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revisions ltr description date (yr -mo -da) approved c added case outline z. corrected the true dimensioning table feature for case outlines u, x, and y. -sld 98-08-13 k.a. cottongim d added case outline 9. added vendor cage 0eu86 for device types 01 through 03 in the standard microcircuit drawing source approval bulletin. -sld 00-04-19 raymond l. monnin rev sheet rev d d d d d d d d d d d d d d sheet 15 16 17 18 19 20 21 22 23 24 25 26 27 28 rev status rev d d d d d d d d d d d d d d of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by gary zahn defense supply center columbus standard microcircuit drawing checked by michael c. jones columbus, ohio 43216 approved by kendall a. cottongim microcircuit, hybrid, memory, digital, 32k x 32-bit, electrically erasable and programmable read only memory this drawing is available for use by all departments and agencies of the department of defense drawing approval date 94-08-26 amsc n/a revision level d size a cage code 67268 5962 -94614 sheet 1 of 28 dscc form 2233 apr 97 5962 -e175-00 distribution statement a . approved for public release; distribution is unlimited.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing documents five product assurance classes, class d (lowest reliability), class e, (exceptions), class g (lowered high reliability), class h (high reliability), and class k, (highest reliability) and a choice of case outlines and lead finishes which are available and are reflected in the part or identifying number (pin). when available, a choice of radiation hardness assurance levels are reflected in the pin. 1.2 pin . the pin shall be as shown in the following example: 5962 - 94614 01 h m x ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? federal rha device device case lead stock class designator type cla ss outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) \ / (see 1.2.3) \/ drawing number 1.2.1 radiation hardness assurance (rha) designator . rha marked devices shall meet the mil-prf-38534 specified rha levels and shall be marked with the appropriate rha designator. a dash (-) indicates a non-rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit function access time 01 we32k32-150q, as8e32k32q-150/883c eeprom, 32k x 32-bit 150 ns 02 we32k32-120q, as8e32k32q-120 /883c eeprom, 32k x 32-bit 120 ns 03 we32k32-90q, as8e32k32q-90/883c eeprom, 32k x 32-bit 90 ns 1.2.3 device class designator . this device class designator shall be a single letter identifying the product assurance level as follows: device class device performance documentation d, e, g, h, or k certification and qualification to mil-prf-38534 1.2.4 case outline(s) . the case outline(s) are as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style m see figure 1 68 ceramic, dual cavity, quad flatpack u see figure 1 66 1.075", hex-in-line, single cavity, with standoffs x see figure 1 66 hex-in-line, single cavity, with standoffs y 1 / see figure 1 66 hex-in-line, single cavity, withou t standoffs z see figure 1 68 co-fired ceramic, single cavity, ultra low profile, quad flatpack 9 see figure 1 68 co-fired ceramic, single cavity, quad flatpack 1.2.5 lead finish . the lead finish shall be as specified in mil-prf-38534. 1 / the case outline y is inactive for new design.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 3 dscc form 2234 apr 97 1.3 absolute maximum ratings . 1 / supply voltage range (v cc ) ................................ ........................... -0.6 v dc to +6.25 v dc input voltage range ................................ ................................ ......... -0.6 v dc to +6.25 v dc power dissipation (p d ) ................................ ................................ .... 1.5 w storage temperature ra nge ................................ ............................ -65 c to +150 c lead temperature (soldering, 10 seconds) ................................ .... +300 c thermal resistance junction-to-case ( q jc ): case outlines m and z ................................ ................................ 11.3 c/w case outlines u, x, and y ................................ ........................... 2.8 c/w case outline 9 ................................ ................................ ............. 4.57 c/w data retention ................................ ................................ ................. 10 years minimum endu rance ................................ ................................ ...................... 10,000 cycles minimum 1.4 recommended operating conditions . supply voltage range (v cc ) ................................ ............................ +4.5 v dc to +5.5 v dc input low voltage range (v il ) ................................ .......................... -0.5 v dc to +0.8 v dc input high voltage range (v ih ) ................................ ........................ +2.0 v dc to v cc + 0.3 v dc output vo ltage, high minimum (v oh ) ................................ ............. +2.4 v dc output voltage, low maximum (v ol ) ................................ ............... +0.45 v dc case operating temperature range (t c ) ................................ ......... -55 c to +125 c 2. applicable documents 2.1 government specification, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of these documents are those listed in the issue of the department of defense index of specifications and standards (dodiss) and supplement thereto, cited in the solitation. specification department of defense mil-prf-38534 - hybrid microcircuits, general specification for. standards department of defense mil-std-883 - test method standard microcircuits. mil-std-1835 - interface standard for microcircuit case outlines. handbooks department of defense mil-hdbk-103 - list of standard microcircuit drawings (smd's). mil-hdbk-780 - standard microcircuit drawings. (unless otherwise indicated, copies of the specification, standards, and handbook are available from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 1 / stresses above the absolute maximum ratings may cause permanent damage to the device. extended operation at the maximum levels may degrade performance and affect reliability.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 4 dscc form 2234 apr 97 2.2 order of precedence . in the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements . the individual item performance requirements for device classes d, e, g, h, and k shall be in accordance with mil-prf-38534. compliance with mil-prf-38534 may include the performance of all tests herein or as designated in the device manufacturer's quality management (qm) plan or as designated for the applicable device class. therefore, the tests and inspections herein may not be performed for the applicable device class (see mil-prf-38534). furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform them. however, the performance requirements as defined in mil-prf-38534 shall be met for the applicable device class. 3.2 design, construction, and physical dimensions . the design, construction, and physical dimensions shall be as specified in mil-prf-38534 and herein. 3.2.1 case outline(s) . the case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 terminal connections . the terminal connections shall be as specified on figure 2. 3.2.3 truth table(s) . the truth table(s) shall be as specified on figure 3. 3.2.4 timing diagram(s) . the timing diagram(s) shall be as specified on figure 4, 5, 6, and 7. 3.2.5 block diagram . the block diagram shall be as specified on figure 8 . 3.2.6 output test circuit . the output test circuit shall be as specified on figure 9 . 3.3 electrical performance characteristics . unless otherwise specified herein, the electrical performance characteristics are as specified in table i and shall apply over the full specified operating temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in table ii. the electrical tests for each subgroup are defined in table i. 3.5 programming procedure . the programming procedure shall be as specified by the manufacturer and shall be available upon request. 3.6 marking of device(s) . marking of device(s) shall be in accordance with mil-prf-38534. the device shall be marked with the pin listed in 1.2 herein. in addition, the manufacturer's vendor similar pin may also be marked. 3.7 data . in addition to the general performance requirements of mil-prf-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group a lot sample, for each device type listed herein. also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. this data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (dscc-va) upon request. 3.8 certificate of compliance . a certificate of compliance shall be required from a manufacturer in order to supply to this drawing. the certificate of compliance (original copy) submitted to dscc-va shall affirm that the manufacturer's product meets the performance requirements of mil-prf-38534 and herein. 3.9 certificate of conformance . a certificate of conformance as required in mil-prf-38534 shall be provided with each lot of microcircuits delivered to this drawing. 