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SQ4483EEY www.vishay.com vishay siliconix s12-1848-rev. b, 30-jul-12 1 document number: 67090 for technical questions, contact: automostechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 automotive p-channel 30 v (d-s) 175 c mosfet features ?trenchfet ? power mosfet ? esd protection: 3000 v ?100 % r g and uis tested ? aec-q101 qualified c ? material categorization: ? for definitions of compliance please see www.vishay.com/doc?99912 notes a. pulse test; pulse width ? 300 s, duty cycle ? 2 %. b. when mounted on 1" sq uare pcb (fr- 4 material). c. parametric verification ongoing. product summary v ds (v) - 30 r ds(on) ( ? ) at v gs = - 10 v 0.0085 r ds(on) ( ? ) at v gs = - 4.5 v 0.0200 i d (a) - 22 configuration single p-channel 5400 d s g so-8 sd sd sd gd 5 6 7 8 top view 2 3 4 1 ordering information package so-8 lead (pb)-free and halo gen-free SQ4483EEY-t1-ge3 absolute maximum ratings (t c = 25 c, unless otherwise noted) parameter symbol limit unit drain-source voltage v ds - 30 v gate-source voltage v gs 20 continuous drain current t c = 25 c i d - 22 a t c = 125 c - 13 continuous source curr ent (diode conduction) i s - 6 pulsed drain current a i dm - 84 single pulse avalanche current l = 0.1 mh i as - 50 single pulse avalanche energy e as 125 mj maximum power dissipation a t c = 25 c p d 7 w t c = 125 c 2 operating junction and storage temperature range t j , t stg - 55 to + 175 c thermal resistance ratings parameter symbol limit unit junction-to-ambient pcb mount b r thja 85 c/w junction-to-foot (drain) r thjf 21
SQ4483EEY www.vishay.com vishay siliconix s12-1848-rev. b, 30-jul-12 2 document number: 67090 for technical questions, contact: automostechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes a. pulse test; pulse width ? 300 s, duty cycle ? 2 %. b. guaranteed by design , not subject to production testing. c. independent of operating temperature. ? ? ? ? ? stresses beyond those listed under absolute maximum ratings ma y cause permanent damage to th e device. these are stress rating s only, and functional operation of the device at these or any other condit ions beyond those indicated in the operatio nal sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended pe riods may affect device reliability. ? specifications (t c = 25 c, unless otherwise noted) parameter symbol test condi tions min. typ. max. unit static drain-source breakdown voltage v ds v gs = 0 v, i d = - 250 a - 30 - - v gate-source threshold voltage v gs(th) v ds = v gs , i d = - 250 a - 1.5 - 2.0 - 2.5 gate-source leakage i gss v ds = 0 v, v gs = 20 v - - 1 ma v ds = 0 v, v gs = 12 v - - 2 a zero gate voltage drain current i dss v gs = 0 v v ds = - 30 v - - - 1 v gs = 0 v v ds = - 30 v, t j = 125 c - - - 50 v gs = 0 v v ds = - 30 v, t j = 175 c - - - 150 on-state drain current a i d(on) v gs = - 10 v v ds ??? - 5 v - 30 - - a drain-source on-state resistance a r ds(on) v gs = - 10 v i d = - 10 a - 0.0070 0.0085 ? v gs = - 10 v i d = - 10 a, t j = 125 c - - 0.0130 v gs = - 10 v i d = - 10 a, t j = 175 c - - 0.0150 v gs = - 4.5 v i d = - 7 a - 0.0160 0.0200 forward transconductance b g fs v ds = - 10 v, i d = - 10 a - 32 - s dynamic b output capacitance c oss v gs = 0 v v ds = - 15 v, f = 1 mhz - 712 890 pf total gate charge c q g v gs = - 10 v v ds = - 15 v, i d = - 10 a - 75 113 nc gate-source charge c q gs -9.5- gate-drain charge c q gd -19- gate resistance r g f = 1 mhz 6 12.82 20 ? turn-on delay time c t d(on) v dd = - 15 v, r l = 1.5 ? i d ? - 10 a, v gen = - 10 v, r g = 1 ? -3857 ns rise time c t r - 82 123 turn-off delay time c t d(off) - 134 201 fall time c t f - 178 214 source-drain diode ratings and characteristics b pulsed current a i sm --- 84a forward voltage v sd i f = - 3 a, v gs = 0 v - - 0.75 - 1.2 v SQ4483EEY www.vishay.com vishay siliconix s12-1848-rev. b, 30-jul-12 3 document number: 67090 for technical questions, contact: automostechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 typical characteristics (25 c, unless otherwise noted) gate current vs. gate-source voltage output characteristics on-resistance vs. drain current gate current vs. ga te-source voltage transfer characteristics capacitance 0.000 0.001 0.002 0.003 0.004 0.005 0 7 14 21 28 35 i gss - g ate current (a) v gs - g ate-to- s ource voltage (v) t j = 25 c 0 20 40 60 80 0 2 4 6 8 10 i d - drain current (a) v d s -drain-to- s ource voltage (v) v gs = 10 v thru 4 v v gs = 3 v 0.00 0.01 0.02 0.03 0.04 0.05 0 14 28 42 56 70 r d s (on) -on-re s i s tance () i d -drain current (a) v gs = 4.5 v v gs gss - g ate current (a) v gs - g ate-to- s ource voltage (v) t j = 25 c t j = 150 c 10 -10 10 -9 10 - 8 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 0 10 20 30 40 50 0 1 2 3 4 5 i d - drain current (a) v gs - g ate-to- s ource voltage (v) t c = - 55 c t c = 125 c t c = 25 c 0 600 1200 1800 2400 3000 0 5 10 15 20 25 30 c - capacitance (pf) v d s -drain-to- s ource voltage (v) c o ss SQ4483EEY www.vishay.com vishay siliconix s12-1848-rev. b, 30-jul-12 4 document number: 67090 for technical questions, contact: automostechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 typical characteristics (25 c, unless otherwise noted) gate charge source drain diode forward voltage threshold voltage on-resistance vs. junction temperature on-resistance vs. gate-to-source voltage drain source breakdown vs . junction temperature 0 2 4 6 8 10 0 20 40 60 80 100 v gs - g ate-to- s ource voltage (v) q g - total g ate charge (nc) i d = 10 a v d s = 15 v 0.001 0.01 0.1 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 i s - s ource current (a) v s d - s ource-to-drain voltage (v) t j = 25 c t j = 150 c -0.5 -0.2 0.1 0.4 0.7 1.0 - 50 - 25 0 25 50 75 100 125 150 175 v gs (th) variance (v) t j -temperature ( c) i d = 250 a i d = 5 ma 0.5 0.8 1.1 1.4 1.7 2.0 - 50 - 25 0 25 50 75 100 125 150 175 r d s (on) -on-re s i s tance (normalized) t j - junction temperature ( c) i d = 10 a v gs gs s (on) -on-re s i s tance () v gs - g ate-to- s ource voltage (v) t j = 150 c t j = 25 c -40 -38 -36 -34 -32 -30 -50-250 255075100125150175 v d s -drain-to- s ource voltage (v) t j - junction temperature ( c) i d = 1 ma SQ4483EEY www.vishay.com vishay siliconix s12-1848-rev. b, 30-jul-12 5 document number: 67090 for technical questions, contact: automostechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 thermal ratings (t a = 25 c, unless otherwise noted) safe operating area normalized thermal transient impedance, junction-to-ambient 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 i d - drain current (a) v d s -drain-to- s ource voltage (v) * v gs > minimum v gs at which r d s (on) i s s pecied 10 m s limited by r d s (on) * 100 s i dm limited t c = 25 c s ingle pul s e bvd ss limited 1 m s 10 s , dc 1 s 100 m s 10 -3 10 -2 1 10 600 10 -1 10 -4 100 2 1 0.1 0.01 0.2 0.1 0.05 0.02 single pulse duty cycle = 0.5 square wave pulse duration (s) e v i t c e f f e d e z i l a m r o n t n e i s n a r t e c n a d e p m i l a m r e h t 1. duty cycle, d = 2. per unit base = r thja = 8 5 c/w 3. t jm - t a = p dm z thja (t) t 1 t 2 t 1 t 2 notes: 4. surface mounted p dm SQ4483EEY www.vishay.com vishay siliconix s12-1848-rev. b, 30-jul-12 6 document number: 67090 for technical questions, contact: automostechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 thermal ratings (t a = 25 c, unless otherwise noted) normalized thermal transient impedance, junction-to-foot note ? the characteristics shown in the two graphs ? - normalized transient thermal impedance junction-to-ambient (25 c) ? - normalized transient thermal impedance junction-to-foot (25 c) ? are given for general guidelines only to enable the user to get a ball park indication of part capabilities. the data are ext racted from single pulse transient thermal impedance characteristics which are developed from empirical measurements. the latter is valid for the part mounted on printed circ uit board - fr4, size 1" x 1" x 0. 062", double sided with 2 oz. copper, 100 % on both sides. the part ca pabilities can widely vary depending on actual application parameters and operating conditions. ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? vishay siliconix maintains worldwide manufactu ring capability. products may be manufact ured at one of seve ral qualified locatio ns. reliability data for silicon technology and package reliability represent a composite of all qualified locations. for related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?67090 . 10 -3 10 -2 110 10 -1 10 -4 2 1 0.1 0.01 0.2 0.1 0.05 0.02 single pulse duty cycle = 0.5 square wave pulse duration (s) e v i t c e f f e d e z i l a m r o n t n e i s n a r t e c n a d e p m i l a m r e h t vishay siliconix package information document number: 71192 11-sep-06 www.vishay.com 1 dim millimeters inches min max min max a 1.35 1.75 0.053 0.069 a 1 0.10 0.20 0.004 0.008 b 0.35 0.51 0.014 0.020 c 0.19 0.25 0.0075 0.010 d 4.80 5.00 0.189 0.196 e 3.80 4.00 0.150 0.157 e 1.27 bsc 0.050 bsc h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 l 0.50 0.93 0.020 0.037 q0808 s 0.44 0.64 0.018 0.026 ecn: c-06527-rev. i, 11-sep-06 dwg: 5498 4 3 1 2 5 6 8 7 h e h x 45 c all le a d s q 0.101 mm 0.004" l ba 1 a e d 0.25 mm (g a ge pl a ne) s oic (narrow): 8-lead jedec p a rt n u m b er: m s -012 s vishay siliconix trenchfet ? power mosfets application note 808 mounting little foot ? , so-8 power mosfets application note document number: 70740 www.vishay.com revision: 18-jun-07 1 wharton mcdaniel surface-mounted little foot power mosfets use integrated circuit and small-signal packages which have been been modified to provide the heat transfer capabilities required by power devices. leadframe materials and design, molding compounds, and die attach materials have been changed, while the footpr int of the