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1 ? fn6365.2 isl3179e, isl3180e high esd protected, +125 c, 40mbps, 3.3v, full fail-safe, rs-485/rs-422 transceivers intersil?s isl3179e and isl3180e are high esd protected (see table 1 below), 3.3v powered, single transceivers that meet both the rs-485 and rs-422 standards for balanced communication. each device has low bus currents (+220a/-150a), so it presents a ?1/5 unit load? to the rs-485 bus. this allows up to 160 transceivers on the network without violating the rs-485 specification?s 32 unit load maximum, and without using repeaters. receiver (rx) inputs feature a ?full fail-safe? design, which ensures a logic high rx output if rx inputs are floating, shorted, or terminated but undriven. the isl3180e is configured for fu ll duplex applications. the isl3179e half duplex version multiplexes the rx inputs and tx outputs to allow a transceiver with an output disable function in 8 ld packages. hot plug circuitry ensures that the tx and rx outputs remain in a high impedance state while the power supply stabilizes. features ? high esd protection on rs-485 i/o pins - isl3179e . . . . . . . . . . . . . . . . . . . . . 16.5kv iec61000 - isl3180e . . . . . . . . . . . . . . . . . . . . . . . . . . 12kv hbm - class 3 hbm esd level on all other pins . . . . . . . >9kv ? specified for +125c operation ? high data rates . . . . . . . . . . . . . . . . . . . . . . up to 40mbps ? 5v tolerant logic inputs ? 1/5 unit load allows up to 160 devices on the bus ? full fail-safe (open, shor ted, terminat ed/undriven) receiver ? hot plug - tx and rx outputs remain three-state during power-up ? low quiescent current . . . . . . . . . . . . . . . . . . 4ma (max) ? low current shutdown mode. . . . . . . . . . . . . . 1a (max) ? -7v to +12v common mode input voltage range ? three-state rx and tx outputs ? 16/16.5ns (max) tx/rx propagation delays; 1.5ns (max) skew ? operates from a single +3.3v supply (10% tolerance) ? current limiting and thermal shutdown for driver overload protection ? pb-free (rohs compliant) applications ? motor controller/position encoder systems ? factory automation ? field bus networks ? security networks ? building environmental control systems ? industrial/process control networks ordering information part number (note) part marking # temp. range (c) package (pb-free) pkg. dwg. # isl3179efbz* 3179 efbz -40 to +125 8 ld soic m8.15 isl3179efuz* 179fz -40 to +125 8 ld msop m8.118 isl3179efrz* 79fz -40 to +125 10 ld dfn l10.3x3c isl3179eibz* 3179 eibz -40 to +85 8 ld soic m8.15 isl3179eiuz* 179iz -40 to +85 8 ld msop m8.118 isl3179eirz* 79iz -40 to +85 10 ld dfn l10.3x3c ISL3180EIBZ* isl3180 eibz -40 to +85 14 ld soic m14.15 *add ?-t? suffix for tape and reel. please refer to tb347 for details on reel specifications note: these intersil pb-free plas tic packaged products employ special pb-free material sets; molding compounds/die attach materials and 100% matte tin plate plus anneal - e3 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering operations. intersil pb-free products are msl classified at pb-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std-020. table 1. summary of features part number half/full duplex data rate (mbps) rs-485 pin esd level hot plug? rx/tx enable? quiescent i cc (ma) low power shutdown? pin count isl3179e half 40 16.5kv iec61000 yes yes 2.6 yes 8, 10 isl3180e full 40 12kv hbm yes yes 2.6 yes 14 data sheet april 22, 2008 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright intersil americas inc. 2007, 2008. all rights reserved all other trademarks mentioned are the property of their respective owners.
