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data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. laser diode nx8304be-cc,NX8304CE-CC 1 310 nm ingaasp mqw-dfb laser diode coaxial module for fiberoptic communications document no. pl10173ej01v0ds (1st edition) date published july 2002 cp(k) printed in japan ? ? ? ? nec compound semiconductor devices 2002 description the nx8304be-cc and NX8304CE-CC are 1 310 nm multiple quantum well (mqw) structured distributed feed- back (dfb) laser diode coaxial modules with an internal optical isolator. this module is as a light source for fiberoptic communications. features ? internal optical isolator ? peak emission wavelength l p = 1 310 nm ? optical output power p f = 2.0 mw ? wide operating temperature range t c = - 40 to +85 c ? ingaas monitor pin-pd ? with sc-upc connector ? based on telcordia reliability
data sheet pl10173ej01v0ds 2 nx8304be-cc,NX8304CE-CC package dimensions (unit: mm) nx83004be-cc pin connections 4 1 3 2 pd ld case 7.20.3 1.00.1 3.70.3 43 2 1 p.c.d. = 2.0 f 15.0 20.01.0 29.01.0 4.00.2 12.70.2 17.00.2 optical fiber (smf) length: 0.5 m with sc connector optical fiber (smf) length: 0.5 m with sc connector 8.0 2.00.2 6.01.0 f 7.00.2 f 2C 2.2 f 3.20.25 f 0.45 0.05 f 0.9 f NX8304CE-CC 19.51.0 0.3 29.31.0 15.0 0.50.2 0.3 2.51.0 8.0 7.00.2 f 3.20.25 f 0.9 f 4C 0.45 0.05 f pin connections pd 3 2 4 1 ld case 7.00.2 12.00.15 16.0 4 3 2 1 p.c.d. = 2.0 f 2 C 2.5 f 16.0 f optical fiber characteristics parameter specification unit mode field diameter 9.5 1 m m cladding diameter 125 2 m m maximum cladding noncircularity 2 % maximum core/cladding concentricity 1.6 % outer diameter 0.9 0.1 mm cut-off wavelength 1 100 to 1 270 nm minimum fiber bending radius 30 mm fiber length 500 50 mm flammability ul1581 vw-1 sc-upc connector fiber length: 500 50 mm 352 mm 8.990.5 mm
data sheet pl10173ej01v0ds 3 nx8304be-cc,NX8304CE-CC ordering information part number flange type available connector nx8304be-cc flat mount flange with sc-upc connector NX8304CE-CC vertical mount flange absolute maximum ratings parameter symbol ratings unit optical output power from fiber p f 5mw forward current of ld i f 150 ma reverse voltage of ld v r 2.0 v forward current of pd i f 2.0 ma reverse voltage of pd v r 15 v operating case temperature t c - 40 to +85 c storage temperature t stg - 40 to +85 c lead soldering temperature t sld 350 (3 sec.) c relative humidity (noncondensing) rh 85 %
data sheet pl10173ej01v0ds 4 nx8304be-cc,NX8304CE-CC electro-optical characteristics (t c = - - - - 40 to +85 c, unless otherwise specified) parameter symbol conditions min. typ. max. unit optical output power from fiber p f cw 2.0 mw operating voltage v op p f = 2.0 mw 1.2 1.6 v threshold current i th t c = 25 c1525ma 55 threshold output power p th i f = i th 100 m w modulation current i mod p f = 2.0 mw, t c = 25 c 8 20 30 ma p f = 2.0 