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rf & protection devices data sheet revision 3.0, 2010-10-04 BGA713L7 single-band umts ln a (700, 800 mhz)
edition 2010-10-04 published by infineon technologies ag 81726 munich, germany ? 2010 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGA713L7 single-band umts lna (700, 800 mhz) data sheet 3 revision 3.0, 2010-10-04 trademarks of infineon technologies ag aurix?, bluemoon?, comneon? , c166?, crossave?, canpak?, ci pos?, coolmos?, coolset?, corecontrol?, dave?, easypim?, econobridg e?, econodual?, eco nopack?, econopim?, eicedriver?, eupec?, fcos?, hitfet?, hybridpack?, isofac e?, i2rf?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, profet?, pro-sil?, primarion?, primepack? , rasic?, reversave?, satric?, sieget?, sindr ion?, smarti?, smartlewis?, tempfet?, thin q!?, tricore?, trenchstop?, x-gold?, xmm?, x-pmu?, xposys?. other trademarks advance design system? (ads) of agilent tech nologies, amba?, arm?, mu lti-ice?, primecell?, realview?, thumb? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus? , firstgps? of trimble navigation ltd. emv? of emvco, llc (visa holdings inc.). ep cos? of epcos ag. flexgo? of microsoft corporation. flexray? is licensed by flexra y consortium. hyperterminal? of hilgraeve incorpor ated. iec? of commission electrotechnique internationale. irda? of infrared data association corporation. iso? of international organization for standardizati on. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. mi crotec?, nucleus? of mentor graphi cs corporation. mifare? of nxp. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave office? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. openwave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of si rius sattelite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of symbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. tektro nix? of tektronix inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilo g?, palladium? of cadence design systems, inc. vlynq? of texas instruments incorpor ated. vxworks?, wind river? of wind ri ver systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-06-09 BGA713L7 single-band umts lna (700, 800 mhz) revision history: 2010-10-04, revision 3.0 previous revision: 2010-05-26, revision 2.0 page subjects (major cha nges since last revision) all added umts bands xii, xvii and xx specification
BGA713L7 single-band umts lna (700, 800 mhz) table of contents data sheet 4 revision 3.0, 2010-10-04 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2 thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 esd integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.5 band select / gain control truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.6 switching time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.7 supply current and power gain characteri stics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.8 logic signal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.9 measured rf characteristics umts bands xii / xvii . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 2.10 measured rf characteristics umts bands xiii / xiv . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.11 measured rf characteristics umts band xx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.12 measured performance band xiii high gain mode vs. freq uency . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.13 measured performance band xiii high gain mode vs. tem perature . . . . . . . . . . . . . . . . . . . . . . . . 16 2.14 measured performance band xiii low gain mode vs. frequ ency . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.15 measured performance band xiii low gain mode vs. temp erature . . . . . . . . . . . . . . . . . . . . . . . . . 