3.10 endurance . a reprogrammability test shall be completed as part of the vendor's reliability monitors. this reprogrammability test shall be done for the initial characterization and after any design process changes which may affect the reprogrammability of the device. the methods and procedures may be vendor specific, but shall guarantee the number of program/erase cycles listed in section 1.3 herein over the full military temperature range. the vendor's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 5 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions 1 / -55 c t c +125 c +4.5 v dc v cc +5.5 v dc unless otherwise specified group a subgroups device type limits unit min ma x dc parameters supply current i cc cs = v il , oe = we = v ih , i out = 0 ma, v cc = 5.5 v dc, a0 through a14 and d0 through d31 change at 5 mhz cmos levels. 1, 2, 3 01 02 03 150 200 250 ma standby current i sb cs = oe = v ih , i out = 0 ma, v cc = 5.5 v dc, a0 through a14 and d0 through d31 change at 5 mhz cmos levels. 1, 2, 3 all 2.5 ma input leakage current i li v in = v ss or v cc 1, 2, 3 all 10 m a output leakage current i lo v out = v ss or v cc , cs = v ih 1, 2, 3 all 10 m a output low voltage v ol i ol = 2.1 ma, v cc = +4.5 v 1, 2, 3 all 0.45 v output high voltage v oh i oh = -400 m a, v cc = +4.5 v 1, 2, 3 all 2.4 v functional testing functional tests see 4.3.1c 7, 8a, 8b dynamic characteristics a0 - a14 2 / oe capacitance c ad c oe v in = 0 v, f = 1.0 mhz, t a = +25 c 4 all 50 pf cs1-4 capacitance 2 / c cs v in = 0 v, f = 1.0 mhz, t a = +25 c 4 all 20 pf we1-4 capacitance 2 / c we v in = 0 v, f = 1.0 mhz, t a = +25 c 4 all 20 pf i/o0-i/o31 capacitance 2 / c i/o v i/o = 0 v, f = 1.0 mhz, t a = +25 c 4 all 20 pf see footnotes at end of table.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 6 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / -55 c t c +125 c +4.5 v dc v cc +5.5 v dc unless otherwise specified group a subgroups device type limits unit min max read cycle ac timing characteristics read cycle time t rc see figure 4 9,10,11 01 02 03 150 120 90 ns address access time t acc see figure 4 9, 10, 11 01 02 03 150 120 90 ns chip select access time t acs see figure 4 9, 10, 11 01 02 03 150 120 90 ns output h old fro m address change oe or cs t oh see figure 4 9, 10, 11 all 0 ns output enable to output valid t oe see figure 4 9, 10, 11 01 02 03 70 60 50 ns chip select or output enable to output high z 2 / t df see figure 4 9, 10, 11 01 02 03 70 60 50 ns byte write ac timing characteristics address setup time t as see figure 5 9, 10, 11 all 0 ns 01 ,02 150 write pulse width t wp see figure 5 9, 10, 11 03 100 ns chip select setup time t cs see figure 5 9, 10, 11 all 0 ns 01, 02 100 address hold time t ah see figure 5 9, 10, 11 03 50 ns see footnotes at end of table.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 7 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / -55 c t c +125 c +4.5 v dc v cc +5.5 v dc unless otherwise specified group a subgroups device type limits unit min max byte write ac timing characteristics - continued 01, 02 10 output enable setup time t oes see figure 5 9, 10, 11 03 4 ns 01, 02 10 data hold time t dh see figure 5 9, 10, 11 03 0 ns output enable hold time t oeh see figure 5 9, 10, 11 all 10 ns 01, 02 100 data setup time t ds see figure 5 9, 10, 11 03 50 ns chip select hold time t csh see figure 5 9, 10, 11 all 0 ns write pulse width high t wph see figure 5 9, 10, 11 all 50 ns write cycle time t wc see figure 5 9, 10, 11 all 10 ms page mode write ac timing characteristics 01, 02 100 data setup time t ds see figure 6 9, 10, 11 03 50 ns 01, 02 10 data hold time t dh see figure 6 9, 10, 11 03 0 ns 01, 02 150 write pulse width t wp see figure 6 9, 10, 11 03 100 ns see footnotes at end of table.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 8 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / -55 c t c +125 c +4.5 v dc v cc +5.5 v dc unless otherwise specified group a subgroups device type limits unit min max page mode write ac timing characteristics - continued byte load cycle time t blc see figure 6 9, 10, 11 all 150 m s write pulse width high t wph see figure 6 9, 10, 11 all 50 ns write cycle time t wc see figure 6 9, 10, 11 all 10 ms data polling ac timing characteristics data hold time t dh see figure 7 9, 10, 11 all 10 ns output enable hold time t oeh see figure 7 9, 10, 11 all 10 ns output enable to output delay t oe see figure 7 9, 10, 11 all 100 ns write recovery time t wr see figure 7 9, 10, 11 all 0 ns 1 / unless otherwise specified: the dc test conditions are as follows: input low voltage, v il = 0.3 v. input high voltage, v ih = v cc - 0.3 v. the ac test conditions are as follows: input pulse levels: v il = 0 v and v ih = 3.0 v. input rise and fall times: 5 nanoseconds. input and output timing reference levels: 1.5 v. 2 / guaranteed by design, but not tested.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 9 dscc form 2234 apr 97 case outline m. figure 1. case outline(s) .