packages remains the same. see application note 826, recommended minimum pad patterns with outline drawin g access for vishay siliconix mosfets, ( http://www.vishay.com/ppg?72286 ), for the basis of the pad design for a little foot so-8 power mosfet. in converting this recommended minimum pad to the pad set for a power mosfet, designers must make two connections: an electrical connection and a thermal connection, to draw heat away from the package. in the case of the so-8 p ackage, the thermal connections are very simple. pins 5, 6, 7, and 8 are the drain of the mosfet for a single mosfet package and are connected together. in a dual package, pi ns 5 and 6 are one drain, and pins 7 and 8 are the other drain. for a small-signal device or integrated circuit, typical co nnections would be made with traces that are 0.020 inches wi de. since the drain pins serve the additional function of providing the thermal connection to the package, this level of connection is inadequate. the total cross section of the copp er may be adequate to carry the current required for the a pplication, but it presents a large thermal impedance. also , heat spreads in a circular fashion from the heat source. in this case the drain pins are the heat sources wh en looking at heat spread on the pc board. figure 1. single mosfet so-8 pad pattern with copper spreading figure 2. dual mosfet so-8 pad pattern with copper spreading the minimum recommended pad patterns for the single-mosfet so-8 with copp er spreading (figure 1) and dual-mosfet so-8 with copper spreading (figure 2) show the starting point for utilizing th e board area available for the heat-spreading copper. to creat e this pattern, a plane of copper overlies the drain pins . the copper plane connects the drain pins electrically, but more importantly provides planar copper to draw heat fr om the drain leads and start the process of spreading the heat so it can be dissipated into the ambient air. these patterns use all the available area underneath the body for this purpose. since surface-mounted packag es are small, and reflow soldering is the most comm on way in which these are affixed to the pc board, ?t hermal? connections from the planar copper to the pads have not been used. even if additional planar copper area is used, there should be no problems in the soldering process. the actual solder connections are defined by the solder mask openings. by combining the basic footprint wi th the copper plane on the drain pins, the solder mask ge neration occurs automatically. a final item to keep in mind is the width of the power traces. the absolute minimum pow er trace width must be determined by the amount of current it has to carry. for thermal reasons, this minimum width should be at least 0.020 inches. the use of wide traces connected to the drain plane provides a low impedance path for heat to move away from the device. 0.027 0.69 0.07 8 1.9 8 0.2 5.07 0.196 5.0 0.2 88 7.3 0.050 1.27 0.027 0.69 0.07 8 1.9 8 0.2 5.07 0.0 88 2.25 0.2 88 7.3 0.050 1.27 0.0 88 2.25 application note 826 vishay siliconix www.vishay.com document number: 72606 22 revision: 21-jan-08 application note recommended minimum pads for so-8 0.246 (6.248) recommended mi nimum pads dimensions in inches/(mm) 0.172 (4.369) 0.152 (3.861) 0.047 (1.194) 0.028 (0.711) 0.050 (1.270) 0.022 (0.559) return to index return to index legal disclaimer notice www.vishay.com vishay revision: 12-mar-12 1 document number: 91000 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. vishay intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, vishay), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. vishay makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, vi shay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on vishays knowledge of typical requirements that are often placed on vishay products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify vish ays terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the vi shay product could result in personal injury or death. customers using or selling vishay products no t expressly indicated for use in such applications do so at their own risk and agr ee to fully indemnify and hold vishay and it s distributors harmless from and against an y and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale , including attorneys fees, even if such claim alleges that vis hay or its distributor was negligent regarding th e design or manufacture of the part. please contact authorized vishay personnel t o obtain written terms and conditions regardin g products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of vishay. product names and markings noted herein may be trad emarks of their respective owners. material category policy vishay intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some vishay documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. |
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