doc. no : qw0905-la268b/dbk-pf rev. : a date : 05 - oct. - 2007 led array data sheet la268b/dbk-pf ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ldbk2640-pf 25.0min 1.0min 2.54typ + - 0.5 typ 3.1 2.9 4.3 3.3 1.5 max part no. la268b/dbk-pf package dimensions page 1/5 ligitek electronics co.,ltd. property of ligitek only + - ? 0.95 2.5 ? 3.1 ? 4.1 2.9 5.85 0.5 2.54typ 3.5 0.5 7.0 7.8 2.9 0.5 3.3 0.5 typ 4.4 4.0 6.0
blue diffused lens color note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) material part no ingan/gan la268b/dbk-pf blue emitted ligitek electronics co.,ltd. property of ligitek only typ. luminous intensity @10ma(mcd) spectral halfwidth nm dominant wave length dnm forward voltage @20ma(v) 47026 4.0 max. typ. 3.5 min. 220450 viewing angle 2 1/2 (deg) 38 page 2/5 part no. la268b/dbk-pf * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. symbol power dissipation reverse current @5v electrostatic discharge( * ) storage temperature operating temperature peak forward current duty 1/10@10khz forward current parameter 120 mw pd -30 ~ +100 -20 ~ +80 t opr tstg esd ir 150 50 v a ratings i fp i f 100 30 dbk ma ma unit
3/5 page dbk chip 1000 100 10 1 3.0 2.5 fig.1 forward current vs. forward voltagefig.2 relative intensity vs. forward current 1000 100 2.0 1.5 1.0 0.5 0.0 10 1 5.0 2.0 forward voltage(v) forward current(ma) f o r w a r d c u r r e n t ( m a ) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.0 1.2 fig.3 forward voltage vs. temperature 2.0 1.0 1.5 1.1 0.9 1.0 2.5 fig.4 relative intensity vs. temperature 4080100 60 0.0 20406080100-20 -400 0.8 -40-200 ambient temperature( ) ambient temperature( ) 20 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 0.5 550 500 400 0.0 450 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a 1.0 0 1 4.0 3.0 1.0 ligitek electronics co.,ltd. property of ligitek only typical electro-optical characteristics curve fig.5 relative intensity vs. wavelength part no. la268b/dbk-pf
60 seconds max ligitek electronics co.,ltd. property of ligitek only page 4/5 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 260 c3sec max 5 /sec max temp( c) 260 2 /sec max time(sec) preheat 150 100 50 120 25 0 0 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) part no. la268b/dbk-pf
page 5/5 reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 test item test condition reliability test: operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs thermal shock test solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. part no. la268b/dbk-pf
|