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 10 dscc form 2234 apr 97 case outline m - continued. symbol millimeters inches min max min max a 4.01 5.10 .158 .200 a1 3.91 4.72 .154 .186 a2 0.13 0.38 .005 .015 b 0.33 0.43 .013 .017 c 0.23 0.30 .009 .012 b 0.25 ref .010 ref d/e 20.3 bsc .800 bsc d1/e1 22.10 22.61 .870 .890 d2/e2 24.89 25.40 .980 1.000 d3/e3 23.77 24.28 .936 .956 e 1.27 bsc .050 bsc r 0.13 .005 l1 0.89 1.14 .035 .045 notes: 1. the u.s. preferred system of measurement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-p ound units shall rule. 2. pin numbers are for reference only. 3. case outline m is a dual cavity package. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 11 dscc form 2234 apr 97 case outlines u and x. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 12 dscc form 2234 apr 97 case outline u only - continued. symbol millimeters inches min max min max a 3.43 4.34 .135 .171 a1 0.64 0.89 .025 .035 f b 0.41 0.51 .016 .020 f b1 1.14 1.40 .045 .055 f b2 1.65 1.91 .065 .075 d/e 27.05 27.56 1.065 1.085 d1/e1 25.40 bsc 1.000 bsc d2 15.24 bsc .600 bsc d3 25.90 26.92 1.020 1.060 e 2.54 bsc .100 bsc l 3.35 3.94 .132 .155 notes: 1. the u.s. preferred system of measurement is t he metric si. this item was designed using inch-pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin 1 is identified by a 0.070 square pad. 3. pin numbers are for reference only. figure 1. case outlines - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 13 dscc form 2234 apr 97 case outline x only - continued. symbol millimeters inches min max min max a 5.08 6.22 .200 .245 a1 0.64 0.89 .025 .035 f b 0.41 0.51 .016 .020 f b1 1.14 1.40 .045 .055 f b2 1.65 1.91 .065 .075 d/e 29.72 30.48 1.170 1.200 d1/e1 25.40 bsc 1.000 bsc d2 15.24 bsc .600 bsc d3 28.96 29.21 1.140 1.150 e 2.54 bsc .100 bsc l 3.68 3.94 .145 .155 notes: 1. the u.s. preferred system of measurement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin 1 is identified by a 0.070 square pad. 3. pin numbers are for reference only. figure 1. case outlines - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 14 dscc form 2234 apr 97 case outline y. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 15 dscc form 2234 apr 97 case outline y - continued. symbol millimeters inches min max min max a 4.69 5.84 .185 .230 f b 0.41 0.51 .016 .020 f b1 0.76 ref .030 ref f b2 1.65 1.91 .065 .075 d/e 29.72 30.48 1.170 1.200 d1/e1 25.40 bsc 1.000 bsc d2 15.24 bsc .600 bsc d3 28.96 29.21 1.140 1.150 e 2.54 bsc .100 bsc l 4.19 4.69 .165 .185 notes: 1. the u.s. preferred system of measurement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin 1 is identified by a 0.070 square pad. 3. pin numbers are for reference only. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 16 dscc form 2234 apr 97 case outline z. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 17 dscc form 2234 apr 97 case outline z - continued. symbol millimeters inches min max min max a 3.56 .140 a2 0.36 0.71 .014 .028 b 0.33 0.43 .013 .017 c 0.23 0.30 .009 .012 d/e 20.32 bsc .800 bsc d1/e1 22.10 22.61 .870 .890 d2/e2 24.89 25.35 .980 1.000 e 1.27 typ .050 typ r 0.13 min .005 min l1 0.89 1.14 .035 .045 notes: 1. the u.s. preferred system of measurement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin numbers are for reference only. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 18 dscc form 2234 apr 97 case outline 9. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 19 dscc form 2234 apr 97 case outline 9 - continued. symbol millimeters inches min max min max a 3.56 .140 a1 2.79 .110 a2 0.46 0.76 .018 .030 b 0.33 0.43 .013 .017 c 0.15 0.25 .006 .010 d/e 20.32 typ .800 typ d1/e1 23.65 24.10 .931 .949 d2/e2 25.15 25.40 .990 1.000 e 1.27 typ .050 typ l1 0.51 1.14 .020 .045 notes: 1. the u.s. preferred system of measurement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-po und units shall rule. 2. pin numbers are for reference only. figure 1. case outlines - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 20 dscc form 2234 apr 97 device types all device types all device types all device types all case outlines m, z, 9 case outlines m, z, 9 case outlines m, z, 9 case outlines m, z, 9 terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol 1 gnd 18 gnd 35 oe 52 gnd 2 cs3 19 i/o8 36 cs2 53 i/o23 3 a5 20 i/o9 37 nc 54 i/o22 4 a4 21 i/o10 38 we2 55 i/o21 5 a3 22 i/o11 39 we3 56 i/o20 6 a2 23 i/o12 40 we4 57 i/o19 7 a1 24 i/o13 41 nc 58 i/o18 8 a0 25 i/o14 42 nc 59 i/o17 9 nc 26 i/o15 43 nc 60 i/o16 10 i/o0 27 v cc 44 i/o31 61 v cc 11 i/o1 28 a11 45 i/o30 62 a10 12 i/o2 29 a12 46 i/o29 63 a9 13 i/o3 30 a13 47 i/o28 64 a8 14 i/o4 31 a14 48 i/o27 65 a7 15 i/o5 32 nc 49 i/o26 66 a6 16 i/o6 33 nc 50 i/o25 67 we1 17 i/o7 34 cs1 51 i/o24 68 cs4 note: 1. nc is a no connect. figure 2. terminal connections .
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 21 dscc form 2234 apr 97 device type all device type all device type all device type all case outlines u,x,y case outlines u,x,y case outlines u,x,y case outlines u,x,y terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol 1 i/o8 18 a12 35 i/o25 52 we3 2 i/o9 19 v cc 36 i/o26 53 cs3 3 i/o10 20 cs1 37 a6 54 gnd 4 a13 21 nc 38 a7 55 i/o19 5 a14 22 i/03 39 nc 56 i/o31 6 nc 23 i/015 40 a8 57 i/o30 7 nc 24 i/o14 41 a9 58 i/o29 8 nc 25 i/o13 42 i/o16 59 i/o28 9 i/o0 26 i/o12 43 i/o17 60 a0 10 i/o1 27 oe 44 i/o18 61 a1 11 i/o2 28 nc 45 v cc 62 a2 12 we2 29 we1 46 cs4 63 i/o23 13 cs2 30 i/o7 47 we4 64 i/o22 14 gnd 31 i/o6 48 i/o27 65 i/o21 15 i/o11 32 i/o5 49 a3 66 i/o20 16 a10 33 i/o4 50 a4 17 a11 34 i/o24 51 a5 note: 1. nc is a no connect. figure 2. terminal connections - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 22 dscc form 2234 apr 97 cs oe we a0-a14 mode data i/o device current h x x x standby high z standby l l h stable read data out active l h l stable write data in active x h x x out disable high z active x x h x write inhibit active x l x x write inhibit active notes: 1. h = v ih = high logic level 2. l = v il = low logic level 3. x = do not care (either high or low) 4. high z = high impedance state figure 3. truth table . figure 4. read cycle timing diagram .
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 23 dscc form 2234 apr 97 figure 5. write cycle timing diagram we controlled . figure 5. write cycle timing diagram cs controlled - continued.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 24 dscc form 2234 apr 97 notes: 1. a0 through a5 are used to address specific bytes within a page. 2. a6 through a14 must specify the same page address during each high to low transition of write enable or chip select. figure 6. page mode write timing diagram . figure 7. data polling ac timing diagram .
