doc. no : qw0905-l rev. : date : 23 - jun - 2005 a08b/10g a data sheet ligitek electronics co.,ltd. property of ligitek only led array la08b/10g
note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lg5520 1/4 la08b/10g page part no. package dimensions ligitek electronics co.,ltd. property of ligitek only ggg g g gggg g 1.0min 2.3typ 12.5min 1.0min 2.3typ ?? 0.5 typ 3.8 6.0 8.0 1.5max 5.3 2.0 1.8 - + 6.8x9=61.2 1.8 4.4 70.0 5.9 ?? 0.5 typ 7.9 2.0 12.5min 5.3 7.2 5.0
part no. absolute maximum ratings at ta=25 j la08b/10g part no note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. typical electrical & optical characteristics (ta=25 j ) forward current peak forward current duty 1/10@10khz operating temperature soldering temperature storage temperature reverse current @5v power dissipation peak wave length f pnm material green emitted gap 565 lens green diffused color viewing angle 2 c 1/2 (deg) spectral halfwidth ??f nm 20 luminous intensity @10ma(mcd) forward voltage @ ma(v) 1.8 min. 2.6 max. 30 1.7 min. typ. 3.0 142 tstg tsol ir t opr -40 ~ +100 max 260 j for 5 sec max (2mm from body) j 10 -40 ~ +85 g a j i f pd i fp parameter symbol ma ma mw ratings unit ligitek electronics co.,ltd. property of ligitek only 2/4 page 30 100 120 g la08b/10g
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) page forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. 3/4 la08b/10g
mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to see soldering well performed or not. 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles solder resistance test thermal shock test high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. part no. page 4/4 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) low temperature storage test operating life test high temperature storage test the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition test item reliability test: description reference standard ligitek electronics co.,ltd. property of ligitek only la08b/10g
|
