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1/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. high-performance re gulators for pcs switching regulator with mos fet for ddr-sdram cores bd95513muv description bd95513muv is a switching regulator capable of supplying high cu rrent output (up to 3a) at low output voltages (0.7v~5.0v) over a broad range of input voltages (4 .5v~28v). the regulator features an intern al n-mosfet power transistor for high efficiency and low space consumption, wh ile incorporating rohm?s proprietary h 3 reg tm control mode technology, yielding the industry?s fastest transient response time against load changes. sllm tm (simple light load mode) technology is also integrated to improve efficiency when powering lighter loads, as well as soft start, variable frequency, short-circuit protecti on with timer latch, over-voltage protection, and ref f unctions. this regulator is suited for pc applications. features 1) internal low on-resistance power n-mosfet 2) internal 5v linear voltage regulator 3) integrated h 3 reg tm dc/dc converter controller 4) selectable simple light load mode (sllm tm ), quiet light load mode (qllm) and forced continuous mode 5) built-in thermal shutdown, low input, current over load, output over- and under-voltage protection circuitry 6) soft start function to minimize rush current during startup 7) adjustable switching frequency (f = 200 khz ~ 1000 khz) 8) built-in output discharge function 9) vqfn032v5050 package size 10) tracking function 11) internal bootstrap diode applications mobile pcs, desktop pcs, lcd-tv, digital household electronics no.10030eat37
technical note bd95513muv 2/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. absolute maxi mum ratings (ta = 25 ) parameter symbol ratings unit input voltage 1 v cc 7 *1 v input voltage 2 v dd 7 *1 v input voltage 3 v in 30 *1 v external v cc voltage extv cc 7 *1 v boot voltage boot 35 v boot-sw voltage boot-sw 7 *1 v output feedback voltage fb v cc v ss/fs/mode voltage ss/fs/mode v cc v v reg voltage v reg v cc v en/ctl input voltage en/ctl 7 *1 v pgood voltage pgood 7 *1 v output current (average) i sw 3 *1 a power dissipation 1 p d1 0.38 *2 w power dissipation 2 p d2 0.88 *3 *6 w power dissipation 3 p d3 2.06 *4 *6 w power dissipation 4 p d4 4.56 *5 *6 w operating temperature range t opr -10 ~ +100 storage temperature range t stg -55 ~ +150 junction temperature t jmax +150 *1 do not exceed pd. *2 ta R 25 (ic only), power dissipated at 3.0 mw/ . *3 ta R 25 (single-layer board, 20.2 mm 2 copper heat dissipation pad), power dissipated at 7.0 mw/ . *4 ta R 25 (4-layer board, 10.29 mm 2 copper heat dissipation pad on top layer, 5505 mm 2 pad on 2nd and 3rd layer), power dissipated at 16.5 mw/ . *5 ta R 25 (4-layer board, all layers with 5505 mm 2 copper heat dissipation pads), power dissipated at 36.5 mw/ . *6 values observed with chip backside soldered. when unsoldered, power dissipation is lower. operating conditions (ta = 25 ) parameter symbol ratings unit min max input voltage 1 v cc 4.5 5.5 v input voltage 2 v dd 4.5 5.5 v input voltage 3 v in 4.5 28 v external v cc voltage extv cc 4.5 5.5 v boot voltage boot 4.5 33 v sw voltage sw -0.7 28 v boot-sw voltage boot-sw 4.5 5.5 v mode input voltage mode 0 5.5 v en/ctl input voltage en/ctl 0 5.5 v pgood voltage pgood 0 5.5 v minimum on time t onmin - 100 ns this product is not designed for use in a radioactive environment.
