agilent t-1 3 / 4 (5 mm) precision optical performance ingan blue and green lamps data sheet features well defined spatial radiation pattern viewing angles: 15? and 30? high luminous output colors: 472 nm blue, 526 nm green superior resistance to moisture uv resistant epoxy benefits superior performance in outdoor environments wavelengths suitable for color mixing in full color (rgb) signs applications commercial outdoor signs automotive interior lights front panel indicators front panel backlighting description these high intensity blue and green leds are based on ingan material technology. ingan is the most efficient and cost effective material for leds in the blue and green region of the spectrum. the 472 nm typical dominant wavelength for blue and 526 nm typical dominant wavelength for green are well suited to color mixing in full color signs. these led lamps are untinted, nondiffused, t-1 3 / 4 packages incorporating second generation optics which produce well defined spatial radiation patterns at specific viewing cone angles. caution: hlmp-cbxx and hlmp-cmxx leds are class 1 esd sensitive. please observe appropriate precautions during handling and processing. refer to agilent application note an-1142 for additional details. these lamps are made with an advanced optical grade epoxy, offering superior high temperature and high moisture resistance performance in outdoor signal and sign applications. the high maximum led junction temperature limit of +130?c enables high temperature operation in bright sunlight conditions. the package epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long term exposure to direct sunlight. these lamps are available in two viewing angle options to give the designer flexibility with optical design. hlmp-cb15, hlmp-cb16, hlmp-cb30, hlmp-cb31, hlmp-cm15, hlmp-cm16, hlmp-cm30, hlmp-cm31
2 tolerance for intensity limit is 15%. led indicators device selection guide color and typical typ. dominant min. luminous max. luminous viewing wavelength intensity, iv intensity, iv leads with package part number angle d (nm) (mcd) at 20 ma (mcd) at 20 ma stand-offs drawing hlmp-cb15-p00xx 15 blue 472 880 - no a hlmp-cb15-qt0xx 15 blue 472 1150 3200 no a hlmp-cb15-r00xx 15 blue 472 1500 - no a hlmp-cb15-rscxx 15 blue 472 1500 2500 no a hlmp-cb16-p00xx 15 blue 472 880 - yes b hlmp-cb16-qt0xx 15 blue 472 1150 3200 yes b hlmp-cb30-k00xx 30 blue 472 310 - no a hlmp-cb30-m00xx 30 blue 472 520 - no a hlmp-cb30-npcxx 30 blue 472 680 1150 no a hlmp-cb30-nrgxx 30 blue 472 680 1900 no a hlmp-cb30-pqcxx 30 blue 472 880 1500 no a hlmp-cb31-m00xx 30 blue 472 520 - yes b hlmp-cb31-nrgxx 30 blue 472 680 1900 yes b hlmp-cb31-pqcxx 30 blue 472 880 1500 yes b hlmp-cm15-s00xx 15 green 526 1900 - no a hlmp-cm15-vy0xx 15 green 526 4200 12000 no a hlmp-cm15-w00xx 15 green 526 5500 - no a hlmp-cm15-wxbxx 15 green 526 5500 9300 no a hlmp-cm16-s00xx 15 green 526 1900 - yes b hlmp-cm16-vy0xx 15 green 526 4200 12000 yes b hlmp-cm30-m00xx 30 green 526 520 - no a hlmp-cm30-rsbxx 30 green 526 1500 2500 no a hlmp-cm30-s00xx 30 green 526 1900 - no a hlmp-cm30-tubxx 30 green 526 2500 4200 no a hlmp-cm30-tucxx 30 green 526 2500 4200 no a hlmp-cm30-tw0xx 30 green 526 2500 7200 no a hlmp-cm30-twaxx 30 green 526 2500 7200 no a hlmp-cm30-uvaxx 30 green 526 3200 5500 no a hlmp-cm31-m00xx 30 green 526 520 - yes b hlmp-cm31-tucxx 30 green 526 2500 4200 yes b hlmp-cm31-tw0xx 30 green 526 2500 7200 yes b hlmp-cm31-twaxx 30 green 526 2500 7200 yes b
3 part numbering system hlmp - x x xx - x x x xx mechanical options 00: bulk dd: ammo pack yy: flexi bin, bulk zz: flexi bin, ammo pack color bin selection 0: full color range a: color bin 1 & 2 only b: color bin 2 & 3 only c: color bin 3 & 4 only g: color bin 2, 3 & 4 only maximum intensity bin 0: no maximum iv bin limit others: refer to intensity bin limit table minimum intensity bin refer to device selection guide viewing angle and standoff options 15: 15 degree without standoff 16: 15 degree with standoff 30: 30 degree without standoff 31: 30 degree with standoff color b: blue m: green package c: t-1 3/4 (5 mm) round lamp