2 fn6365.2 april 22, 2008 pinouts isl3179e (8 ld soic, msop) top view isl3179e (10 ld dfn) top view isl3180e (soic) top view ro re de di 1 2 3 4 8 7 6 5 v cc b/z a/y gnd d r 2 3 4 1 5 9 8 7 10 6 ro re de di nc v cc nc b/z a/y gnd nc ro re de di gnd gnd v cc nc a b z y nc 1 2 3 4 5 6 7 14 13 12 11 10 9 8 d r truth table transmitting inputs outputs re de di b/z a/y x1101 x1010 0 0 x high-z high-z 1 0 x high-z* high-z* note: *shutdown mode truth table receiving inputs output re de a-b ro 00 -0.05v 1 00 -0.2v 0 0 0 inputs open/shorted 1 1 1 x high-z 1 0 x high-z* note: *shutdown mode pin descriptions pin function ro receiver output: if a-b -50mv, ro is high; if a-b -200mv, ro is low; ro = high if a and b are unconnected (floati ng) or shorted, or connected to a terminated bus that is undriven. re receiver output enable. ro is enabled when re is low; ro is high impedance when re is high. if the rx enable function isn?t required, connect re directly to gnd. de driver output enable. the driver outputs, y and z, are enabled by bringing de high, and they are high impedance when de is lo w. if the tx enable function isn?t required, connect de to v cc through a 1k or greater resistor. di driver input. a low on di forces output y low and output z high. similarly, a high on di forces output y high and output z lo w. isl3179e, isl3180e
3 fn6365.2 april 22, 2008 gnd ground connection. a/y 16.5kv iec61000 esd protected rs-485/rs-422 level, non-inverting receiver input and non-inverting driver output. pin is an input (a) if de = 0; pin is an output (y) if de = 1. isl3179e only b/z 16.5kv iec61000 esd protected rs-485/rs-422 level, inverting receiver i nput and inverting driver output. pin is an input (b) if de = 0; pin is an output (z) if de = 1. isl3179e only a 12kv hbm esd protected rs-485/rs-422 level, non-inverting receiver input. isl3180e only b 12kv hbm esd protected rs-485/rs-422 level, inverting receiver input. isl3180e only y 12kv hbm esd protected rs-485/rs-422 level, non-inverting driver output. isl3180e only z 12kv hbm esd protected rs-485/rs-422 level, inverting driver output. isl3180e only v cc system power supply input (3.0v to 3.6v). nc no connection. typical operating circuit isl3179e isl3180e pin descriptions (continued) pin function 0.1 f + d r 7 6 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +3.3v 0.1 f + d r 6 7 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +3.3v r t r t (soic and msop pin numbers shown) 0.1 f + d r 12 11 10 9 14 2 3 4 5 6, 7 v cc gnd ro re de di a b y z +3.3v 0.1 f + d r 12 11 10 9 14 2 3 4 5 6, 7 v cc gnd ro re de di a b y z +3.3v r t r t (pin numbers for soic) isl3179e, isl3180e
4 fn6365.2 april 22, 2008 absolute maximum rati ngs thermal information v cc to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7v input voltages di, de, re . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 7v input/output voltages a, b, y, z, a/y, b/z . . . . . . . . . . . . . . . . . . . . . . . . . . . -9v to +13v ro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to (v cc +0.3v) short circuit duration y, z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . . . . . . . . . see specification table operating conditions temperature range isl3179ef . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40c to +125c isl3179ei, isl3180ei . . . . . . . . . . . . . . . . . . . . . .-40c to +85c thermal resistance (typical, note 1, 2) ja (c/w) jc (c/w) 8 ld soic package . . . . . . . . . . . . . . . 160 n/a 14 ld soic package . . . . . . . . . . . . . . 128 n/a 8 ld msop package . . . . . . . . . . . . . . 137 n/a 10 ld dfn package. . . . . . . . . . . . . . . 46 3.5 maximum junction temperature (plastic package) . . . . . . +150c maximum storage temperature range . . . . . . . . . .-65c to +150c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/pb-freereflow.asp caution: do not operate at or near the maximum ratings listed fo r extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. notes: 1. ja is measured with the component mounted on a high effective therma l conductivity (with direct attach for dfn) test board in fre e air. see tech brief tb379 for details. 