technical note bd95513muv 3/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. electrical characteristics (unless otherwise noted, t a =25 , av in =12v, v cc =v dd =v reg , en/ctl=5v, mode=0v, r fs =180k ? ) parameter symbol limits unit condition min. typ. max. [whole device] av in bias current 1 i in 1 - 1200 1800 a av in bias current 2 i in 2 - 150 250 a extv cc =5v av in standby current i in stb - 0 10 a ctl=en=0v en low voltage enlow gnd - 0.8 v en high voltage enhigh 2.3 - 5.5 v en bias voltage i en - 12 20 a ctl low voltage ctllow gnd - 0.8 v ctl high voltage ctlhigh 2.3 - 5.5 v ctl bias current i ctl - 1 6 a [5v regulator] v reg input voltage v reg 4.90 5.00 5.10 v v in =6.0 to 25v i reg =0 to 100ma maximum current i reg 100 - - ma [5v switch] extv cc input threshold voltage ev cc _ uvlo 4.2 4.4 4.6 v extv cc :sweep up switch resistance r evcc - 1.0 2.0 [under-voltage lockout protection] av in threshold voltage av in _ uvlo 4.1 4.3 4.5 v v cc :sweep up av in hysteresis voltage dav in _ uvlo 100 160 220 mv v cc :sweep down v reg threshold voltage v reg_ uvlo 4.1 4.3 4.5 v v reg :sweep up v reg hysteresis voltage dv reg_ uvlo 100 160 220 mv v reg :sweep down [h 3 reg tm control block] on time ton 400 500 600 nsec max on time tonmax 10.0 22.0 40.0 sec min off time toffmin - 450 550 nsec [fet block] high-side on resistance ron_high - 120 200 m low-side on resistance ron_low - 120 200 m [scp block] scp startup voltage v scp 0.420 0.490 0.560 v when v fb : 30% down delay t scp - 1 - ms
technical note bd95513muv 4/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. parameter symbol limits unit condition min. typ. max. [over-voltage protection block] ovp detect voltage v ovp 0.812 0.840 0.868 v when v fb : 20% up [soft start block] charge current iss 1.4 2.2 3.0 a standby voltage vss_stb - - 100 mv [current regulation block] maximum output current i ocp 3 - - a [voltage detection block] feedback terminal voltage 1 v fb 1 0.693 0.700 0.707 v feedback terminal voltage 2 v fb 2 0.690 0.700 0.710 v t a =-10 to 100 i out = 0a to 3a feedback terminal bias current i fb -100 0 100 na [mode block] sllm tm condition vth sllm v cc -0.5 - v cc v sllm tm longest low-gate off time: forced continuous mode vth cont gnd - 0.5 v continuous mode [power good block] v fb power good low voltage v fb pl 0.605 0.63 0.655 v when v fb : 10% down v fb power good high voltage v fb ph 0.745 0.77 0.795 v when v fb : 10% up
technical note bd95513muv 5/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. reference data fig.4 transient response (v in =7v, v out =2.5v) fig.5 transient response (v in =12v, v out =2.5v) fig.6 transient response (v in =19v, v out =2.5v) fig.7 transient response (v in =7v, v out =2.5v) fig.8 transient response (v in =12v, v out =2.5v) fig.9 transient response (v in =19v, v out =2.5v) fig.10 sllm tm mode (i out =0a) fig.11 sllm tm mode (i out =0.4a) fig.12 1 sllm tm mode (i out =1a) fig.1 io-efficiency (v in =7v,v out =2.5v) 0 20 40 60 80 100 0.01 0.1 1 10 io [a] [%] sllm tm continuous mode qllm 0 20 40 60 80 100 0. 01 0. 1 1 10 io [a] [%] sllm tm continuous mode qllm 0 20 40 60 80 100 0.01 0.1 1 10 io [a] [%] sllm tm continuous mode qllm v out (50mv/div) sw (10v/div) i out (2a/div) v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div 2sec/div v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div fig.3 io-efficiency (v in =19v,v out =2.5v) fig.2 io-efficiency (v in =12v,v out =2.5v) v out i l hg lg 2sec/div v out (50mv/div) sw (10v/div) i out (2a/div) 2sec/div v out i l hg lg 2sec/div v out i l hg lg 2sec/div
technical note bd95513muv 6/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. reference data 10sec/div fig.15 pgood rising waveform fig.16 pgood falling waveform fig.18 v in change (5 19v) fig.19 v in change (19 5v) fig.20 en wake up fig.17 scp timer latch waveform v out 2[v/div] en pgood 200sec/div pgood en v out 2[v/div] 2msec/div sw v out 2[v/div] i l 5[a/div] 200sec/div sw en v reg 2[v/div] v out 2[v/div] 400sec/div fig.13 qllm mode (i out =0a) fig.14 qllm mode (i out =1a) v out sw 10sec/div v out hg/lg v in hg/lg v out v in
technical note bd95513muv 7/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. block diagram v reg reference block delay h3reg tm controller bloc k r s q driver circuit power good 5v reg thermal protection boot v in sw v dd pgnd ce v out v out en/uvlo gnd mode mode tsd ilim fs v reg uvlo ilim scp tsd extv cc fb pgood ref(0.7v) ctl en v in a v in ss v dd ss soft start ovp ref 1.2 fb scp uvlo v reg av in v ref 0.85 v ss 0.85 v out mode en ss a v in v reg ocp v reg v cc mode mode 13 7 16 5 10 8 17 6 18 14 15 11 9 12 19 20 21 1 2 3 4 26 27 28 30 31 22 23 24 25 32 29 v in (4.5 28v) hg lg