18 3 application circuit and block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.1 umts bands xii and xvii application circu it schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.2 umts bands xiii and xiv app lication circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.3 umts bands xx application circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.4 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.5 application board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4 physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.1 package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.2 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.3 product marking pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table of contents
BGA713L7 single-band umts lna (700, 800 mhz) list of figures data sheet 5 revision 3.0, 2010-10-04 figure 1 block diagram of single-band lna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 2 application circuit with chip outlin e (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 3 application circuit with chip outlin e (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 4 application circuit with chip outlin e (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 5 application board layout on 3-layer fr4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 6 cross-section view of application board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 7 detail of application board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 figure 8 recommended footprint and stenc il layout for the tslp-7-1 package . . . . . . . . . . . . . . . . . . . . 25 figure 9 package outline (top, side and bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 figure 10 marking pattern (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 list of figures
BGA713L7 single-band umts lna (700, 800 mhz) list of tables data sheet 6 revision 3.0, 2010-10-04 table 1 absolute maximum ra tings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 2 thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 3 esd integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 4 dc characteristics, t a = 25 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 5 truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 6 typical switching times; t a = -30 ... 85 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 7 typical characteristics 700 mhz band, t a =25c, v cc =2.8v, r ref =5.6k ? . . . . . . . . . . . . . . 12 table 8 typical characteristics 700 mhz band, t a =25c, v cc =2.8v, r ref =5.6k ? . . . . . . . . . . . . . . 13 table 9 typical characteristics 800 mhz band, t a =25c, v cc =2.8v, r ref =5.6k ? . . . . . . . . . . . . . . 14 table 10 parts list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 11 parts list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 12 parts list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 13 pin definition and function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 list of tables
product name package chip marking BGA713L7 tslp-7-1 t1533 b3 single-band umts ln a (700, 800 mhz) BGA713L7 data sheet 7 revision 3.0, 2010-10-04 1 features main features: ? gain: 15.5 / -10 db in high / low gain mode ? noise figure: 1.1 db in high gain mode ? supply current: 4.8 / 0.5 ma in high / low gain mode ? standby mode (< 2 a typ.) ? output internally matched to 50 ? ? inputs pre-matched to 50 ? ? 2 kv hbm esd protection ? low external component count ? small leadless tslp-7-1 package (2.0 x 1.3 x 0.39 mm) ? pb-free (rohs compliant) package description the BGA713L7 is a low current single -band low noise amplifier mmic for um ts bands xii, xiii, xiv, xvii and xx. the lna is based upon infineon?s proprietary and cost-effective sige:c technology and comes in a low profile tslp-7-1 leadless green package. this document specif ies electrical parameters, pinout, application circuit and packaging of the chip.