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 25 dscc form 2234 apr 97 figure 8. block diagram . notes: 1. v z is programmed from -2.0 v to +7.0 v. i oh and i ol are programmable from 0 to 16 ma. 2. tester impedance z o = 75 ohms. 3. v z is typically the midpoint of v oh and v ol . 4. c l includes tester jig capacitance. figure 9. typical output test circuit .
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 26 dscc form 2234 apr 97 table ii. electrical test requirements . mil-prf-3853 4 test requirements subgroups (in accordance with mil-prf-38534, group a test table) interim electrical parameters 1, 4, 7, 9 final electrical parameters 1*, 2, 3, 4, 7, 8a, 8b, 9, 10, 11 group a test requirements 1, 2, 3, 4, 7, 8a, 8b, 9, 10, 11 group c end-point electrical parameters 1, 2, 3, 4, 7, 8a, 8b, 9, 10, 11 end-point electrical parameters for radiation hardness assurance (rha) devices not applicable * pda applies to subgroup 1. 3.11 data retention . a data retention stress test shall be completed as part of the vendor's reliability monitors. this test shall be done for initial characterization and after any design process change which may affect data retention. the methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military temperature range. the vendor's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. 4. quality assurance provisions 4.1 sampling and inspection . sampling and inspection procedures shall be in accordance with mil-prf-38534 or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. 4.2 screening . screening shall be in accordance with mil-prf-38534. the following additional criteria shall apply: a. burn-in test, method 1015 of mil-std-883. (1) test condition b. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either dscc-va or the acquiring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of mil-std-883. (2) t a as specified in accordance with table i of method 1015 of mil-std-883. (3) prior to burn-in all devices shall be programmed with a 00 hex data pattern to the entire memory array. the resulting pattern shall be verified before and after burn-in. devices having bits not in the proper state after burn-in shall constitute a device failure and shall not be delivered. b. interim and final electrical test parameters shall be as specified in table ii herein, except interim electrical parameter tests prior to burn -in are optional at the discretion of the manufacturer.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 27 dscc form 2234 apr 97 4.3 conformance and periodic inspections . conformance inspection (ci) and periodic inspection (pi) shall be in accordance with mil-prf-38534 and as specified herein. 4.3.1 group a inspection (ci) . group a inspection shall be in accordance with mil-prf-38534 and as follows: a. tests s hall be as specified in table ii herein. b. subgroups 5 and 6 shall be omitted. c. subgroups 7, 8a, and 8b shall include verification of the truth table in table 3. d. the following data patterns shall be verified during subgroups 7, 8a, and 8b. (1) 0 's to all memory cell locations. (2) 1's to all memory cell locations. (3) checkerboard pattern to entire memory array. (4) checkerboard compliment to entire memory array. 4.3.2 group b inspection (pi) . group b inspection shall be in accordance with mil-prf-38534. 4.3.3 group c inspection (pi) . group c inspection shall be in accordance with mil-prf-38534 and as follows: a. end-point electrical parameters shall be as specified in table ii herein. b. all devices requiring end-point electrical testing shall be programmed with a checkerboard pattern of alternate rows of aa hex and 55 hex. c. steady-state life test, method 1005 of mil-std-883. (1) test condition b. the test circuit shall be maintained by the manufacturer under document revisio n level control and shall be made available to either dscc-va or the acquiring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of mil-std-883. (2) t a as specified in accordance with table i of method 1005 of mil-std-883. (3) test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883. (4) the checkerboard data pattern shall be verified after burn-in as part of end-point electrical testing. 4.3.4 group d inspection (pi) . group d inspection shall be in accordance with mil-prf-38534. 4.3.5 radiation hardness assurance (rha) inspection . rha inspection is not currently applicable to this drawing. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38534. 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 replaceability . microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing.