technical note bd95513muv 8/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. pin configuration pin function table pin no. pin name pin function 1-4 v in battery voltage input (4.5 ~ 28 v) 5 boot hg driver power supply 6 pgood power good output (high when output 10% of regulation) 7 av in battery voltage sense 8 ctl linear regulator on/off (high = 5.0v, low = off) 9 mode control mode selection gnd : continuous mode 3.0v : qllm v cc : sllm tm 10 en enable output (high when v out on) 11 fs switching frequency adjustment(r fs = 30 k ~ 100 k ) 12 gnd sense ground 13 v cc power supply input 14 extv cc external power supply input 15 v reg ic reference voltage (5.0v / 200ma) 16 ss soft start condenser input 17 ref output reference voltage (0.7 v) 18 fb feedback input (0.7 v) 19 v out voltage discharge output 20 n.c. - 21 v dd power supply input (5 v) 22-25 pgnd power ground 26-31 sw output to inductor 32 pgnd power ground underside fin substrate connection 31 30 29 26 25 22 21 20 19 18 17 9 10 11 12 13 14 1 2 3 4 5 6 v in v in v in v in boot pgood pgnd v dd ce v out fb ref mode en fs gnd v cc extvcc sw sw sw sw sw pgnd 7 av in 8 ctl 15 v reg 16 ss 23 pgnd 24 pgnd 27 sw 28 32 pgnd *connect the underside (fin) to the ground terminal
technical note bd95513muv 9/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. pin descriptions ?v cc this pin supplies power to the ic?s internal circuitry, excluding the fet driver. the input supply voltage range is 4.5 to 5.5v, with a maximum current draw of 900a. this pin should be bypassed with a capacitance of approximately 0.1f. ?en enables or disables the switching regulator. when the volt age on this pin reaches 2.3 v or higher, the internal switching regulator is turned on. at voltages less th an 0.8 v, the regulator is turned off. ?v dd this pin supplies power to the low side of the fet driver, as well as to the bootstrap diode. as the diode draws its peak current when switching on or off, this pin should be bypassed with a capacitance of approximately 1 f. ?v reg output pin from the 5 v linear regulator. this pin also supplie s power to the internal driver and control circuitry. v reg standby function is controlled by the ctl pin. the output supplies 5v at 100 ma and should be bypassed to ground using a 10 f capacitor with a rating of x5r or x7r. ? extv cc external power supply input for the linear regulator. when the voltage on the extv cc pin exceeds 4.4 v, the regulator uses it in conjunction with other power sources to supply v reg . leave the extv cc pin floating when not in use. ?ref reference voltage output pin. the reference voltage is set in ternally by the ic to 0.7 v, and the ic works to keep v ref approximately equal to v fb . variations in voltage levels on this pin af fect the output voltage, so the pin should be bypassed with a 100 pf ~ 0.1 f ceramic capacitor. ?ss soft start/stop pin. when en is set high, the capacitor between the internal current source and ss-gnd controls the startup time of the ic. when the volt age on the ss pin is lower than the ref output voltage (0.7 v), the output voltage is held at the same voltage as the ss pin. ?av in the bd95513muv controls the duty cycl e and output voltage based upon the input voltage at this pin, so voltage variations or oscillations on this line can cause operation to bec ome unstable. this pin also acts as the voltage input for the switching block, so insufficient coupling impedance can al so cause operation to become unstable. therefore, this line should be bypassed with either a power capacitor or rc filter. ?fs frequency-adjusting resistance input pin. attaching a resistance of 30 k ~ 100 k ? adjusts the switching frequency from 200 khz ~ 1 mhz. ?boot this pin serves as the power source for the high side of t he fet driver. a bootstrap diode is integrated within the ic. the maximum voltage on this pin should not exceed +30 v vs . gnd or +7 v vs. sw. when operating the switching regulator, the operation of t he bootstrap circuitry causes the boot voltage to swing from (v in + v dd ) ~ v dd . ? pgood power good indicator. this open-drain output should be connected via a 100 k ? pull-up resistor. ?mode mode selection pin. when low, the ic functions in forced-c ontinuous mode; at voltages from 0v ~ 3v, qllm mode; when high, sllm tm mode. ? ctl linear regulator control pin. when voltage is 2.3 v or hig her, a logic high is recognized and the internal regulator (v reg = 5 v) is switched on. at voltages of 0.8 v or lower, a logic low is recogni zed and the regulator is switched off. however, even if en is logic high, the switchi ng regulator will not operate if ctl is logic low. ?fb output voltage feedback input. v fb is held at 0.7 v by the ic. ?sw output from the switching regulator to t he inductor. this output swings from v in ~ gnd. the trace from the output to the inductor should be as short and wide as possible. ?v out voltage output discharge pin. when en is off, this output is pulled low. ?v in power supply input. the ic can accept any input from 4.5 v to 28 v. this pin should be bypassed directly to ground by a power capacitor. ?pgnd power ground terminal.