BGA713L7 single-band umts lna (700, 800 mhz) features data sheet 8 revision 3.0, 2010-10-04 figure 1 block diagram of single-band lna %*$/b&klsb%o'yvg %ldvlqj /rjlf &lufxlwu\ 5)287 55() 9&& 5),1 9(1 *1' 9*6
BGA713L7 single-band umts lna (700, 800 mhz) electrical characteristics data sheet 9 revision 3.0, 2010-10-04 2 electrical characteristics 2.1 absolute maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 2.2 thermal resistance 2.3 esd integrity table 1 absolute maximum ratings parameter symbol values unit note / test condition min. typ. max. supply voltage v cc -0.3 ? 3.6 v ? supply current i cc ??10ma? pin voltage v pin -0.3 ? v cc +0.3 v all pins except rf input pins pin voltage rf input pins v rfin -0.3 ? 0.9 v ? rf input power p rfin ??4dbm? junction temperature t j ??150c? ambient temperature range t a -30 ? 85 c ? storage temperature range t stg -65 ? 150 c ? table 2 thermal resistance parameter symbol values unit note / test condition min. typ. max. thermal resistance junction to soldering point r thjs ?150?k/w? table 3 esd integrity parameter symbol values unit note / test condition min. typ. max. esd hardness hbm 1) 1) according to jesd22-a114 v esd-hbm ? 2000 ? v all pins
BGA713L7 single-band umts lna (700, 800 mhz) electrical characteristics data sheet 10 revision 3.0, 2010-10-04 2.4 dc characteristics 2.5 band select / gain control truth table 2.6 switching time table 4 dc characteristics, t a =25c parameter symbol values unit note / test condition min. typ. max. supply voltage v cc 2.6 2.8 3.0 v ? supply current high gain mode i cchg ?4.8?ma? supply current low gain mode i cclg ?0.50?ma? supply current standby mode i ccoff ?0.1? a? logic level high v hi 1.5 2.8 ? v all logic pins logic level low v lo ?0.00.5v logic currents i hi ?5.0? a all logic pins i lo ?0.1? a table 5 truth table control voltage state bands xii, xiii, xiv, xvii and xx ven vgs hg lg hl off on h h on off l l standby 1) 1) in order to achieve minimum standby current it is encour aged to apply logic low-level at the vgs pin in standby mode although this is not mandatory. lh table 6 typical switching times; t a = -30 ... 85 c parameter symbol values unit note / test condition min. typ. max. settling time gainstep t gs ?1? s switching lg ? hg
BGA713L7 single-band umts lna (700, 800 mhz) electrical characteristics data sheet 11 revision 3.0, 2010-10-04 2.7 supply current and power gain characteristics supply current high gain mode versus resistance of reference resistor r ref see figure 3 on page 20; low gain mode supply current is independent of reference resistor). 2.8 logic signal characteristics current consumption of logic inputs ven, vgs supply current i cc =f( r ref ) v cc =2.8v power gain |s 21 |=f( r ref ) v cc =2.8v logic currents i en =f( v en ) v cc =2.8v logic currents i gs =f( v gs ) v cc =2.8v 1 10 100 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 r ref [k ? ] icc [ma] 1 10 100 13 13.5 14 14.5 15 15.5 16 r ref [k ? ] power gain [db] 1 10 100 13 13.5 14 14.5 15 15.5 16 r ref [k ? ] power gain [db] 1 10 100 13 13.5 14 14.5 15 15.5 16 r ref [k ? ] power gain [db] 1 10 100 13 13.5 14 14.5 15 15.5 16 r ref [k ? ] power gain [db] 1 10 100 13 13.5 14 14.5 15 15.5 16 r ref [k ? ] power gain [db] 1 10 100 13 13.5 14 14.5 15 15.5 16 r ref [k ? ] power gain [db] 1 10 100 13 13.5 14 14.5 15 15.5 16 r ref [k ? ] power gain [db] 1 10 100 13 13.5 14 14.5 15 15.5 16 r ref [k ? ] power gain [db] 1 10 100 13 13.5 14 14.5 15 15.5 16 r ref [k ? ] power gain [db] 0 0.5 1 1.5 2 2.5 3 0 2 4 6 v en [v] i en [a] 0 0.5 1 1.5 2 2.5 3 0 2 4 6 v gs [v] i gs [a]