2. for jc , the ?case temp? location is the center of the exposed metal pad on the package underside. electrical specifications test conditions: v cc = 3.0v to 3.6v; typicals are at v cc = 3.3v, t a = +25c. (note 3) parameter symbol test conditions temp (c) min (note 13) typ max (note 13) units dc characteristics driver differential v out v od r l = 100 (rs-422) (figure 1a), (note 12) full 2 2.3 - v r l = 54 (rs-485) (figure 1a) full 1.5 2.1 v cc v no load full - - v cc r l = 60 , -7v v cm 12v (figure 1b), (note 12) full 1.5 2 - v change in magnitude of driver differential v out for complementary output states v od r l = 54 or 100 (figure 1a) full - 0.01 0.2 v driver common-mode v out v oc r l = 54 or 100 (figure 1a) full - 2 2.5 v change in magnitude of driver common-mode v out for complementary output states v oc r l = 54 or 100 (figure 1a) full - 0.02 0.2 v logic input high voltage v ih di, de, re full 2 - - v logic input low voltage v il di, de, re full - - 0.8 v logic input current i in1 di = de = re = 0v or v cc full -2 - 2 a input current (a, b, a/y, b/z) i in2 de = 0v, v cc = 0v or 3.6v v in = 12v full - - 220 a v in = -7v full -160 - - a y or z output leakage current i oz de = 0v, -7v v y or v z 12v, isl3180e only full -40 - 40 a driver short-circuit current, v o = high or low i osd1 de = v cc , -7v v y or v z 12v (note 5) full - - 250 ma receiver differential threshold voltage v th -7v v cm 12v full -200 - -50 mv receiver input hysteresis v th v cm = 0v 25 - 28 - mv receiver output high voltage v oh i o = -12ma, v id = -50mv full v cc - 0.5 - - v receiver output low voltage v ol i o = +10ma, v id = -200mv full - - 0.4 v isl3179e, isl3180e
5 fn6365.2 april 22, 2008 receiver output low current i ol v ol = 1v, v id = -200mv full 25 - - ma three-state (high impedance) receiver output current i ozr 0.4v v o 2.4v full -1 0.015 1 a receiver input resistance r in -7v v cm 12v full 54 80 - k receiver short-circuit current i osr 0v v o v cc full 20 - 110 ma supply current no-load supply current (note 4) i cc di = de = 0v or v cc full - 2.6 4 ma shutdown supply current i shdn de = 0v, re = v cc , di = 0v or v cc full - 0.05 1 a esd performance rs-485 pins (a/y, b/z) isl3179e only iec61000-4-2, air-gap discharge method 25 - 16.5 - kv iec61000-4-2, contact discharge method 25 - 9 - kv human body model, from bus pins to gnd 25 - 16.5 - kv rs-485 pins (a, b, y, z) isl3180e only iec61000-4-2, air-gap discharge method 25 - 4 - kv iec61000-4-2, contact discharge method 25 - 5 - kv human body model, from bus pins to gnd 25 - 12 - kv all pins hbm, per mil-std-883 method 3015 25 - >9 - kv machine model 25 - >400 - v driver switching characteristics maximum data rate f max v od 1.5v, r d = 54 , c l = 100pf (figure 4) -40 to 85 40 60 - mbps 125 16 32 - mbps driver differential output delay t dd r d = 54 , c d = 50pf (figure 2) full - 11 16 ns prop delay part-to-part skew t skp-p r d = 54 , c d = 50pf (figure 2), (note 11) full - - 4 ns driver differential output skew t skew r d = 54 , c d = 50pf (figure 2) full - 0 1.5 ns driver differential rise or fall time t r , t f r d = 54 , c d = 50pf (figure 2) full - 4 7 ns driver enable to output high t zh r l = 110 , c l = 50pf, sw = gnd (figure 3), (note 6) full - 18 25 ns driver enable to output low t zl r l = 110 , c l = 50pf, sw = v cc (figure 3), (note 6) full - 16 25 ns driver disable from output high t hz r l = 110 , c l = 50pf, sw = gnd (figure 3), full - 15 25 ns driver disable from output low t lz r l = 110 , c l = 50pf, sw = v cc (figure 3), full - 18 25 ns time to shutdown t shdn (note 8) full 60 - 600 ns driver enable from shutdown to output high t zh(shdn) r l = 110 , c l = 50pf, sw = gnd (figure 3), (notes 8, 9) full - - 1000 ns driver enable from shutdown to output low t zl(shdn) r l = 110 , c l = 50pf, sw = v cc (figure 3), (notes 8, 9) full - - 1000 ns receiver switching characteristics maximum data rate f max v id = 1.5v full 40 60 - mbps receiver input to output delay t plh , t phl (figure 5) full - 10 16.5 ns prop delay part-to-part skew t skp-p (figure 5), (note 11) full - - 4 ns receiver skew | t plh - t phl |t skd (figure 5) full - 0 1.5 ns receiver enable to output high t zh r l = 1k , c l = 15pf, sw = gnd (figure 6), (note 7) full - 10 15 ns electrical specifications test conditions: v cc = 3.0v to 3.6v; typicals are at v cc = 3.3v, t a = +25c. (note 3) (continued) parameter symbol test conditions temp (c) min (note 13) typ max (note 13) units isl3179e, isl3180e
