or greater) capacitance between the output and ground for stability for 2.5 v, 3.0 v, and 3.3 v output voltage options. output voltage options of 5.0 v require only 0.22 f for stability. the output capacitor must be mounted as close as possible to the mc33275. if the output capacitor must be mounted further than two centimeters away from the mc33275, then a larger value of output capacitor may be required for stability. a value of 0.68 f or larger is recommended. most type of aluminum, tantalum, or multilayer ceramic will perform adequately. solid tantalums or appropriate multilayer ceramic capacitors are recommended for operation below 25 c. an input bypass capacitor is recommended to improve transient response or if the regulator is connected to the supply input filter with long wire lengths, more than 4 inches. this will reduce the circuit's sensitivity to the input line impedance at high frequencies. a 0.33 f or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. the bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator's input terminals. figure 15 shows the esr that allows the ldo to remain stable for various load currents. 0 100 esr (ohm) load current (ma) 100 200 300 10 1.0 0.1 figure 15. esr for v out = 3.0v v out = 3.0 v c out = 1.0 f c in = 1.0 f 50 150 250 stable region applications should be tested over all operating conditions to insure stability. thermal protection internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. when activated, typically at 150 c, the output is disabled. there is no hysteresis built into the thermal protection. as a result the output will appear to be oscillating during thermal limit. the output will turn off until the temperature drops below the 150 c then the output turns on again. the process will repeat if the junction increases above the threshold. this will continue until the existing conditions allow the junction to operate below the temperature threshold. thermal limit is not a substitute for proper heatsinking. the internal current limit will typically limit current to 450 ma. if during current limit the junction exceeds 150 c, the thermal protection will protect the device also. current limit is not a substitute for proper heatsinking. output noise in many applications it is desirable to reduce the noise present at the output. reducing the regulator bandwidth by increasing the size of the output capacitor will reduce the noise on the mc33275.
mc33275 http://onsemi.com 8 figure 16. sot223 thermal resistance and maximum power dissipation versus p.c.b. copper length 60 80 100 120 140 160 180 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0102030 25 15 5.0 l, length of copper (mm) p d(max) for t a = 50 c r ja , thermal resistance, junctiontoair ( cw) p d , maximum power dissipation (w) minimum size pad r q ja l l 2.0 oz. copper ??? ??? ??? figure 17. dpak thermal resistance and maximum power dissipation versus p.c.b. copper length figure 18. sop8 thermal resistance and maximum power dissipation versus p.c.b. copper length r , thermal resistance, ja q junctiontoair ( c/w) 30 50 70 90 110 170 0.4 0.8 1.2 1.6 3.2 0204050 30 10 l, length of copper (mm) p d(max) for t a = 50 c l l r q ja 130 2.0 150 2.4 2.8 ??????? ??????? ??????? graph represents symmetrical layout 2.0 oz. copper 3.0 mm 40 50 60 70 80 90 100 0102030 25 15 5.0 l, length of copper (mm) 0.6 0.8 1.0 1.2 1.4 1.6 r ja , thermal resistance, junctiontoair ( cw) 0.4 p d , maximum power dissipation (w) l ??? ??? ??? ??? 2.0 oz. copper r q ja minimum size pad p d(max) for t a = 50 c l
mc33275 http://onsemi.com 9 ordering information device type operating temperature range, tolerance case package mc33275dt2.5rk 25v 369a dpak mc33275st2.5t3 2.5 v ( fixed volta g e ) 318e sot223 mc33275d2.5r2 (fixed voltage) 7515 sop8 mc33275dt3.0rk 30v 1% t l 369a dpak mc33275st3.0t3 3.0 v ( fixed volta g e ) 1% tolerance at t a = 25 c 318e sot223 mc33275d3.0r2 (fixed voltage) at t a = 25 c 7515 sop8 mc33275dt3.3rk 33v 2% t l t 369a dpak mc33275st3.3t3 3.3 v ( fixed volta g e ) 2% tolerance at t j from 40 to +125 c 318e sot223 mc33275d3.3r2 (fixed voltage) t j from 40 to +125 c 7515 sop8 mc33275dt5.0rk 50v 369a dpak mc33275st5.0t3 5.0 v ( fixed volta g e ) 318e sot223 mc33275d5.0r2 (fixed voltage) 7515 sop8 device marking device version marking (1st line) mc33275 2.5v 27525 mc33275 3.0v 27530 mc33275 3.3v 27533 mc33275 5.0v 27550 tape and reel specifications device reel size tape width quantity mc33275dt 13o 16mm embossed tape 2500 units mc33275d 13o 12mm embossed tape 2500 units mc33275s 13o 8mm embossed tape 4000 units
mc33275 http://onsemi.com 10 package dimensions d suffix plastic package case 75107 (sop8) issue w st suffix plastic package case 318e04 (sot223) issue k h s f a b d g l 4 123 0.08 (0003) c m k j dim a min max min max millimeters 0.249 0.263 6.30 6.70 inches b 0.130 0.145 3.30 3.70 c 0.060 0.068 1.50 1.75 d 0.024 0.035 0.60 0.89 f 0.115 0.126 2.90 3.20 g 0.087 0.094 2.20 2.40 h 0.0008 0.0040 0.020 0.100 j 0.009 0.014 0.24 0.35 k 0.060 0.078 1.50 2.00 l 0.033 0.041 0.85 1.05 m 0 10 0 10 s 0.264 0.287 6.70 7.30 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 x y g m y m 0.25 (0.010) z y m 0.25 (0.010) z s x s m
mc33275 http://onsemi.com 11 package dimensions dt suffix plastic package case 369a13 (dpak) issue ab d a k b r v s f l g 2 pl m 0.13 (0.005) t e c u j h t seating plane z dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.180 bsc 4.58 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.102 0.114 2.60 2.89 l 0.090 bsc 2.29 bsc r 0.175 0.215 4.45 5.46 s 0.020 0.050 0.51 1.27 u 0.020 --- 0.51 --- v 0.030 0.050 0.77 1.27 z 0.138 --- 3.51 --- notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 123 4
mc33275 http://onsemi.com 12 on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mc33275/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com n. american technical support : 8002829855 toll free usa/canada

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