hlmp-hb56, hlmp-hm56 precision optical performance blue and green 5mm standard oval leds data sheet features ? well defned spatial radiation pattern ? high brightness material ? available in green and blue color green 525 nm blue 470 nm ? tinted and difused benefts ? viewing angle designed for wide feld of view appli - cations ? superior performance for outdoor environments applications ? full color signs ? commercial outdoor advertising description these precision optical performance oval leds are specifcally designed for full color/video and passenger information signs. the oval shaped radiation pattern and high luminous intensity ensure these devices are excellent for wide feld of view outdoor applications where a wide viewing angle and readability in sunlight are essential. these lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. high efciency led material is used in these lamps: indium gallium nitride (ingan) for blue and green. each lamp is made with an advance optical grade epoxy ofering superior high temperature and high moisture resistance in outdoor applications. the package epoxy contains both uv-a and uv-b inhibi - tors to reduce the efects of long term exposure to direct sunlight. caution : devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate pre - cautions during handling and processing. refer to application note an-1142 for additional details. package dimensions 5.20 (0.204) 2.54 (0.10) 7.00 (0.275) 1.00 (0.039) 1.50 (0.059 ) max. max. sq. typ. 24.00 (0.945) min. 0.70 (0.028) 1.00 (0.039) min. 0.50 ? 0.10 (0.020 ? 0.004) cathode lead notes: 1. dimensions in millimeters (inches). 2. tolerance ? 0.25 mm unless otherwise noted. 3. if heat-sinking application is required, the terminal for heat sink is anode. note: measured at base of lens. 3.80 (0.150) max.
2 part numbering system h l m p - x x 5 6 - x x x x x mechanical option 00: bulk dd: ammo pack color bin option 0: full color bin distribution maximum intensity bin refer to device selection guide minimum intensity bin refer to device selection guide color b: blue 470 nm m: green 525 nm package h: 5mm standard oval device selection guide luminous intensity, iv (cd) typical dominant at 20 ma part number color wavelength l d (nm) minimum maximum standofs lens type hlmp-hb56-lp0xx blue 470 0.40 1.15 no tinted, difused hlmp-hm56-sv0xx green 525 1.90 5.50 no tinted, difused notes: 1. tolerance for luminous intensity measurement is 15%. 2. the luminous intensity is measured on the mechanical axis of the lamp package. 3. the optical axis is closely aligned with the package mechanical axis. 4. the dominant wavelength l d is derived from the chromaticity diagram and represents the color of the lamp. 5. led light output is bright enough to cause injuries to the eyes. precautions must be taken to prevent looking directly at the led with unaided eyes. absolute maximum rating at t a = 25c parameters blue and green unit dc forward current [1] 30 ma peak pulsed forward current [2] 100 ma average forward current 30 ma power dissipation 116 mw led junction temperature 110 c operating temperature range -40 to +85 c storage temperature range -40 to +100 o c notes: 1. derate linearly as shown in figure 2. 2. duty factor 10%, frequency 1 khz please refer to ab 5337 for complete information about part numbering system.
