ligitek electronics co.,ltd. property of ligitek only la16b/sbks-s3 data sheet led array doc. no : qw0905-la16b/sbks-s3 rev. : a date : 07 - sep. - 2005
part no. la16b/sbks-s3 package dimensions note : 1.all dimension are in millimeter tolerance is
blue transparent page 2/4 unit ma ma sbks 30 100 ratings mw # a $ $ 120 50 -20 ~ +80 max 260 $ for 5 sec max (2mm from body) -30 ~ +100 40 viewing angle 2 % 1/2 (deg) 630 300 min. 3.5 typ. max. 4.2 26 475 lens forward voltage @20ma(v) dominant wave length & dnm spectral halfwidth '& nm luminous intensity @20ma(mcd) typ. ligitek electronics co.,ltd. property of ligitek only part no. la16b/sbks-s3 parameter peak forward current duty 1/10@10khz forward current operating temperature reverse current @5v power dissipation soldering temperature storage temperature emitted blue la16b/sbks-s3 ingan/sic part nomaterial typical electrical & optical characteristics (ta=25 $ ) symbol tsol t opr tstg ir i f pd i fp absolute maximum ratings at ta=25 $ note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. color electrostatic discharge esd500 v
25 ambient temperature( $ ) fig.3 forward current vs. temperature 0 f o r w a r d c u r r e n t @ 2 0 m a 0 10 20 40 30 680 630 530 430 480 480 0 380 580 r e l a t i v e i n t e n s i t y @ 2 0 m a 100 5075 wavelength (nm) fig.4 relative intensity vs. wavelength 0.5 1.0 2 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve f o r w a r d c u r r e n t ( m a ) 1 0 5 10 15 30 25 20 sbk-s chip 1.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward current(ma) 5 4 3 05 forward voltage(v) 0 0.25 0.75 0.5 30 25 15 1020 fig.2 relative intensity vs. forward current 1.5 1.25 part no.la16b/sbks-s3 ligitek electronics co.,ltd. property of ligitek only page3/4
page 4/4 reference standard description this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. part no. la16b/sbks-s3 operating life test test item reliability test: 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. low temperature storage test solder resistance test thermal shock test high temperature high humidity test 1.t.sol=260 $ 5 $ 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 $ 5 $ &-40 $ 5 $ (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test intended to see soldering well performed or not. solderability test 1.t.sol=230 $ 5 $ 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 ligitek electronics co.,ltd. property of ligitek only
2. 12 bag / inner box size : l x w x h 33.5cm x 19cm x 7.5cm w 3. 12 inner boxes / carton size : l x w x h 58.5cm x 34cm x 34cm w l i t e m n o . q ' t y : p c s n , w , : k g s g , w , : k g s c/no: made in china h h l ligitek electronics co.,ltd. property of ligitek only packing specification 1.500 pcs / bag
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