BGA713L7 single-band umts lna (700, 800 mhz) electrical characteristics data sheet 12 revision 3.0, 2010-10-04 2.9 measured rf characteristi cs umts bands xii / xvii table 7 typical characteristics 700 mhz band, t a =25c, v cc =2.8v, r ref =5.6k ? 1) 1) performance based on application circuit in figure 2 on page 19 parameter symbol values unit note / test condition min. typ. max. pass band range band xii 728 746 mhz pass band range band xvii 734 746 mhz current consumption i cchg ? 4.8 ? ma high gain mode i cclg ? 0.50 ? ma low gain mode gain s 21hg ? 15.3 ? db high gain mode s 21lg ? -9.9 ? db low gain mode reverse isolation 2) 2) verification based on aql; not 100% tested in production s 12hg ? -40 ? db high gain mode s 12lg ? -9.9 ? db low gain mode noise figure nf hg ? 1.1 ? db high gain mode nf lg ? 9.9 ? db low gain mode input return loss 2) s 11hg ?-13?db50 ?, high gain mode s 11lg ?-14?db50 ?, low gain mode output return loss 2) s 22hg ?-27?db50 ? , high gain mode s 22lg ?-19?db50 ? , low gain mode stability factor 3) 3) guaranteed by device design; not tested in production k ? >2.2 ? dc to 8 ghz; all gain modes input compression point 2) ip 1dbhg ? -7 ? dbm high gain mode ip 1dblg ? -12 ? dbm low gain mode inband iip3 2) f 1 - f 2 =1mhz p f1 = p f2 =-37dbm iip3 hg iip3 lg ?-8 -2 ? dbm high gain mode low gain mode
BGA713L7 single-band umts lna (700, 800 mhz) electrical characteristics data sheet 13 revision 3.0, 2010-10-04 2.10 measured rf characteristi cs umts bands xiii / xiv table 8 typical characteristics 700 mhz band, t a =25c, v cc =2.8v, r ref =5.6k ? 1) 1) performance based on application circuit in figure 3 on page 20 parameter symbol values unit note / test condition min. typ. max. pass band range band xiii 746 756 mhz pass band range band xiv 758 768 mhz current consumption i cchg ? 4.8 ? ma high gain mode i cclg ? 0.50 ? ma low gain mode gain s 21hg ? 15.5 ? db high gain mode s 21lg ? -9.8 ? db low gain mode reverse isolation 2) 2) verification based on aql; not 100% tested in production s 12hg ? -39 ? db high gain mode s 12lg ? -9.8 ? db low gain mode noise figure nf hg ? 1.1 ? db high gain mode nf lg ? 9.8 ? db low gain mode input return loss 2) s 11hg ?-15?db50 ?, high gain mode s 11lg ?-12?db50 ?, low gain mode output return loss 2) s 22hg ?-15?db50 ? , high gain mode s 22lg ?-20?db50 ? , low gain mode stability factor 3) 3) guaranteed by device design; not tested in production k ? >2.3 ? dc to 8 ghz; all gain modes input compression point 2) ip 1dbhg ? -7 ? dbm high gain mode ip 1dblg ? -11 ? dbm low gain mode inband iip3 2) f 1 - f 2 =1mhz p f1 = p f2 =-37dbm iip3 hg iip3 lg ?-7 -2 ? dbm high gain mode low gain mode
BGA713L7 single-band umts lna (700, 800 mhz) electrical characteristics data sheet 14 revision 3.0, 2010-10-04 2.11 measured rf characteristics umts band xx table 9 typical characteristics 800 mhz band, t a =25c, v cc =2.8v, r ref =5.6k ? 1) 1) performance based on application circuit in figure 4 on page 21 parameter symbol values unit note / test condition min. typ. max. pass band range 791 821 mhz current consumption i cchg ? 4.8 ? ma high gain mode i cclg ? 0.50 ? ma low gain mode gain s 21hg ? 15.9 ? db high gain mode s 21lg ? -8.4 ? db low gain mode reverse isolation 2) 2) verification based on aql; not 100% tested in production s 12hg ? -38 ? db high gain mode s 12lg ? -8.4 ? db low gain mode noise figure nf hg ? 1.0 ? db high gain mode nf lg ? 8.4 ? db low gain mode input return loss 2) s 11hg ?-16?db50 ?, high gain mode s 11lg ?-11?db50 ?, low gain mode output return loss 2) s 22hg ?-13?db50 ? , high gain mode s 22lg ?-27?db50 ? , low gain mode stability factor 3) 3) guaranteed by device design; not tested in production k ? >2.3 ? dc to 8 ghz; all gain modes input compression point 2) ip 1dbhg ? -6 ? dbm high gain mode ip 1dblg ? -10 ? dbm low gain mode inband iip3 2) f 1 - f 2 =1mhz p f1 = p f2 =-37dbm iip3 hg iip3 lg ?-8 -1 ? dbm high gain mode low gain mode