electrical/optical characteristics t a = 25c value parameters symbol min. typ. max. units test condition forward voltage v f v i f = 20 ma green 2.8 3.3 3.85 blue 2.8 3.2 3.85 reverse voltage v r 5.0 v i r = 10 a thermal resistance r q j-pin 240 c/w led junction to anode lead dominant wavelength [1,2] l d nm i f = 20 ma green 520 525 540 blue 460 470 480 peak wavelength l peak nm peak of wavelength of spectral green 516 distribution at i f = 20 ma blue 464 spectral half width dl 1/2 nm wavelength width at spectral green 32 distribution 1 / 2 power point at blue 23 i f = 20 ma luminous efcacy [3] h v lm/w emitted luminous green 520 power/emitted radiant power blue 75 luminous flux j v mlm i f = 20 ma green 3000 blue 600 luminous efciency [4] h e lm/w luminous flux/electrical power green 50 i f = 20 ma blue 10 notes: 1. the dominant wavelength l d is derived from the chromaticy diagram and represents the color of the lamp. 2. tolerance for each color bin limit is 0.5 nm. 3. the radiant intensity, ie in watts/steradian, may be found from the equation ie = iv/ h v , where iv is the luminous intensity in candelas and h v is the luminous efcacy in lumens/watt. 4. h e = j v / i f x v f , where j v is the emitted luminous fux, if is electrical forward current and vf is the forward voltage. figure 1. relative intensity vs. wavelength. figure 3. forward current vs. forward voltage. figure 2. forward current vs. ambient temperature. wavelength e nm relative intensity 350 40 0 4 50 500 550 600 650 1.00 blue 0 0.80 0.60 0.40 0.20 green 0 5 10 15 20 25 30 35 0 2 0 4 0 6 0 8 0 100 t a - ambient temperature - o c i f - maximum forward current - ma 0 5 10 15 20 25 30 35 0 1 2 3 4 forward voltage - v forward current - ma
4 figure 5. relative intensity vs. dc forward current. figure 4. relative dominant wavelength vs. dc for - ward current. figure 6. spatial radiation patternCmajor axis. figure 7. spatial radiation patternCminor axis. intensity bin limit table intensity (mcd) at 20 ma bin min max l 400 520 m 520 680 n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 tolerance for each bin limit is 15%. 4 relative intensity 1 0 angular displacement degree 0.5 -90 -60 0 -30 30 60 90 relative intensity 1 0 angular displacement degree 0.5 -90 -60 0 -30 30 60 90 0.995 1.000 1.005 1.010 1.015 1.020 0 1 0 2 0 3 0 forward current, ma relative dominant wavelength green blue 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 5 10 15 20 25 30 dc forward current - ma relative luminous intensity (normalized at 20 ma)
5 blue color bin table min max bin dom dom xmin ymin xmax ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 4 472.0 476.0 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 tolerance for each bin limit is 0.5 nm. green color bin table min max bin dom dom xmin ymin xmax ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 2 524.0 528.0 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 3 528.0 532.0 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 4 532.0 536.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 5 536.0 540.0 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 tolerance for each bin limit is 0.5 nm. cie 1931 - chromaticity diagram 0.000 0.200 0.400 0.600 0.800 1.000 0.000 0.200 0.400 0.600 0.800 x y 3 4 5 blue 2 1 1 2 3 4 5 green avago color bin on cie 1931 diagram relative light output vs junction temperature 0.1 1 10 -40 -20 0 2 0 4 0 6 0 8 0 100 t j - junction temperature - c relative light output (normalized at t j = 25c) green blue
6 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness led are using high efciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led confguration 1.59mm ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105 c max. - preheat time 60 sec max - peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. cathode anode alingap device ingan device
7 example of wave soldering temperature profle for th led 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. ammo packs drawing note: the ammo-packs drawing is applicable for packaging option Cdd & Czz and regardless of standof or non-standof. 18.00 0.50 (0.7087 0.0197) 6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394) 9.125 0.625 (0.3593 0.0246) 12.70 0.30 (0.50 0.0118) cathode 0.70 0.20 (0.0276 0.0079) 20.5 1.00 (0.8071 0.0394) a a view a?a ? 4.00 0.20 (0.1575 0.008) typ. all dimensions in millimeters (inches).
8 packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n r e v : d e p t i d : s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 1 m a x t e m p 2 5 0 c packaging box for ammo packs note: for ingan device, the ammo pack packaging box contains esd logo. from left side of box, adhesive tape must be facing upward. avago technologies anode mother label cathode c a + ? anode lead leaves the box first. label on this side of box.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 2007 avago technologies limited. all rights reserved. obsoletes 5989-1395en av02-0390en - july 18, 2007 disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, main - tenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its sup - pliers, for all loss, damage, expense or liability in connection with such use. acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) (ii) avago baby label (only available on bulk packaging) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only p a r t # : p a r t n u m b e r l o t # : l o t n u m b e r m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 1 m a x t e m p 2 5 0 c
|