technical note bd95513muv 10/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. operation the bd95513muv is a switching regulator incorporating rohm?s proprietary h 3 reg tm controlla control system. when v out drops suddenly due to changes in load, the system quickly restores the output voltage by extending the t on time interval. this improves the regulator?s transient response. when light-load mode is activated, the ic employs the simple light load mode (sllm tm ) controller, further improving system efficiency. h 3 reg tm control (normal operation) (rapid changes in load) light load control (sllm tm mode) (qllm mode) v fb v ref hg lg high gate output is determined by the above formula. when v fb falls below the reference voltage (0.7v), the h 3 reg tm controlla is activated; v fb v ref hg io lg t on + when v out drops due to a sudden change in load and the voltage remains below v ref after the preprogrammed t on time interval has elapsed, the system quickly restores v out by extending the t on time, thereby improvin g transient response. t on = v ref v in 1 f [sec] ???(1) sllm tm mode is enabled by setting the mode pin to logic high. when the low gate is off and the current through the inductor is 0 (current flowing from v out to sw), the sllm tm function is activated, disabling high gate output. if v fb falls below v ref again, the high gate is switched back on, lowering the switching frequency of the regulator and yielding higher efficiency when powering light loads. v fb v ref hg lg 0 a qllm mode is enabled by setting the mode pin to hiz or middle voltage. when the lower gate is off and the current through the inductor is 0 (current flowing from v out to sw), qllm mode is activated, disabling high gate output. if v fb falls below v ref within a programmed time interval (typ. 40 s), the high gate is switched on, but if v fb does not fall below v ref , the lower gate is forced on, dropping v fb and switching the high gate back on. the minimum switching frequency is set to 25 khz (t = 40 s), which keeps the regulator?s frequency from entering the audible spectrum but yields less efficient results than sllm tm mode. v fb v ref hg lg 0 a
technical note bd95513muv 11/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. timing chart ? soft start function ? timer latch-type short circuit protection ? output over-voltage protection the soft start function is enabled when the en pin is set high. current control circuitry takes ef fect at startup, yielding a moderate ?ramping start? in output voltage. soft start timing and incoming current are given by equation (2) and (3) below: when output voltage falls to v ref x 0.70 or less, the output short circuit protection engages, turning the ic off after a set period of time to prevent internal damage. when en is switched back on or when uvlo is cleared, output continues. the time period before shutting off is set internally at 1ms. soft start period: t ss = v ref css 2a(typ) [sec] rush current: i in (on)= cov out tss [a] (css: soft start capacitor; co: output capacitor) ???(2) ???(3) when output reaches or exceeds v ref x 1.2, the output over-voltage protection is engaged, turning the low-side fet completely on to reduce the output (low gate on, high gate off). when the output falls, it returns to standard mode. en ss v ou t i in t ss v out hg lg v ref 1.2 switching v out scp en/uvlo 1ms v ref 0.70
technical note bd95513muv 12/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. external component selection 1. inductor (l) selection * passing a current larger than the inductor?s rated current will cause magnetic saturation in the inductor and decrease system efficiency. in selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the inductor?s rated current value. * to minimize possible inductor damage and maximize efficiency, choose an inductor with a low dcr and acr resistance. 2. output capacitor selection (c o ) give special consideration to the conditions of formula (7) fo r output capacitance. also, keep in mind that the output rise time must be established within the soft start timeframe. choosing a capacitance that is too large can cause startup ma lfunctions, or in some cases, may engage the short circuit protection. 3. input capacitor selection (c in ) a low-esr capacitor is recommended to re duce esr loss and maximize efficiency. the inductor?s value directly influences the output ripple current. a s formula (4) indicates below, the greater the inductance or switching frequency, the lower the ripple current: i l = (v in -v out )v out l v in f [ a ] ??? ( 4 ) the proper output ripple current se tting is about 30% of maximum output current. i l =0.3 i out max. [a] ???