memory products wafer and die infosheet cypress semiconductor corporation ? 3901 north first street san jose , ca 95134 408-943-2600 document #: 38-05299 rev. *a revised december 9, 2002 features ? async srams, dual-ports, fifos, micropower srams, proms, and sync srams wafer and die wafer ? standard wafer 25?30 mil thick ? background wafer to 14 mil thick ? background wafer to 11 mil thick die ? die in wafer form 25?30 mil thick ? background die to 14 mil thick ? background die to 11 mil thick ? known good die (kgd) levels 1, 2, and 3 temperature ranges ? commercial, industrial, and automotive waffle pack packages wafer and die classification cypress semiconductor ? s package products are also sold in both wafer and die form. cypress semiconductor classifies them as follows: wafer wafers are probed at room and hot to guarantee full function- ality. other parameters are guaranteed based on the level of product that is supplied to the customer. details of product levels are described later in this specification. known good die kgd is available in both die in wafer form and background die. product in wafer form is not background and is anywhere from 25 to 30 mil thick. background die are 14 or 11 mil thick, sawed, and shipped in waffle packs. the product in either form is tested to three different levels: level 1 wafers are probed to guarantee full functionality and all static dc parameters. other parameters are not guaranteed and warranted, including device reliability. level 2 wafers are probed to guarantee full functionality, all static dc and partial ac parameters. other parameters are not guaranteed and warranted, including device reliability. level 3 wafers are probed to guarantee full functionality and all static dc and ac parameters. all parameters are guaranteed and warranted, including device reliability. wafers and die in wafer form are shipped in jars with die maps. background die are shipped as die in waffle packs.
wafer and die infosheet document #: 38-05299 rev. *a page 2 of 4 maximum ratings (above which the useful life may be impaired. for user guide- lines, not tested.) storage temperature ................................. ? 65 c to +150 c ambient temperature with power applied............................................. ? 55 c to +125 c operating range range [1,2] ambient temperature commercial 0 c to +70 c industrial ? 40 c to +85 c automotive ? 40 c to +125 c functional characteristics product type silicon type dc test parameters [2, 3] ac test parameters [2, 3] async srams, dual-ports, fifos, micropower srams, proms and sync srams wafer per product spec. none. kgd 1 per product spec. none. kgd 2 per product spec. partial per product spec. kgd 3 per product spec. full per product spec. ordering information silicon type ordering code [2,4] wafer code wafer/die type operating range wafer cyxxxx-waf ww wafer (25-30 mil). commercial cyxxxx-ww14 ww wafer (14 mil). cyxxxx-ww11 ww wafer (11 mil). kgd1 cyxxxx-1xw xw die (25-30 mil) in wafer form. commercial cyxxxx-1xw14 xw die (14 mil) in wafer form. cyxxxx-1xw11 xw die (11 mil) in wafer form. cyxxxx-1x14 x die (14 mil) in waffle pack. cyxxxx-1x11 x die (11 mil) in waffle pack. cyxxxx-1xwi xw die (25-30 mil) in wafer form. industrial cyxxxx-1xw14i xw die (14 mil) in wafer form. cyxxxx-1xw11i xw die (11 mil) in wafer form. cyxxxx-1x14i x die (14 mil) in waffle pack. cyxxxx-1x11i x die (11 mil) in waffle pack. cyxxxx-1xwe xw die (25-30 mil) in wafer form. automotive cyxxxx-1xw14e xw die (14 mil) in wafer form. cyxxxx-1xw11e xw die (11 mil) in wafer form. cyxxxx-1x14e x die (14 mil) in waffle pack. cyxxxx-1x11e x die (11 mil) in waffle pack. notes: 1. check product specific datasheets for available temperature ranges. 2. shaded area is advance information. 3. contact a cypress representative for product specific test parameters. 4. cyxxxx denotes the packaged product designator. for example, the cypress part number cy7c1049b -12vi in kgd1 (14 mil) would be a cy7c1049b -1x14i. not all combinations are available for all products. contact a cypress representative for product availability.
wafer and die infosheet document #: 38-05299 rev. *a page 3 of 4 ? cypress semiconductor corporation, 2002. the information contained herein is subject to change without notice. cypress semico nductor corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a cypress semiconductor product. nor does it convey or imply any license unde r patent or other rights. cypress semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected t o result in significant injury to the user. the inclusion of cypress semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in do ing so indemnifies cypress semiconductor against all charges. all product and company names mentioned in this document may be the trademarks of their respective holders. kgd2 cyxxxx-2xw xw die (25-30 mil) in wafer form. commercial cyxxxx-2xw14 xw die (14 mil) in wafer form. cyxxxx-2xw11 xw die (11 mil) in wafer form. cyxxxx-2x14 x die (14 mil) in waffle pack. cyxxxx-2x11 x die (11 mil) in waffle pack. cyxxxx-2xwi xw die (25-30 mil) in wafer form. industrial cyxxxx-2xw14i xw die (14 mil) in wafer form. cyxxxx-2xw11i xw die (11 mil) in wafer form. cyxxxx-2x14i x die (14 mil) in waffle pack. cyxxxx-2x11i x die (11 mil) in waffle pack. cyxxxx-2xwe xw die (25-30 mil) in wafer form. automotive cyxxxx-2xw14e xw die (14 mil) in wafer form. cyxxxx-2xw11e xw die (11 mil) in wafer form. cyxxxx-2x14e x die (14 mil) in waffle pack. cyxxxx-2x11e x die (11 mil) in waffle pack. kgd3 cyxxxx-3xw xw die (25-30 mil) in wafer form. commercial cyxxxx-3xw14 xw die (14 mil) in wafer form. cyxxxx-3xw11 xw die (11 mil) in wafer form. cyxxxx-3x14 x die (14 mil) in waffle pack. cyxxxx-3x11 x die (11 mil) in waffle pack. cyxxxx-3xwi xw die (25-30 mil) in wafer form. industrial cyxxxx-3xw14i xw die (14 mil) in wafer form. cyxxxx-3xw11i xw die (11 mil) in wafer form. cyxxxx-3x14i x die (14 mil) in waffle pack. cyxxxx-3x11i x die (11 mil) in waffle pack. cyxxxx-3xwe xw die (25-30 mil) in wafer form. automotive cyxxxx-3xw14e xw die (14 mil) in wafer form. cyxxxx-3xw11e xw die (11 mil) in wafer form. cyxxxx-3x14e x die (14 mil) in waffle pack. cyxxxx-3x11e x die (11 mil) in waffle pack. ordering information (continued) silicon type ordering code [2,4] wafer code wafer/die type operating range
wafer and die infosheet document #: 38-05299 rev. *a page 4 of 4 document history page document title: wafer and die infosheet memory products document number: 38-05299 rev. ecn no. issue date orig. of change description of change ** 116316 09/26/02 dfp/meg new mpd sram wafer and die infosheet *a 121670 12/10/02 dfp/dkj changed title to ? wafer and die infosheet memory products. ? added dual-ports, fifos, and proms to portfolio.
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