4 notes: 1. dimensions in mm. 2. tolerance 0.1 mm unless otherwise noted. 1.14 ?0.20 (0.045 ?0.008) 5.80 ?0.20 (0.228 ?0.008) 5.00 ?0.20 (0.197 ?0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 ?0.20 (0.343 ?0.008) 2.54 ?0.38 (0.100 ?0.015) 0.50 ?0.10 (0.020 ?0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat hlmp-cx15 and hlmp-cx30 package dimensions 1.14 ?0.20 (0.045 ?0.008) 5.80 ?0.20 (0.228 ?0.008) 5.00 ?0.20 (0.197 ?0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 ?0.20 (0.343 ?0.008) 2.54 ?0.38 (0.100 ?0.015) 0.50 ?0.10 (0.020 ?0.004) sq. typ. cathode lead cathode flat d 1.50 ?0.15 (0.059 ?0.006) hlmp-cx16 and hlmp-cx31 hlmp-cx16 hlmp-cx31 d = 12.60 ?0.25 (0.496 ?0.010) d = 12.22 ?0.50 (0.481 ?0.020)
5 electrical/optical characteristics at t a = 25?c parameter symbol min. typ. max. units test conditions forward voltage v f 3.8 4.0 v i f = 20 ma reverse voltage v r 5i r = 100 a peak wavelength peak of wavelength of blue ( d = 472 nm) peak 470 nm spectral distribution green ( d = 526 nm) 524 at i f = 20 ma spectral halfwidth wavelength width blue ( d = 472 nm) ? 1/2 35 nm at spectral power green ( d = 526 nm) 47 point at i f = 20 ma capacitance c 43 pf v f = 0, f = 1 mhz luminous efficacy emitted luminous blue ( d = 472 nm) v 75 lm/w power/emitted radiant green ( d = 526 nm) 520 power thermal resistance r j-pin 240 ?c/w led junction-to- cathode lead absolute maximum ratings at t a = 25?c parameter blue and green dc forward current [1] 30 ma peak pulsed forward current [2] 100 ma reverse voltage (i r = 100 a) 5 v power dissipation 120 mw led junction temperature 130?c operating temperature range ?0?c to +80?c storage temperature range ?0?c to +100?c notes: 1. derate linearly as shown in figure 5 for temperatures above 50?c. 2. duty factor 10%, frequency 1khz.
6 figure 1. relative intensity vs. wavelength. figure 3. relative luminous intensity vs. forward current. wavelength ?nm relative intensity 400 450 500 550 600 650 700 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 green blue 0 0 1.5 0.5 intensity normalized at 20 ma i f forward current ma 0 5 15 30 1.0 10 25 20 figure 4. maximum forward current vs. ambient temperature. figure 5. spatial radiation pattern ?15? lamps. figure 6. spatial radiation pattern ?30? lamps. i f forward current ma 0 0 t a ambient temperature c 40 80 40 35 25 15 10 20 60 100 5 20 30 normalized intensity 1.0 0 angular displacement degrees 0.8 0.6 0.2 -30 0.4 10 20 -20 -10 0 30 0.9 0.7 0.5 0.3 0.1 normalized intensity 1.0 0 angular displacement degrees 0.8 0.6 0.2 -40 0.4 10 20 -20 -10 0 40 0.9 0.7 0.5 0.3 0.1 -30 30 520 550 530 dominant wavelength nm forward current ma 0 20 60 120 540 40 100 80 525 535 545 green blue 472 473 474 475 476 477 478 471 figure 7. color vs. forward current. figure 2. forward current vs. forward voltage. 2.0 3.4 v f forward voltage v 0 10 25 30 i f forward current ma 4.2 5 15 20 2.4 3.0 3.8 2.2 2.8 3.2 4.0 2.6 3.6
7 intensity bin limits bin name min. max. k 310 400 l 400 520 m 520 680 n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 tolerance for each intensity bin limit is 15%. color bin limits (nm at 20 ma) blue color range (nm) bin id min. max. 1 460.0 464.0 2 464.0 468.0 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 tolerance for each bin limit is 0.5 nm. green color range (nm) bin id min. max. 1 520.0 524.0 2 524.0 528.0 3 528.0 532.0 4 532.0 536.0 5 536.0 540.0 tolerance for each bin limit is 0.5 nm. note: 1. all bin categories are established for classification of products. products may not be available in all bin categories. please contact your agilent represen- tatives for further information.
figure 8. recommended wave soldering profile. precautions lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. ? recommended soldering conditions: ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. ? if necessary, use fixture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25 c, before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: manual solder wave soldering dipping pre-heat temperature 105 c max. pre-heat time 30 sec max. peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max. led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time seconds temperature c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force. 8
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152 (domestic/interna- tional), or 0120-61-1280 (domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ?2005 agilent technologies, inc. obsoletes 5989-1904en october 25, 2005 5989-4124en
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