(5) l= (v in -v out )v out i l v in f [h] ???(6) (i l : output ripple current, f: switching frequency) when determining the proper output capacitor, be sure to factor in the equivalent series resistance (esr) and equivalent series inductance (esl) required to set the output ripple voltage at 20 mv or more. when selecting the limit of the inductor, be sure to allow enough margin for the output voltage. out put ripple voltage is determined by formula (7) below: v out = i l esr+esl i l / t on ??? (7) (i l : ouput ripple current, esr: equivalent series resistance, esl: equivalent series inductance) tss: soft start timeframe (see p. 10, equation (2)) i limit : maximum output current input capacitor in order to prevent extreme over-current conditions, the input capacitor must have a low enough esr to fully support a large ripple in the output. the formula for rms ripple current (i rms ) is given by equation (9) below: when v in =2 v out , i rms = i out 2 esl v in l co v out esr output capacitor v in l co v out c in i l v in i l l co v out output ripple current coQ tss (i limit -i out ) v out ??? ( 8 ) i rms =i out v in ( v in -v out ) v in [a] ??? ( 9 )
technical note bd95513muv 13/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. 0 50 100 150 200 250 300 350 400 450 500 50 100 150 200 250 300 rfs[k] frequency [khz] 5v 7v 12v 19v 25v from top: v in = 4. frequency adjustment the bd95513muv operates by feeding the output voltage back thro ugh a resistive voltage divider. the output voltage is set by the following equation (see schematic below): output voltage = the switching frequency is also amplified by the same resistive voltage divider network: f sw = (frequency set by r fs ) [hz] ???(12) the resistance connected to the fs terminal adjusts the on-time (t on ) during normal operation as illustrated to the left. when t on , input voltage and v ref voltage are known, the switching frequency can be determined by the following formula: nnn (10) however, real-life considerations (such as external mosfet gate capacitance and switching time) must be factored in as they affect the overall switching rise and fall time. this leads to an increase in t on , lowering the total frequency slightly. a dditionally, when output current lingers around 0a in continuous mode, this ?dead time? also has an effect upon t on , further lowering the switching frequency. confirm the switching frequency by measuring the current through the coil (at the point where current does not flow backwards) during normal operation. f= v ref v in t on v ref (0.7v) + i l esr ??? (11) r1+r2 r2 r1+r2 r2 1 2 h 3 reg tm controlla s rq driver circuit sllm v in output voltage v in fb r1 r2 sllm tm esr ref(0.7v)
technical note bd95513muv 14/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. evaluation board circuit (frequency=300khz continuous mode/qllm/sllm tm example circuit) evaluation board parts list part no value company part name part no value company part name u1 rohm bd95513muv r1 10 ? rohm mcr03 d1 rohm rb051l-40 r4 10 ? rohm mcr03 c1 1f kyocera cm105b105k06a r6 180k ? rohm mcr03 c3 1f kyocera cm105b105k16a r7 31k ? rohm mcr03 c4 10f kyocera cm316b106k06a r8 20k ? rohm mcr03 c5 1000pf murata grm39x7r102k50 r9 100k ? rohm mcr03 c6 0.1f kyocera cm105b104k06a l1 1.8h sumida cdep104-1r8ml c7 1f kyocera cm105b105k16a c14 470f sanyo 2r5tpe470ml c11 10f kyocera cm316b106m16a c15 1f kyocera cm105b105k06a c12 0.1f kyocera cm05b104k25a c1 6 1f kyocera cm105b105k06a c13 220pf murata grm39c0g221j50 c11 c10 r6 r4 v reg (5v) ref c6 c4 c1 c7 c5 en v reg v in v reg c12 d1 pgnd pgnd c14 pgnd pgnd r7 l1 a v in bd95513muv u1 gnd v out en v reg ref(0.7v) fs ss/ track v cc gnd v dd boot v in sw pgnd fb 7 10 15 11 16 17 12 21 5 1~4 26~31 22~25,32 12v 1.8v/3a 18 pgood 6 ce 20 r1 r8 extv cc mode 9 mode c13 13 14 v ou t 19 v dd ctl ctl 8 5v r9 c3
