document number: 53013 revision 14-may-03 www.vishay.com 2 s vishay sfernice for technical questions, contact sfer@vishay.com current sensing bondable chip resistors features ? low ohmic value down to 0.05 ? ? tolerance down to 1% ? stability ? low noise ? low tcr this thin film chip resistor fits applications as force balance scales, e beam deflection systems, switching power supplies, etc... all rely on current sensors to feed back and control the current. gold pads are compatible with thermosonic or ultrasonic bonding of gold and aluminium wires. ordering information dimensions in inches (millimeters) electrical specifications ohmic values and associated tolerance: 0.05 ? r < 0.2 ? ? 5% 0.2 ? r < 0.5 ? ? 2% 0.5 ? r < 1 ? ? 1% higher values and higher tolerances on request power dissipation at + 70c: sa: 0.5w sb: 2w sc: 6w temperature coefficient: ? 100ppm/c ? 50ppm/c on request noise: - 35db max. low ohmic value chip resistors are also available with solderable or weldable wraparound terminations. for standard sizes see our data sheet p document number: 53017 and ask us about performance. mechanical specifications substrate: alumina resistive element: ni cr glassivation: ta 2 o 5 bonding pads: gold backside metallization: on request ni au series power dissipation a b c sa 0.5w 1.5 1.5 0.2 sb 2w 3 3 0.4 sc 6w 5 5 0.5 dimensions environmental specifications operating temperature range: - 55c to + 125c storage temperature: - 55c to + 155c s a 100 or 25 ? 1% series type temperature coefficient ohmic value tolerance in ppm/c a k = ? 100ppm/c f = ? 1% b h = ? 50ppm/c g = ? 2% c on request j = ? 5% s = special 0. 4 a c c b
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