6 fn6365.2 april 22, 2008 receiver enable to output low t zl r l = 1k , c l = 15pf, sw = v cc (figure 6), (note 7) full - 11 15 ns receiver disable from output high t hz r l = 1k , c l = 15pf, sw = gnd (figure 6) full - 10 15 ns receiver disable from output low t lz r l = 1k , c l = 15pf, sw = v cc (figure 6) full - 10 15 ns time to shutdown t shdn (note 8) full 60 - 600 ns receiver enable from shutdown to output high t zh(shdn) r l = 1k , c l = 15pf, sw = gnd (figure 6), (notes 8, 10) full - - 1000 ns receiver enable from shutdown to output low t zl(shdn) r l = 1k , c l = 15pf, sw = v cc (figure 6), (notes 8, 10) full - - 1000 ns notes: 3. all currents into device pins are positive; all currents out of device pins are negative. all voltages are referenced to devi ce ground unless otherwise specified. 4. supply current specification is valid for loaded drivers when de = 0v. 5. applies to peak current. see ?typical perfor mance curves? on page 11 for more information. 6. because of the shutdown feature, keep re = 0 to prevent the device from entering shdn. 7. because of the shutdown feature, the re signal high time must be short enough (typically <100ns) to prevent the device from entering shdn. 8. these ic?s are put into shutdown by bringing re high and de low. if the inputs are in this state for less than 60ns, the parts are guaranteed not to enter shutdown. if the inputs are in this state for at least 700ns, the parts are guaranteed to have entered shutdown. see ? low power shutdown mode? on page 10. 9. keep re = v cc , and set the de signal low time >700ns to ensure that the device enters shdn. 10. set the re signal high time >700ns to ensure that the device enters shdn. 11. this is the part-to-part skew between any two units tested with identical test conditions (temperature, v cc , etc.). 12. v cc = 3.3v 5% 13. parameters with min and/or max limits are 100% tested at +25 c, unless otherwise specified. te mperature limits established b y characterization and are not production tested. test circuits and waveforms figure 1a. v od and v oc figure 1b. v od with common mode load figure 1. dc driver test circuits electrical specifications test conditions: v cc = 3.0v to 3.6v; typicals are at v cc = 3.3v, t a = +25c. (note 3) (continued) parameter symbol test conditions temp (c) min (note 13) typ max (note 13) units d de di v cc v od v oc r l /2 r l /2 z y d de di v cc v od 375 375 z y r l = 60 v cm -7v to +12v isl3179e, isl3180e
7 fn6365.2 april 22, 2008 figure 2a. test circuit figure 2b. measurement points figure 2. driver propagation delay and differential transition times figure 3a. test circuit figure 3b. measurement points figure 3. driver enable and disable times figure 4a. test circuit figure 4b. measurement points figure 4. driver data rate test circuits and waveforms (continued) d de di v cc signal generator c d r d z y out (z) 3v 0v 1.5v 1.5v v oh v ol out (y) t plh t phl diff out (y - z) t r +v od -v od 90% 90% t f 10% 10% di skew = |t plh - t phl | d de di z y v cc gnd sw parameter output re di sw t hz y/z x 1/0 gnd t lz y/z x 0/1 v cc t zh y/z 0 (note 6) 1/0 gnd t zl y/z 0 (note 6) 0/1 v cc t zh(shdn) y/z 1 (note 9) 1/0 gnd t zl(shdn) y/z 1 (note 9) 0/1 v cc signal generator 110 50pf out (y, z) 3v 0v 1.5v 1.5v v oh 0v v oh - 0.5v t hz out (y, z) v cc v ol v ol + 0.5v t lz de output high output low t zl , t zl(shdn) t zh , t zh(shdn) (note 8) 50% 50% (note 8) (note 8) d de di v cc signal generator z y v od + - 54 c l c l 3v 0v diff out (y - z) +v od -v od di 0v isl3179e, isl3180e
