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  1 composite transistors xn04683 (xn4683) silicon npn epitaxial planer transistor (tr1) silicon pnp epitaxial planer transistor (tr2) for high-frequency amplification/for general amplification  features  two elements incorporated into one package.  reduction of the mounting area and assembly cost by one half.  basic part number of element  2sc2404 + 2sb0709a(2sb709a)  absolute maximum ratings (ta=25?c) unit: mm marking symbol: er internal connection parameter symbol ratings unit collector to base voltage v cbo 30 v collector to emitter voltage v ceo 20 v emitter to base voltage v ebo 3v collector current i c 15 ma collector to base voltage v cbo ?0 v collector to emitter voltage v ceo ?0 v emitter to base voltage v ebo ? v collector current i c ?00 ma peak collector current i cp ?00 ma total power dissipation p t 200 mw junction temperature t j 150 ?c storage temperature t stg ?5 to +150 ?c tr1 overall tr2 1 : collector (tr1) 4 : collector (tr2) 2 : base (tr2) 5 : base (tr1) 3 : emitter (tr2) 6 : emitter (tr1) eiaj : sc?4 mini type package (6?in) 2.8 +0.2 ?.3 1.5 0.65 0.15 0.65 0.15 1 6 5 4 3 2 1.45 0.1 0.95 0.95 1.9 0.1 +0.25 ?.05 0.3 +0.1 ?.05 0.5 +0.1 ?.05 2.9 +0.2 ?.05 1.1 +0.2 ?.1 0.8 0.4 0.2 0 to 0.05 0.16 +0.1 ?.06 0.1 to 0.3 61 2 tr2 tr1 5 43 note.) the part number in the parenthesis shows conventional part number.
2 composite transistors xn04683  electrical characteristics (ta=25?c)  tr1 parameter symbol conditions min typ max unit collector to base voltage v cbo i c = 10 a, i e = 0 30 v emitter to base voltage v ebo i e = 10 a, i c = 0 3 v forward current transfer ratio h fe1 v ce = 6v, i c = ?ma 40 260 base to emitter voltage v be v cb = 6v, i e = ?ma 720 mv feedback capacitance cre v cb = 6v, i e = ?ma, f = 10.7mhz 0.8 1 pf transition frequency f t v cb = 6v, i e = ?ma, f = 200mhz 450 650 mhz noise figure nf v cb = 6v, i e = ?ma, f = 100mhz 3.3 db power gain pg v cb = 6v, i e = ?ma, f = 100mhz 24 db  tr2 parameter symbol conditions min typ max unit collector to base voltage v cbo i c = ?0 a, i e = 0 ?0 v collector to emitter voltage v ceo i c = ?ma, i b = 0 ?0 v emitter to base voltage v ebo i e = ?0 a, i c = 0 7 v collector cutoff current i cbo v cb = ?0v, i e = 0 0.1 a i ceo v ce = ?0v, i b = 0 ?00 a forward current transfer ratio h fe v ce = ?0v, i c = ?ma 160 460 collector to emitter saturation voltage v ce(sat) i c = ?00ma, i b = ?0ma ?0.3 ?0.5 v transition frequency f t v cb = ?0v, i e = 1ma, f = 200mhz 80 mhz collector output capacitance c ob v cb = ?0v, i e = 0, f = 1mhz 2.7 pf
3 composite transistors xn04683 common characteristics chart p t ?ta characteristics charts of tr1 i c ?v ce i c ?i b i c ?v be v ce(sat) ?i c h fe ?i c f t ?i e 0 0 160 40 120 80 100 300 200 400 ambient temperature ta ( ? c ) total power dissipation p t ( mw ) 0 0 4 8 12 16 12 10 8 6 4 2 collector to emitter voltage v ce ( v ) collector current i c ( ma ) ta=25 ? c i b =100 a 80 a 60 a 40 a 20 a 0 0 40 80 120 160 12 10 8 6 4 2 base current i b ( a ) collector current i c ( ma ) v ce =6v ta=25 ? c 0 0 2.0 1.6 1.2 0.8 0.4 30 25 20 15 10 5 base to emitter voltage v be ( v ) collector current i c ( ma ) v ce =6v ta=75 ? c 25 ? c 25 ? c 0.01 0.03 0.1 0.3 0.1 0.3 1 3 10 30 100 1 3 10 30 100 collector current i c ( ma ) collector to emitter saturation voltage v ce(sat) ( v ) i c /i b =10 ta=75 ? c 25 ? c 25 ? c 0 0.1 0.3 360 300 240 180 120 60 1 3 10 30 100 forward current transfer ratio h fe collector current i c ( ma ) v ce =6v ta=75 ? c 25 ? c 25 ? c 0.1 0.3 1 3 10 30 100 transition frequency f t ( mhz ) emitter current i e ( ma ) 0 1200 1000 800 600 400 200 v cb =6v ta=25 ? c