standard microcircuit drawing size a 5962-94614 defense supply center columbus columbus, ohio 43216-5000 revision level d sheet 28 dscc form 2234 apr 97 6.3 configuration control of smd's . all proposed changes to existing smd's will be coordinated as specified in mil-prf-38534.. 6.4 record of users . military and industrial users shall inform defense supply center columbus when a system application requires configuration control and the applicable smd. dscc will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectronic devices (fsc 5962) should contact dscc-va, telephone (614) 692-0544. 6.5 comments . comments on this drawing should be directed to dscc-va, columbus, ohio 43216-5000, or telephone (614) 692-0512. 6.6 sources of supply . sources of supply are listed in mil-hdbk-103 and qml-38534. the vendors listed in mil-hdbk-103 and qml-38534 have submitted a certificate of compliance (see 3.8 herein) to dscc-va and have agreed to this drawing.
standard microcircuit drawing bulletin date: 00-04-19 approved sources of supply for smd 5962-94614 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38534 during the next revisions. mil-hdbk-103 and qml-38534 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by dscc-va. this bulletin is superseded by the next dated revisions of mil-hdbk-103 and qml-38534. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9461401hua 5962-9461401hua 5962-9461401huc 5962-9461401huc 5962-9461401hma 5962-9461401hmc 5962-9461401hxa 5962-9461401hxc 5962-9461401hya 5962-9461401hyc 5962-9461401hza 5962-9461401hza 5962-9461401hzc 5962-9461401hzc 5962-9461401h9a 5962-9461401h9c 0eu86 54230 0eu86 54230 54230 54230 54230 54230 3 / 3 / 0eu86 54230 0eu86 54230 54230 54230 as8e32k32p-150/883c we32k32-150h1q as8e32k32p-150/883c we32k32-150h1q we32k32-150g2q we32k32-150g2q we32k32n-150hq we32k32n-150hq we32k32n-150hsq we32k32n-150hsq as8e32k32q-150/883c we32k32-150g2uq as8e32k32q-150/883c we32k32-150g2uq we32k32-150g1uq we32k32-150g1uq 5962-9461402hua 5962-9461402hua 5962-9461402huc 5962-9461402huc 5962-9461402hma 5962-9461402hmc 5962-9461402hxa 5962-9461402hxc 5962-9461402hya 5962-9461402hyc 5962-9461402hza 5962-9461402hza 5962-9461402hzc 5962-9461402hzc 5962-9461402H9A 5962-9461402h9c 0eu86 54230 0eu86 54230 54230 54230 54230 54230 3 / 3 / 0eu86 54230 0eu86 54230 54230 54230 as8e32k32p-120/883c we32k32-120h1q as8e32k32p-120/883c we32k32-120h1q we32k32-120g2q we32k32-120g2q we32k32n-120hq we32k32n-120hq we32k32n-120hsq we32k32n-120hsq as8e32k32q-120/883c we32k32-120g2uq as8e32k32q-120/883c we32k32-120g2uq we32k32-120g1uq we32k32-120g1uq 1 of 2
standard microcircuit drawing bulletin - continued date: 00-04-19 standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9461403hua 5962-9461403hua 5962-9461403huc 5962-9461403huc 5962-9461403hma 5962-9461403hmc 5962-9461403hxa 5962-9461403hxc 5962-9461403hya 5962-9461403hyc 5962-9461403hza 5962-9461403hza 5962-9461403hzc 5962-9461403hzc 5962-9461403h9a 5962-9461403h9c 0eu86 54230 0eu86 54230 54230 54230 54230 54230 3 / 3 / 0eu86 54230 0eu86 54230 54230 54230 as8e32k32p-90/883c we32k32-90h1q as8e32k32p-90/883c we32k32-90h1q we32k32-90g2q we32k32-90g2q we32k32n-90hq we32k32n-90hq we32k32n-90hsq we32k32n-90hsq as8e32k32q-90/883c we32k32-90g2uq as8e32k32q-90/883c we32k32-90g2uq we32k32-90g1uq we32k32-90g1uq 1 / the lead finish shown for each pin representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. 3 / no longer available from a qml source. vendor cage vendor name number and address 0eu86 austin semiconductor incorporated 8701 cross park drive austin, tx 78584-4566 54230 white electronic designs corporation 3601 east university drive phoenix, az 85034-7217 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2

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