8 fn6365.2 april 22, 2008 figure 5a. test circuit figure 5b. measurement points figure 5. receiver propagation delay figure 6a. test circuit figure 6b. measurement points figure 6. receiver enable and disable times test circuits and waveforms (continued) signal generator r ro re a b +1.5v 15pf ro +3v 0v t plh 1.5v 1.5v v cc 0v 1.7v 1.7v t phl a 1k v cc gnd sw parameter de a sw t hz 0 +1.5v gnd t lz 0 -1.5v v cc t zh (note 7) 0 +1.5v gnd t zl (note 7) 0 -1.5v v cc t zh(shdn) (note 10) 0 +1.5v gnd t zl(shdn) (note 10) 0 -1.5v v cc signal generator r ro re a b gnd 15pf ro 3v 0v 1.5v 1.5v v oh 0v 1.5v v oh - 0.5v t hz ro v cc v ol 1.5v v ol + 0.5v t lz re output high output low t zl , t zl(shdn) t zh , t zh(shdn) (note 8) (note 8) (note 8) isl3179e, isl3180e
9 fn6365.2 april 22, 2008 application information rs-485 and rs-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. rs-422 is a subset of rs-485, so rs-485 transceivers are also rs-422 compliant. rs-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. rs-485 is a true multipoint standard, which allows up to 32 one unit load devices (any mix of drivers and receivers) on each bus. to allow for multipoint operation, the rs-485 spec requires that drivers must handle bus contention without sustaining any damage. another important advantage of rs-485 is the extended common mode range (cmr), which specifies that the driver outputs and receiver inputs withstand signals that range from +12v to -7v. rs-422 and rs-485 are intended for runs as long as 4000? (~1200m), so the wide cmr is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. receiver (rx) features this transceiver utilizes a di fferential input receiver for maximum noise immunity and common mode rejection. input sensitivity is 200mv, as re quired by the rs-422 and rs-485 specifications. receiver inputs function with common mode voltages as great as +9/-7v outside the power supplies (i.e., +12v and -7v), making them ideal for long networks, or industrial environments, where induced voltages are a realistic concern. the receiver input resistance of 50k surpasses the rs-422 specification of 4k , and is 5x the rs-485 ?unit load? (ul) requirement of 12k minimum. thus, the isl3179e is known as a ?one-fifth ul? transceiver, and there can be up to 160 devices on the rs-485 bus while still complying with the rs-485 loading specification. the receiver is a ?full fail-sa fe? version that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled (terminated/undriven). rx outputs deliver large low stat e currents (typically 28ma at v ol = 1v) to ease the design of optically coupled isolated networks. receivers easily meet the 40mbps data rate supported by the driver, and the receiver output is tri-statable via the active low re input. driver (tx) features the rs-485/rs-422 driver is a di fferential output device that delivers at least 1.5v across a 54 load (rs-485), and at least 2v across a 100 load (rs-422). the drivers feature low propagation delay skew to maximize bit width, and to minimize emi. outputs of the drivers are not slew rate limited, so faster output transition times allow data rates of at least 40mbps. driver outputs are tri-statable via the active high de input. for parallel applications, bit-to-bit skews between any two transmitter and receiver pair s are guaranteed to be no worse than 8ns (4ns max for any two tx, 4ns max for any two rx). esd protection all pins on the isl3179e and isl3180e include class 3 (>9kv) human body model (hbm) esd protection structures, but the rs-485 pins (driver outputs and receiver inputs) incorporate advanced st ructures allowing them to survive esd events in excess of 16.5kv hbm (isl3179e) or 12kv hbm (isl3180e), and 16.5kv (isl3179e) or 4kv (isl3180e) iec61000-4 -2. the rs-485 pins are particularly vulnerable to esd strikes because they typically connect to an exposed port on the exterior of the finished product. simply t ouching the port pins, or connecting a cable, can caus e an esd event that might destroy unprotected ics. these new esd structures protect the device