technical note bd95513muv 15/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. notes for use (1) absolute maximum ratings exceeding the absolute maximum ratings (such as supply volt age, temperature range, etc.) may result in damage to the device. in such cases, it may be impossible to identify probl ems such as open circuits or short circuits. if any operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. (2) power supply polarity connecting the power supply in reverse polarity can cause damage to the ic. take precautions when connecting the power supply lines. an external power diode can be added. (3) power supply lines the pcb layout pattern should be designed to provide the ic with low-impedance gnd and supply lines. to minimize noise on the supply and gnd lines, ground and power supply lines of analog and digital blocks should be separated. for all power lines supplying ics, connect a bypass capacitor between the power supply and the gnd terminal. if using electrolytic capacitors, keep in mind that their capacitance is reduced at lower temperatures. (4) gnd voltage the potential of the gnd pin must be the minimum potential in the syst em in all operating conditions. (5) thermal design use thermal design techniques that allow for a sufficient ma rgin for power dissipation in actual operating conditions. (6) inter-pin shorts and mounting errors use caution when positioning he ic for mounting on pcbs. the ic may be damaged if there are any connection errors or if pins are shorted together. (7) operation in strong electromagnetic fields exercise caution when using the ic in t he presence of strong electrom agnetic fields as doing so may cause the ic to malfunction. (8) aso when using the ic, set the output transistor so that it does not exceed either absolute maximum ratings or aso. (9) thermal shutdown circuit the ic incorporates a built-in thermal shutdown circuit (tsd circuit), which is designed to shut down the ic only to prevent thermal overloading. it is not designed to pr otect the ic or guarantee its operation. do not continue to use the ic if this circuit is activated, or in environments in which activation of this circuitry can be assumed. tsd on temp. [ ] (typ.) hysteresis temp. [ ] (typ.) bd95513muv 175 15 (10) testing on application boards when testing the ic with application boards, connecting capaci tors directly to low-impedance terminals can subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should be turned off completely before connecting it to or removing it from a jig or fixture during the evaluation process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage.
technical note bd95513muv 16/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. (11) regarding ic input pins this monolithic ic contains p+ isolation a nd p substrate layers between adjacent elem ents in order to keep them isolated. pn junctions are formed at the intersection of these p layers with the n layers of other elements, creating parasitic diodes and/or transistors. for example (refer to the figure below): when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode when gnd > pin b, the pn junction operates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic, a nd the operation of these parasiti c diodes can result in mutual interference among circuits, operational faults, or physical dama ge. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. (12) ground wiring traces when using both small-signal and large- current gnd traces, the two ground trac es should be routed separately but connected to a single ground potential within the application in order to avoid variat ions in the small-signal ground caused by large currents. also ensure that the gnd traces of external components do not cause variations on gnd voltage. power dissipation vqfn032v5050 ic only j-a = 328.9 /w ic mounted on 1-layer board (with 20.2 mm 2 copper thermal pad) j-a = 142.0 /w ic mounted on 4-layer board (with 20.2 mm 2 pad on top layer, 5502 mm 2 pad on layers 2,3) j-a = 60.7 /w ic mounted on 4-layer board (with 5505mm 2 pad on all layers) j-a = 27.4 /w pin a parasitic elements n n n p + p + p p substrate gnd parasitic element resistance n n n p + p + p p substrate gnd parasitic elements pin b transistor (npn) c b e n gnd pin a parasitic element pin b other adjacent elements e b c gnd example of ic structure 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0 25 50 75 100 125 150 ambient temperature: ta ( ) power dissipation : pd (w) 0.38w 0.88w 2.06w 4.56w
technical note bd95513muv 17/17 www.rohm.com 2010.10- rev. a ? 2010 rohm co., ltd. all rights reserved. ordering part number b d 9 5 5 1 3 m u v - e 2 part no. part no. package muv : vqfn032v5050 packaging and forming specification e2: embossed tape and reel (unit : mm) vqfn032v5050 0.08 s s 1.0max (0.22) 0.02 +0.03 - 0.02 24 8 1 9 32 16 25 17 0.5 0.75 0.4 0.1 3.4 0.1 3.4 0.1 0.25 +0.05 - 0.04 c0.2 5.0 0.1 5.0 0.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
r1010 a www.rohm.com ? 2010 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redunda ncy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospac e machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.

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