mw 6 50 differential efficiency h d p f = 2.0 mw, t c = 25 c 0.07 0.1 0.2 w/a p f = 2.0 mw 0.04 0.3 temperature dependence of differential efficiency dh d dh d = 10 log - 3.5 - 2.2 db kink (refer to definitions ) kink p f = up to 2.4 mw 20 % peak emission wavelength l p p f = 2.0 mw 1 280 1 310 1 335 nm temperature dependence of peak emission wavelength d l / d t 0.09 0.1 nm/ c spectral width d l p f = 2.0 mw, - 20 db down width 0.1 1.0 nm side mode suppression ratio smsr p f = 2.0 mw 30 40 db cut-off frequency f c p f = 2.0 mw, - 3 dbm 2.0 ghz rise time t r 10-90%, p pk = 2.0 mw, i f = i th 0.15 0.5 ns fall time t f 90-10%, p pk = 2.0 mw, i f = i th 0.15 0.5 ns monitor current i m v r = 5 v, p f = 2.0 mw, t c = 25 c 200 700 1 500 m a monitor dark current i d v r = 5 v, p f = 2.0 mw 10 500 na v r = 5 v, t c = 25 c0.150 monitor pd terminal capacitance c t v r = 5 v, f = 1 mhz 1.0 20 pf linearity (refer to definitions ) lin m v r = 5 v, p f = 0.2 to 2.0 mw 15 % tracking error (refer to definitions ) g i m = const. 0.5 1.0 db relative intensity noise rin ref = - 14 db - 135 db/hz optical return ross orl smf 35 52 db h d (@ t c c) h d (@ 25 c)
data sheet pl10173ej01v0ds 5 nx8304be-cc,NX8304CE-CC parameter definitions (mw) i m (ma) 0 p f 2.0 p l 0.2 lin m = 100 [%] dp l p l dp l = dp o max. 0.2 < p l < 2.0 (mw) dp l dp o linearity : lin m dp o i f - p f i f - d h 2.4 dp k dp k = dp o max. p k 2.4 (mw) kink = 100 [%] dp k p k (mw) i f (ma) 0 p f p k kink : kink 0 i m i m t c = 25?c t c = C40 to +85?c p f (mw) p f 2.0 (ma) g = 10 log tracking error : g [db] p f 2.0
data sheet pl10173ej01v0ds 6 nx8304be-cc,NX8304CE-CC typical characteristics (t c = 25 c, unless otherwise specified) forward current vs. forward voltage forward current i f (ma) forward voltage v f (v) 100 60 40 20 0 80 0.5 1.0 1.5 2.0 2.5 spectrum relative intensity (db) wavelength l (nm) 10 C10 C30 C50 C70 0 C20 C40 C60 1 300 1 310 1 320 100 10 1 C60 0 40 80 100 C40 C20 20 60 operating current and threshold current vs. case temperature case temperature t c (?c) operating current i op (ma), threshold current i th (ma) i th i op @p f = 2 mw 0.18 0.12 0.06 0.00 C40 C60 C20 0 20 40 60 80 100 temperature depenedence of differential efficiency case temperature t c (?c) differential efficiency d (w/a) h 0 1.0 2.0 3.0 4.0 5.0 20 40 60 80 100 forward current i f (ma) optical output power from fiber p f (mw) optical output power from fiber p f (mw) optical output power from fiber vs. forward current 0.5 0 1.0 2.0 3.0 4.0 5.0 1.0 1.5 monitor current i m (ma) optical output power from fiber vs.monitor current t c = C 40 ?c +85 ?c +25?c
data sheet pl10173ej01v0ds 7 nx8304be-cc,NX8304CE-CC 1 320 1 315 1 310 1 305 1 300 C20 0 40 80 100 C60 C40 20 60 temperature dependence of peak emission wavelength case temperature t c (c) peak emission wavelength l p (nm) remark the graphs indicate nominal characteristics.