whether or not it is powered up, and without degrading the rs-485 common mode range of -7v to +12v. this built-in esd protection eliminates the need for board level protection st ructures (e.g., transient suppression diodes), and th e associated, undesirable capacitive load they present. iec61000-4-2 testing the iec61000 test method applies to finished equipment, rather than to an individual ic. therefore, the pins most likely to suffer an esd event are t hose that are ex posed to the outside world (the rs-485 pins in this case), and the ic is tested in its typical application configuration (power applied) rather than testing each pi n-to-pin combination. the iec61000 standard?s lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the hbm test. the extra esd protection built into the isl3179e?s rs-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level pr otection on the rs-485 port. air-gap discharge test method for this test method, a charged probe tip moves toward the ic pin until the voltage arcs to it. the current waveform delivered to the ic pin depends on approach speed, humidity, temperature, etc., so it is more difficult to obtain repeatable results. the isl3179e rs-485 pins withstand 16.5kv air-gap discharges, while the isl3180e?s rs-485 pins withstand 4kv. contact discharge test method during the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. the result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages isl3179e, isl3180e
10 fn6365.2 april 22, 2008 higher than 9kv. the rs-485 pins of the isl3179e survive 9kv contact discharges, while the isl3180e?s rs-485 pins withstand 5kv. hot plug function when a piece of equipment powers up, there is a period of time where the processor or as ic driving the rs-485 control lines (de, re ) is unable to ensure that the rs-485 tx and rx outputs are kept disabled. if the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. to avoid this scenario, the isl3179e and isl3180e incorporate a ?hot plug? function. circuitry monitoring v cc ensures that, during power up and power down, the tx and rx outputs rema in disabled, regardless of the state of de and re , if v cc is less than ~2.4v. this gives the processor/asic a chance to st abilize and drive the rs-485 control lines to the proper states. data rate, cables , and terminations rs-485/rs-422 are intended for network lengths up to 4000?, but the maximu m system data rate decreases as the transmission length increases. devices operating at 40mbps are limited to lengths less than 100?. twisted pair is the cable of choice for rs-485/rs-422 networks. twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receiver in this ic. proper termination is imperative to minimize reflections. in point-to-point, or point-to-multi point (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120 ) at the end farthest from the driver. in multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. stubs connecting a transceiver to the main cable should be kept as short as possible. the isl3179e, and isl3180e may also be used at slower data rates over longer cables, but there are some limitations. the rx is optimized for high speed operation, so its output may glitch if the rx input differential transition times are too slow. keeping the transition times below 500ns, which equates to the tx driving a 1000? (305m) cat 5 cable, yields excellent performance over the full operating temperature range. built-in driver overload protection as stated previously, the rs-4 85 specification requires that drivers survive worst case bus contentions undamaged. these transmitters meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. the driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the rs-485 specificat ion, even at the common mode voltage range extremes. in the event of a major short circuit condition, the device also includes a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. this elimi nates the power dissipation, allowing the die to cool. the drivers automatically reenable after the die temperature drops about +15c. if the contention persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. receivers stay operational during thermal shutdown. low power shutdown mode this bicmos transceiver uses a fraction of the power required by their bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent i cc to a 50na trickle. it enters shutdown whenever the receiver and driver are simultaneously disabled (re =v cc and de = gnd) for a period of at least 600ns. disabling both the driver and the receiver for le ss than 60ns guarantees that the transceiver will not enter shutdown. note that receiver and driver enable times increase when the transceiver enables from shutdown. refer to notes 6, 7, 8, 9 and 10, at the end of the ?electrical specification? table on page 6, for more information. figure 7. hot plug performance (isl3179e) vs isl83485 without hot plug circuitry time (40 s/div) v cc receiver output (v) driver y output (v) 2 4 2 4 v cc (v) r l = 1k ro 0 2 4 0 0 a / y r l = 1k 2.3v 2.5v de, di = v cc isl3179e re = gnd isl3179e isl3179e, isl3180e
11 fn6365.2 april 22, 2008 typical performance curves v cc = 3.3v, t a = +25c; unless otherwise specified figure 8. driver output current vs differential output voltage figure 9. driver differential output voltage vs temperature figure 10. driver output current vs short circuit voltage figure 11. supply current vs temperature figure 12. driver differential propagation delay vs temperature figure 13. driver differential skew vs temperature 0 10 20 30 40 50 60 70 80 90 0 0.5 1.0 1.5 2.0 2.5 3.0 differential output voltage (v) driver output current (ma) +25c +85c r d = 54 r d = 100 +125c 3.3 r d = 33 1.90 1.95 2.00 2.05 2.10 2.15 2.20 2.25 2.30 2.35 2.40 -40 -15 10 35 60 85 110 temperature (c) differential output voltage (v) r d = 54 r d = 100 125 output voltage (v) -7 -6 -4 -2 0 2 4 6 8 10 12 output current (ma) y or z = high y or z = low -100 -50 0 50 100 150 2.10 2.15 2.20 2.25 2.30 2.35 2.40 -40 -15 10 35 60 85 110 125 temperature (c) i cc (ma) de = v cc , re = x or de = gnd, re = gnd 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 -40 -15 10 35 60 85 110 125 temperature (c) propagation delay (ns) t plh t phl 0 0.05 0.10 0.15 0.20 0.25 -40 -15 10 35 60 85 110 125 temperature (c) skew (ns) |t plh - t phl | isl3179e, isl3180e
12 fn6365.2 april 22, 2008 figure 14. driver and receiver waveforms figure 15. driver and receiver waveforms figure 16. driver and receiver waveforms driving 100 ? (31m) of cat5 cable (double terminated with 120 ) figure 17. driver and receiver waveforms driving 500? (152m) of cat5 cable (double terminated with 120 ) figure 18. receiver output current vs receiver output voltage typical performance curves v cc = 3.3v, t a = +25c; unless otherwise specified (continued) time (5ns / div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro y-z -3 2 3 -1 0 1 -2 time (5ns / div) receiver output (v) r diff = 54 , c d = 50pf 0 5 driver output (v) 0 5 driver input (v) di ro -3 -2 -1 0 1 2 3 y-z time (10ns/div) -3.0 receiver output (v) 1.5 3.0 -1.5 0 0 5.0 receiver input (v) 0 5 driver input (v) di = 40mbps ro driver+cable delay (~160ns) a - b time (200ns/div) -3.0 receiver output (v) 1.5 3.0 -1.5 0 a - b 0 5.0 receiver input (v) 0 5 driver input (v) ro driver+cable delay (~720ns) di = 2mbps 0 10 20 30 40 50 0 0.5 1.0 1.5 2.0 2.5 3.0 receiver output voltage (v) receiver output current (ma) v oh +25c v oh +85c v ol +25c v ol +85c v oh +125c v ol +125c 3.3 60 isl3179e, isl3180e
13 fn6365.2 april 22, 2008 die characteristics substrate and dfn thermal pad potential (powered up): gnd transistor count: 768 process: si gate bicmos isl3179e, isl3180e