4 composite transistors xn04683 z rb ?i e c re ?v ce c ob ?v cb p g ?i e nf ?i e characteristics charts of tr2 i c ?v ce i c ?i b i b ?v be 0.1 0.3 1 3 10 reverse transfer impedance z rb ( ? ) emitter current i e ( ma ) 0 120 100 80 60 40 20 v cb =6v f=2mhz ta=25 ? c 0.1 0.3 1 3 10 30 100 0 2.4 2.0 1.6 1.2 0.8 0.4 common emitter reverse transfer capacitance c re ( pf ) collector to emitter voltage v ce ( v ) i c =1ma f=10.7mhz ta=25 ? c 0 0.1 0.3 10 20 30 40 35 25 15 5 1 3 10 30 100 power gain pg ( db ) emitter current i e ( ma ) f=100mhz r g =50 ? ta=25 ? c v ce =10v 6v 0 0.1 0.3 12 10 8 6 4 2 1 3 10 30 100 noise figure nf ( db ) emitter current i e ( ma ) f=100mhz r g =50 ? ta=25 ? c v ce =6v, 10v 0 0 18 2 4 6 8 10 12 14 16 60 50 40 30 20 10 collector to emitter voltage v ce ( v ) collector current i c ( ma ) ta=25 ? c i b = 300 a 250 a 200 a 150 a 100 a 50 a 0 0 100 200 300 400 60 50 40 30 20 10 base current i b ( a ) collector current i c ( ma ) v ce = 5v ta=25 ? c 0 0 0.4 0.8 1.2 1.6 400 350 300 250 200 150 100 50 base to emitter voltage v be ( v ) base current i b ( a ) v ce = 5v ta=25 ? c 0 1.2 1.0 0.8 0.6 0.4 0.2 collector output capacitance c ob ( pf ) collector to base voltage v cb ( v ) 030 525 10 20 15 f=1mhz i e =0 ta=25 ? c
5 composite transistors xn04683 i c ?v be v ce(sat) ?i c h fe ?i c f t ?i e c ob ?v cb 0 0 2.0 1.6 1.2 0.8 0.4 240 200 160 120 80 40 base to emitter voltage v be ( v ) collector current i c ( ma ) v ce = 5v ta=75 ? c 25 ? c 25 ? c 0.001 0.003 1 3 0.01 0.03 0.1 0.3 1 3 10 10 30 100 300 1000 collector current i c ( ma ) collector to emitter saturation voltage v ce(sat) ( v ) i c /i b =10 ta=75 ? c 25 ? c 25 ? c 0 1 3 600 500 400 300 200 100 10 30 100 300 1000 forward current transfer ratio h fe collector current i c ( ma ) v ce = 10v ta=75 ? c 25 ? c 25 ? c 0 0.1 0.3 40 80 120 160 140 100 60 20 1 3 10 30 100 transition frequency f t ( mhz ) emitter current i e ( ma ) v cb = 10v ta=25 ? c 0 1 5 20 2 8 7 6 5 4 3 2 1 3 50 10 30 100 collector output capacitance c ob ( pf ) collector to base voltage v cb ( v ) f=1mhz i e =0 ta=25 ? c
please read the following notes before using the datasheets a. these materials are intended as a reference to assist customers with the selection of panasonic semiconductor products best suited to their applications. due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. b. panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. therefore, panasonic will not assume any liability for any damages arising from any errors etc. that may ap- pear in this material. c. these materials are solely intended for a customer's individual use. therefore, without the prior written approval of panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the internet or in any other way, is prohibited. request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese govern- ment if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative character- istics and applied circuit examples of the products. it does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) the products described in this material are intended to be used for standard applications or gen- eral electronic equipment (such as office equipment, communications equipment, measuring in- struments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. at the final stage of your design, purchas- ing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) when using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) no part of this material may be reprinted or reproduced by any means without written permission from our company. 2001 mar


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