everlight electronics co., ltd. http:// www.everlight.com rev.2 page: 1 o f 10 device no. : dse-000 prepared date:3 0-jun.-2011 prepared by:zhouchen technical data sheet 0805 package chip led(1.0mm height) 17-21/ghc-xs1t2m/3t features ? package in 8mm tape on 7 diameter reel. ? compatible with automatic placement equipment. ? compatible with infrared and vapor phase reflow solder process. ? mono-color type. ? pb-free. ? the product itself will remain with in rohs complia nt version . descriptions ? the 17-21 smd led is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ? besides, lightweight makes them ideal for miniature applications. etc. applications ? backlighting in dashboard and switch. ? telecommunication: indicator and backlighting in telephone and fax. ? flat backlight for lcd, switch and symbol. ? general use. device selection guide part no. chip emitted color resin color material 17-21/ghc-xs1t2m/3t ingan brilliant green water cle ar
everlight electronics co., ltd. http:// www.everlight.com rev.2 page: 2 o f 10 device no. : dse-000 prepared date:3 0-jun.-2011 prepared by:zhouchen 17-21/ghc- xs1t2m/3t package outline dimensions + - 1.05 note: the tolerances unless mentioned is 0.1mm ,unit = mm
everlight electronics co., ltd. http:// www.everlight.com rev.2 page: 3 o f 10 device no. : dse-000 prepared date:3 0-jun.-2011 prepared by:zhouchen 17-21/ghc-xs1t2m/3t absolute maximum ratings (ta=25 ) parameter symbol rating unit reverse voltage v r 5 v forward current i f 25 ma peak forward current (duty 1/10 @1khz) i fp 100 ma power dissipation p d 95 mw electrostaticdischarge (hbm) esd 150 v operating temperature topr -40 ~ +85 storage temperature tstg -40 ~ +90 soldering temperature tsol reflow soldering: 260 for 10 sec hand soldering: 350 for 3 sec electro-optical characteristics (ta=25 ) parameter symbol min. typ. max. unit condition luminous intensity i v 180 ----- 450 mcd i f =20ma viewing angle 2 1/2 ---- 140 ---- deg peak wavelength p ---- 518 ---- nm dominant wavelength d 515 ---- 530 nm spectrum radiation bandwidth ---- 35 ---- nm forward voltage v f 2.75 ---- 3.95 v reverse current i r ---- ---- 50 a v r =5v notes: 1.tolerance of luminous intensity 11% 2.tolerance of dominant wavelength 1nm 3.tolerance of forward voltage 0.1v
everlight electronics co., ltd. http:// www.everlight.com rev.2 page: 4 o f 10 device no. : dse-000 prepared date:3 0-jun.-2011 prepared by:zhouchen 17-21/ghc-xs1t2m/3t bin range of dom. wavelength groups bin min max unit condition x w 515 520 nm i f =20ma x 520 525 y 525 530 bin range of luminous intensity bin min max unit condition s1 180 225 mcd i f =20ma s2 225 285 t1 285 360 t2 360 450 bin range of forward voltage groups bin min max unit condition m 5 2.75 3.05 nm i f =20ma 6 3.05 3.35 7 3.35 3.65 8 3.65 3.95 notes: 1.tolerance of luminous intensity 11% 2.tolerance of dominant wavelength 1nm 3.tolerance of forward voltage 0.1v
everlight electronics co., ltd. http:// www.everlight.com rev.2 page: 5 o f 10 device no. : dse-000 prepared date:3 0-jun.-2011 prepared by:zhouchen 17-21/ghc-xs1t2m/3t typical electro-optical characteri ta=25c relative luminous intensity ambient temperature t (c ) a % ) ( relative luminous intensity ( ) % wavelength (nm) ta=25c forward voltage v (v) f forward current i (ma) relative luminous intensity ( ) % forward current i (ma) ta=25c ambient temperature t (c a ) forward current i (ma) ta=25c 1.0 0.9 0.8 0.7 0.5 0.3 0.1 0.2 0.4 0.6 10 40 50 60 70 80 90