BGA713L7 single-band umts lna (700, 800 mhz) electrical characteristics data sheet 15 revision 3.0, 2010-10-04 2.12 measured performance band xiii high gain mode vs. frequency t a =25c, v cc =2.8v, v gs =2.8v, v en =2.8v, r ref =5.6k ? power gain |s 21 |=f ( f ) power gain wideband |s 21 |=f ( f ) matching | s 11 |=f ( f ), | s 22 |=f ( f ) noise figure nf =f ( f ) 0.74 0.745 0.75 0.755 0.76 0.765 0.77 12 13 14 15 16 17 18 frequency [ghz] power gain [db] 0 1 2 3 4 5 6 7 8 ?60 ?50 ?40 ?30 ?20 ?10 0 10 20 frequency [ghz] power gain [db] 0.74 0.745 0.75 0.755 0.76 0.765 0.77 ?30 ?25 ?20 ?15 ?10 ?5 0 frequency [ghz] |s 11 |, |s 22 | [db] s 11 s 22 0.74 0.745 0.75 0.755 0.76 0.765 0.77 0.8 0.9 1 1.1 1.2 1.3 1.4 frequency [ghz] nf [db]
BGA713L7 single-band umts lna (700, 800 mhz) electrical characteristics data sheet 16 revision 3.0, 2010-10-04 2.13 measured performanc e band xiii high gain mode vs. temperature v cc =2.8v, v gs =2.8v, v en =2.8v, f = 750 mhz, r ref =5.6k ? power gain |s 21 |=f ( t a ) supply current i cc =f ( t a ) input compression p1db =f ( t a ) noise figure nf =f ( t a ) ?40 ?20 0 20 40 60 80 100 13 14 15 16 17 18 t a [c] power gain [db] ?40 ?20 0 20 40 60 80 100 3 3.5 4 4.5 5 5.5 6 6.5 7 t a [c] i cc [ma] ?40 ?20 0 20 40 60 80 100 ?12 ?10 ?8 ?6 ?4 ?2 t a [c] p1db [dbm] ?40 ?20 0 20 40 60 80 100 0.6 0.8 1 1.2 1.4 1.6 1.8 t a [c] nf [db]
BGA713L7 single-band umts lna (700, 800 mhz) electrical characteristics data sheet 17 revision 3.0, 2010-10-04 2.14 measured performance band xiii low gain mode vs. frequency t a =25c, v cc =2.8v, v gs =0v, v en =2.8v, r ref =5.6k ? power gain |s 21 |=f ( f ) power gain wideband |s 21 |=f ( f ) matching | s 11 |=f ( f ), | s 22 |=f ( f ) noise figure nf =f ( f ) 0.74 0.745 0.75 0.755 0.76 0.765 0.77 ?13 ?12 ?11 ?10 ?9 ?8 ?7 frequency [ghz] power gain [db] 0 1 2 3 4 5 6 7 8 ?60 ?50 ?40 ?30 ?20 ?10 0 frequency [ghz] power gain [db] 0.74 0.745 0.75 0.755 0.76 0.765 0.77 ?30 ?25 ?20 ?15 ?10 ?5 0 frequency [ghz] |s 11 |, |s 22 | [db] s 11 s 22 0.74 0.745 0.75 0.755 0.76 0.765 0.77 5 6 7 8 9 10 11 frequency [ghz] nf [db]
BGA713L7 single-band umts lna (700, 800 mhz) electrical characteristics data sheet 18 revision 3.0, 2010-10-04 2.15 measured performanc e band xiii low gain mode vs. temperature v cc =2.8v, v gs =0v, v en =2.8v, f = 750 mhz, r ref =5.6k ? power gain |s 21 |=f ( t a ) supply current i cc =f ( t a ) input compression p1db =f ( t a ) noise figure nf =f ( t a ) ?40 ?20 0 20 40 60 80 100 ?13 ?12 ?11 ?10 ?9 ?8 ?7 t a [c] power gain [db] ?40 ?20 0 20 40 60 80 100 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 t a [c] i cc [ma] ?40 ?20 0 20 40 60 80 100 ?20 ?18 ?16 ?14 ?12 ?10 ?8 ?6 ?4 ?2 0 t a [c] p1db [dbm] ?40 ?20 0 20 40 60 80 100 5 6 7 8 9 10 11 t a [c] nf [db]
BGA713L7 single-band umts lna (700, 800 mhz) application circuit and block diagram data sheet 19 revision 3.0, 2010-10-04 3 application circuit and block diagram 3.1 umts bands xii and xvii a pplication circuit schematic figure 2 application circuit wi th chip outline (top view) note: package paddle (pin 7) has to be rf grounded. table 10 parts list part number part type manufacturer size comment l1 ... l2 chip inductor various 0402 wirewound, q 50 c1 ... c4 chip capacitor various 0402 rref chip resistor various 0402 rfout 700 mhz rfin 700 mhz bga 713l 7_appl _bld_bands _xii_xvii.vsd 3 2 1 4 5 6 biasing & logic circuitry rfout rref vcc rfin ven 7gnd vgs c1 3.3 pf c2 100 pf v en = 0 / 2.8 v v gs = 0 / 2.8 v v cc = 2.8 v c4 10nf l2 7 .5nh c3 8.2 pf l1 10 nh r ref 5.6k ?
BGA713L7 single-band umts lna (700, 800 mhz) application circuit and block diagram data sheet 20 revision 3.0, 2010-10-04 3.2 umts bands xiii and xiv a pplication circuit schematic figure 3 application circuit wi th chip outline (top view) note: package paddle (pin 7) has to be rf grounded. table 11 parts list part number part type manufacturer size comment l1 ... l2 chip inductor various 0402 wirewound, q 50 c1 ... c4 chip capacitor various 0402 rref chip resistor various 0402 rfout 700 mhz rfin 700 mhz bga 713l 7_appl _bld_bands _xiii_xiv.vsd 3 2 1 4 5 6 biasing & logic circuitry rfout rref vcc rfin ven 7gnd vgs c1 3.0 pf c2 100 pf v en = 0 / 2.8 v v gs = 0 / 2.8 v v cc = 2.8 v c4 10nf l2 7 .5nh c3 8.2 pf l1 10 nh r ref 5.6k ?