14 fn6365.2 april 22, 2008 mini small outline pl astic packages (msop) notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-187ba. 2. dimensioning and tolerancing per ansi y14.5m - 1994. 3. dimension ?d? does not include mold flash, protrusions or gate burrs and are measured at datum plane. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not includ e interlead flash or protrusions and are measured at datum plane. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. formed leads shall be planar wi th respect to one another within 0.10mm (0.004) at seating plane. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimension at maximum ma terial condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. datums and to be determined at datum plane . 11. controlling dimension: millimeter. converted inch dimen- sions are for reference only. l 0.25 (0.010) l1 r1 r 4x 4x gauge plane seating plane e e1 n 12 top view index area -c- -b- 0.20 (0.008) a b c seating plane 0.20 (0.008) c 0.10 (0.004) c -a- -h- side view b e d a a1 a2 -b- end view 0.20 (0.008) c d e 1 c l c a - h - -a - - b - - h - m8.118 (jedec mo-187aa) 8 lead mini small outline plastic package symbol inches millimeters notes min max min max a 0.037 0.043 0.94 1.10 - a1 0.002 0.006 0.05 0.15 - a2 0.030 0.037 0.75 0.95 - b 0.010 0.014 0.25 0.36 9 c 0.004 0.008 0.09 0.20 - d 0.116 0.120 2.95 3.05 3 e1 0.116 0.120 2.95 3.05 4 e 0.026 bsc 0.65 bsc - e 0.187 0.199 4.75 5.05 - l 0.016 0.028 0.40 0.70 6 l1 0.037 ref 0.95 ref - n8 87 r 0.003 - 0.07 - - r1 0.003 - 0.07 - - 0 5 o 15 o 5 o 15 o - 0 o 6 o 0 o 6 o - rev. 2 01/03 isl3179e, isl3180e
15 fn6365.2 april 22, 2008 isl3179e, isl3180e dual flat no-lead plastic package (dfn) // nx (b) section "c-c" for odd terminal/side e cc 5 c l terminal tip (a1) bottom view a 6 area index c c 0.10 0.08 side view 0.10 2x e a b c 0.10 d top view cb 2x 6 8 area index nx l e2 e2/2 ref. e n (nd-1)xe (datum a) (datum b) 5 0.10 8 7 d2 b a c n-1 12 plane seating c a a3 nx b d2/2 nx k 9 l m l10.3x3c 10 lead dual flat no-lead plastic package symbol millimeters notes min nominal max a 0.85 0.90 0.95 - a1 - - 0.05 - a3 0.20 ref - b 0.20 0.25 0.30 5, 8 d 3.00 bsc - d2 2.33 2.38 2.43 7, 8 e 3.00 bsc - e2 1.59 1.64 1.69 7, 8 e 0.50 bsc - k0.20 - - - l 0.35 0.40 0.45 8 n102 nd 5 3 rev. 1 4/06 notes: 1. dimensioning and tolerancing conform to asme y14.5-1994. 2. n is the number of terminals. 3. nd refers to the number of terminals on d. 4. all dimensions are in millim eters. angles are in degrees. 5. dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. the configuration of the pin #1 identifier is optional, but must be located within the zone indicated. the pin #1 identifier may be either a mold or mark feature. 7. dimensions d2 and e2 are fo r the exposed pads which provide improved electrical and thermal performance. 8. nominal dimensions are provided to assist with pcb land pattern design efforts, see intersil technical brief tb389. 9. compliant to jedec mo-229-weed-3 except for dimensions e2 & d2.
16 fn6365.2 april 22, 2008 small outline plast ic packages (soic) index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 c h 0.25(0.010) b m m notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. m8.15 (jedec ms-012-aa issue c) 8 lead narrow body small outline plastic package symbol inches millimeters notes min max min max a 0.0532 0.0688 1.35 1.75 - a1 0.0040 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 9 c 0.0075 0.0098 0.19 0.25 - d 0.1890 0.1968 4.80 5.00 3 e 0.1497 0.1574 3.80 4.00 4 e 0.050 bsc 1.27 bsc - h 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 l 0.016 0.050 0.40 1.27 6 n8 87 0 8 0 8 - rev. 1 6/05 isl3179e, isl3180e
17 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6365.2 april 22, 2008 isl3179e, isl3180e small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include inte rlead flash or protrusions. interlead flash and protrusions shall not ex ceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m14.15 (jedec ms-012-ab issue c) 14 lead narrow body small outline plastic package symbol inches millimeters notes min max min max a 0.0532 0.0688 1.35 1.75 - a1 0.0040 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 9 c 0.0075 0.0098 0.19 0.25 - d 0.3367 0.3444 8.55 8.75 3 e 0.1497 0.1574 3.80 4.00 4 e 0.050 bsc 1.27 bsc - h 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 l 0.016 0.050 0.40 1.27 6 n14 147 0 o 8 o 0 o 8 o - rev. 0 12/93

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