data sheet pl10173ej01v0ds 8 nx8304be-cc,NX8304CE-CC dfb-ld family absolute maximum ratings electro-optical characteristics (t c = 25 c) part number t c ( c) t stg ( c) i th (ma) p f (mw) l p (nm) application package typ. min. typ. nx8300be-cc nx8300ce-cc 0 to +75 - 40 to +85 15 2 *1 1 310 2.5 gb/s: stm-16 (s-16.1, l-16.1) coaxial nx8303bg-cc nx8303cg-cc - 10 to +85 - 40 to +85 15 2 *1 1 310 622 mb/s: stm-4 (l-4.1) coaxial nx8304be-cc NX8304CE-CC - 40 to +85 - 40 to +85 15 2 *1 1 310 for fiberoptic communications coaxial nx8503bg-cc nx8503cg-cc - 10 to +85 - 40 to +85 15 2 *1 1 550 156 mb/s: stm-1 (l-1.2, l-1.3) coaxial 622 mb/s: stm-4 (l-4.2, l-4.3) nx8504be-cc nx8504ce-cc - 10 to +85 - 40 to +85 15 2 *1 1 550 622 mb/s: stm-4 (l-4.2, l-4.3) coaxial nx8560lj-cc - 20 to +70 - 40 to +85 6 - 1 dbm 1 550 *2 10 gb/s: stm-64 bfy with gpo tm nx8562lb - 20 to +65 - 40 to +85 20 20 1 550 *2 cw light source for external modulator bfy nx8563lb - 20 to +65 - 40 to +85 20 10 1 550 *2 cw light source for external modulator bfy nx8564le-cc - 20 to +70 - 40 to +85 7 - 2 dbm *1 1 550 *2 2.5 gb/s: stm-16, 360 km ea modulator integrated bfy nx8565le-cc - 20 to +70 - 40 to +85 7 - 2 dbm *1 1 550 *2 2.5 gb/s: stm-16, 600 km ea modulator integrated bfy nx8566le-cc - 20 to +70 - 40 to +85 7 0 dbm 1 550 *2 2.5 gb/s: stm-16, 240 km ea modulator integrated bfy nx8570 series - 20 to +70 - 40 to +85 20 20 1 550 *2 cw light source with l monitoring pd bfy nx8571 series - 20 to +70 - 40 to +85 20 10 1 550 *2 cw light source with l monitoring pd bfy *1 typ. *2 available for dwdm wavelengths based on itu-t recommendations
data sheet pl10173ej01v0ds 9 nx8304be-cc,NX8304CE-CC reference document name document no. optical semiconducrtor devices for fiberoptic communications selection guide p12480e opto-electronics devices pamphlet p13623e opto-electronics devices (cd-rom) p12944x nec semiconductor device reliability/quality control system *1 c11159e quality grades on nec semiconductor devices *1 c11531e semiconductor selection guide - products and packages - *1 x13769e *1 published by nec corporation
data sheet pl10173ej01v0ds 10 nx8304be-cc,NX8304CE-CC gpo is a trademark of gilbert engineering co., inc. m8e 00. 4 - 0110 the information in this document is current as of july, 2002. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above).
nec compound semiconductor devices hong kong limited hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-528-0301 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-528-0302 nec electron devices european operations http://www.nec.de/ tel: +49-211-6503-101 fax: +49-211-6503-487 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0110 nec compound semiconductor devices, ltd. 5th sales group, sales division tel: +81-3-3798-6372 fax: +81-3-3798-6783 e-mail: salesinfo@csd-nec.com business issue nec compound semiconductor devices, ltd. http://www.csd-nec.com/ sales engineering group, sales division e-mail: techinfo@csd-nec.com fax: +81-44-435-1918 technical issue nx8304be-cc,NX8304CE-CC safety information on this product danger invisible laser radiation avoid direct exposure to beam output power mw max wavelength nm class lllb laser product avoid exposure-invisible laser radiation is emitted from this aperture semiconductor laser warning laser beam a laser beam is emitted from this diode during operation. the laser beam, visible or invisible, directly or indirectly, may cause injury to the eye or loss of eyesight. ? do not look directly into the laser beam. ? avoid exposure to the laser beam, any reflected or collimated beam. caution gaas products the product contains gallium arsenide, gaas. gaas vapor and powder are hazardous to human health if inhaled or ingested. ? do not destroy or burn the product. ? do not cut or cleave off any part of the product. ? do not crush or chemically dissolve the product. ? do not put the product in the mouth. follow related laws and ordinances for disposal. the product should be excluded from general industrial waste or household garbage. caution optical fiber a glass-fiber is attached on the product. handle with care. ? when the fiber is broken or damaged, handle carefully to avoid injury from the damaged part or fragments.

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