BGA713L7 single-band umts lna (700, 800 mhz) application circuit and block diagram data sheet 21 revision 3.0, 2010-10-04 3.3 umts bands xx applic ation circuit schematic figure 4 application circuit wi th chip outline (top view) note: package paddle (pin 7) has to be rf grounded. table 12 parts list part number part type manufacturer size comment l1 ... l2 chip inductor various 0402 wirewound, q 50 c1 ... c4 chip capacitor various 0402 rref chip resistor various 0402 rfin 800 mhz rfout 800 mhz bga713 l7_ appl_bld_ band_ xx.vsd 3 2 1 4 5 6 biasing & logic circuitry rfout rref vcc rfin ven 7gnd vgs c1 3.3 pf c2 100 pf v en = 0 / 2.8 v v gs = 0 / 2.8 v v cc = 2.8 v c4 10nf l2 9 .1nh c3 8.2 pf l1 9.1nh r ref 5.6k ?
BGA713L7 single-band umts lna (700, 800 mhz) application circuit and block diagram data sheet 22 revision 3.0, 2010-10-04 3.4 pin description table 13 pin definition and function pin no. name pin type buffer type function 1 rfin lna input 2 ven band select control 3 vgs gain step control 4 vcc supply voltage 5 rref bias current reference resistor (high gain mode) 6 rfout lna output 7 gnd ground package paddle; ground connection and control circuitry
BGA713L7 single-band umts lna (700, 800 mhz) application circuit and block diagram data sheet 23 revision 3.0, 2010-10-04 3.5 application board figure 5 application board layout on 3-layer fr4 note: top layer thickness: 0.2 mm, bo ttom layer thickness: 0.8 mm, 17 mm cu metallization, gold plated. board size: 21 x 18 mm. figure 6 cross-section view of application board %*$/b$ssb%rdugyvg 7rsod\huwrsylhz 0lggohod\huwrsylhz %rwwrpod\huwrsyl hz %*$/b&urvvb6hfwlrqb9lhzyvg pp&rsshu pp3uhsuhj)5 pp3uhsuhj)5 pp&rsshu pp)5 pp3uhsuhj)5 pp3uhsuhj)5 pp&rsshu
BGA713L7 single-band umts lna (700, 800 mhz) application circuit and block diagram data sheet 24 revision 3.0, 2010-10-04 figure 7 detail of application board layout note: in order to achieve the same performance as given in this datasheet please follow the suggested pcb-layout as closely as possible. the position of th e gnd vias is critical for rf performance. %*$/b$ssb%rdugbh[dfwyvg 5),1 9(1 9*6 9&& 55() 5)287 *1'
BGA713L7 single-band umts lna (700, 800 mhz) physical characteristics data sheet 25 revision 3.0, 2010-10-04 4 physical characteristics 4.1 package footprint figure 8 recommended footprint and stencil layout for the tslp-7-1 package 4.2 package dimensions figure 9 package outline (top, side and bottom view) 0.25 1.4 1.9 0.25 0.2 0.25 0.25 0.2 1.4 1.9 0.3 0.3 0.3 0.2 0.2 0.2 0.2 0.2 stencil apertures copper solder mask r0.1 0.25 1.4 1.9 0.25 0.2 0.25 0.25 0.2 1.4 1.9 0.3 0.3 0.3 0.2 0.2 0.2 0.2 0.2 stencil apertures copper solder mask r0.1 smd nsmd tslp-7-1-fp v01 0.05 max. +0.1 0.4 1) dimension applies to plated terminal 0.035 1.2 0.05 1 0.05 1.3 0.05 1.7 0.05 2 6 x 0.2 0.035 1) 6 x 0.2 0.035 1) 0.035 1.1 1) 456 1 2 3 7 1) top view bottom view pin 1 marking tslp-7-1-po v04
BGA713L7 single-band umts lna (700, 800 mhz) physical characteristics data sheet 26 revision 3.0, 2010-10-04 4.3 product marking pattern figure 10 marking pattern (top view) %*$/b0dunlqjb/d\rxwyvg % %*$/ 7\shfrgh &: 'dwhfrgh<<:: 3lqpdunlqj /dvhupdunlqj
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