everlight electronics co., ltd. http:// www.everlight.com rev.2 page: 6 o f 10 device no. : dse-000 prepared date:3 0-jun.-2011 prepared by:zhouchen 17-21/ghc-xs1t2m/3t label explanation cat: luminous intensity (mcd) hue: dom. wavelength (nm) ref: forward voltage (v) reel dimensions note: the tolerances unless mentioned is 0.1mm,unit = mm
everlight electronics co., ltd. http:// www.everlight.com rev.2 page: 7 o f 10 device no. : dse-000 prepared date:3 0-jun.-2011 prepared by:zhouchen 17-21/ghc-xs1t2m/3t carrier tape dimensions: loaded quantity 3000 pcs p er reel note: the tolerances unless mentioned is 0.1mm , unit = mm moisture resistant packaging
everlight electronics co., ltd. http:// www.everlight.com rev.2 page: 8 o f 10 device no. : dse-000 prepared date:3 0-jun.-2011 prepared by:zhouchen 17-21/ghc-xs1t2m/3t reliability test items and conditions the reliability of products shall be satisfied with items listed below. confidence level : 90 % ltpd : 10 % no. items test condition test hours/cycles sample size ac/re 1 reflow soldering temp. : 260 5 min. 5sec. 6 min. 22 pcs. 0/1 2 temperature cycle h : +100 15min 5 min l : -40 15min 300 cycles 22 pcs. 0/1 3 thermal shock h : +100 5min 10 sec l : -10 5min 300 cycles 22 pcs. 0/1 4 high temperature storage temp. : 100 1000 hrs. 22 pcs. 0/1 5 low temperature storage temp. : -40 1000 hrs. 22 pcs. 0/1 6 dc operating life i f = 20 ma 1000 hrs. 22 pcs. 0/1 7 high temperature / high humidity 85 / 85%rh 1000 hrs. 22 pcs. 0/1
everlight electronics co., ltd. http:// www.everlight.com rev.2 page: 9 o f 10 device no. : dse-000 prepared date:3 0-jun.-2011 prepared by:zhouchen 17-21/ghc-xs1t2m/3t precautions for use 1. over-current-proof customer must apply resistors for protection , ot herwise slight voltage shift will cause big current change ( burn out will happe n ). 2. storage time 2.1 do not open moisture proof bag before the prod ucts are ready to use. 2.2 before opening the package: the leds should b e kept at 30 or less and 90%rh or less. 2.3 after opening the package: the led's floor life is 1 year under 30 or less and 60% rh or less. if unused leds remain, it should be stored in moist ure proof packages. 2.4 if the moisture absorbent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 60 5 for 24 hours. 3. soldering condition 3.1 pb-free solder temperature profile 3.2 reflow soldering should not be done more than t wo times. 3.3 when soldering, do not put stress on the leds d uring heating. 3.4 after soldering, do not warp the circuit board.
everlight electronics co., ltd. http:// www.everlight.com rev.2 page: 10 of 10 device no. : dse-000 prepared date:3 0-jun.-2011 prepared by:zhouchen 17-21/ghc-xs1t2m/3t 4.soldering iron each terminal is to go to the tip of soldering iro n temperature less than 350 for 3 seconds within once in less than the soldering iron capacit y 25w. leave two seconds and more intervals, and do soldering of each terminal. be careful because the damage of the product is often started at the time of the hand solder. 5.repairing repair should not be done after the leds hav e been soldered. when repairing is unavoidable, a double-head soldering iron should be used (as below figure). it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. everlight electronics co., ltd. tel: 886-2-2267-2000, 2267-9936 office: no 25, lane 76, sec 3, chung yang rd, f ax: 886-2267-6244, 2267-6189, 2267-6306 tucheng, taipei 236, taiwan, r.o.c http:// www.everlight.com
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