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BSD235C optimos? 2 + optimos?-p 2 small signal transistor features complementary p + n channel enhancement mode super logic level (2.5v rated) avalanche rated qualified according to aec q101 100% lead-free; rohs compliant maximum ratings, at t j =25 c, unless otherwise specified 1) parameter symbol conditions unit pn continuous drain current i d t a =25 c -0.53 0.95 a t a =70 c -0.46 0.76 pulsed drain current i d,pulse t a =25 c -2.1 3.8 avalanche energy, single pulse e as p: i d =-0.53 a, n: i d =0.95 a, r gs =25 ? 1.4 1.6 mj gate source voltage v gs v power dissipation p tot t a =25 c w operating and storage temperature t j , t stg c esd class jesd22-a114-hbm c soldering temperature t solder c iec climatic category; din iec 68-1 value -55 ... 150 55/150/56 260 12 0.5 1) remark: only one of both transistors active 0 (<250v) pg-sot-363 type package tape and reel information marking lead free packing BSD235C pg-sot-363 l6327: 3000 pcs / reel x9s yes non dry 4 5 6 1 2 3 p n v ds -20 20 v r ds(on),max v gs =4.5 v 1200 350 m ? v gs =2.5 v 2100 600 i d -0.53 0.95 a product summary 1 2 6 5 3 4 rev.2.1 page 1 2009-02-11
BSD235C parameter symbol conditions unit min. typ. max. thermal characteristics p n electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage p v (br)dss v gs =0 v, i d =-250 a - - -20 v n v gs =0 v, i d =250 a 20 - - gate threshold voltage p v gs(th) v ds = v gs , i d =-1.5 a -1.2 -0.9 -0.6 n v ds = v gs , i d =1.6 a 0.7 0.95 1.2 zero gate voltage drain current p i dss v ds =-20 v, v gs =0 v, t j =25 c - - -1 a n v ds =20 v, v gs =0 v, t j =25 c --1 p v ds =-20 v, v gs =0 v, t j =150 c - - -100 n v ds =20 v, v gs =0 v, t j =150 c - - 100 p n p r ds(on) v gs =-2.5 v, i d =-0.17 a - 1221 2100 m ? n v gs =2.5 v, i d =0.29 a - 415 600 p v gs =-4.5v, i d =-0.53 a - 745 1200 n v gs =4.5 v, i d =0.95 a - 266 350 transconductance p g fs | v ds |>2| i d | r ds(on)max , i d =-0.46 a - 0.7 - s n | v ds |>2| i d | r ds(on)max , i d =0.76 a -2- gate-source leakage current values 2) performed on 40mm 2 fr4 pcb. the traces are 1mm wide, 70 m thick and 20mm long; they are present on both sides of the pcb drain-source on-state resistance thermal resistance, junction - ambient - - 250 minimal footprint 2) k/w 100 r thja na i gss - v gs =12 v, v ds =0 v - rev.2.1 page 2 2009-02-11
BSD235C parameter symbol conditions unit min. typ. max. dynamic characteristics input capacitance p c iss -37-pf n - 47 - output capacitance p c oss -17- n - 24 - reverse transfer capacitance p c rss -14- n-3- turn-on delay time p t d(on) - 3.8 - ns n - 3.8 - rise time p t r - 5.0 - n - 3.6 - turn-off delay time p t d(off) - 5.1 - n - 4.5 - fall time p t f - 3.2 - n - 1.2 - gate charge characteristics gate to source charge p q gs - -0.09 - nc gate to drain charge q gd - -0.2 - switching charge q g - -0.4 - gate plateau voltage v plateau - -2.4 - gate to source charge n q gs - 0.11 - gate to drain charge q gd - 0.09 - switching charge q g - 0.34 - gate plateau voltage v plateau - 2.4 - v dd =16 v, i d =0.95 a, v gs =0 to 4.5 v values v gs =0 v, p: v ds =-10 v, n: v ds = 10 v, f =1 mhz p: v dd =-10 v, v gs =-4.5 v, r g =6 ? , i d =-0.53 a n: v dd =10 v, v gs =4.5 v, r g =6 ? , i d =0.95 a v dd =-10 v, i d =-0.53 a, v gs =0 to -4.5 v rev.2.1 page 3 2009-02-11
BSD235C parameter symbol conditions unit min. typ. max. reverse diode p i s - - -0.42 a n 0.5 diode pulse current p i s,pulse - - -2.1 n - - 3.8 diode forward voltage p v sd v gs =0 v, i f =-0.53 a, t j =25 c - -1 -1.2 v n v gs =0 v, i f =0.95 a, t j =25 c - 0.9 1.1 reverse recovery time p t rr - 7.6 - ns n - 5.2 - reverse recovery charge p q rr - 1.1 - nc n - 0.97 - values t c =25 c v r =10 v, i f = i s , d i f /d t =100 a/s diode continuous forward current rev.2.1 page 4 2009-02-11
BSD235C 1 power dissipation (p) 2 power dissipation (n) p tot =f( t a ) p tot =f( t a ) 3 drain current (p) 4 drain current (n) i d =f( t a ) i d =f( t a ) parameter: v gs -4.5 v parameter: v gs 4.5 v 0 0.1 0.2 0.3 0.4 0.5 0.6 0 40 80 120 160 t a [c] p tot [w] 0 0.2 0.4 0.6 0.8 1 0 40 80 120 160 t a [c] i d [a] 0 0.1 0.2 0.3 0.4 0.5 0.6 0 40 80 120 160 t a [c] p tot [w] 0 0.2 0.4 0.6 0.8 1 0 40 80 120 160 t a [c] -i d [a] rev.2.1 page 5 2009-02-11
BSD235C 5 safe operating area (p) 6 safe operating area (n) i d =f( v ds ); t a =25 c; d =0 i d =f( v ds ); t a =25 c; d =0 parameter: t p parameter: t p 7 max. transient thermal impedance (p) 8 max. transient thermal impedance (n) z thja =f( t p ) z thja =f( t p ) parameter: d = t p / t parameter: d = t p / t 1 s 10 s 100 s 1 ms 10 ms dc 10 2 10 1 10 0 10 -1 10 1 10 0 10 -1 10 -2 v ds [v] i d [a] single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 2 10 1 10 0 10 -1 10 -2 10 -3 10 -4 10 -5 10 3 10 2 10 1 10 0 t p [s] z thja [k/w] 1 s 10 s 100 s 1 ms 10 ms dc 10 2 10 1 10 0 10 -1 10 1 10 0 10 -1 10 -2 -v ds [v] -i d [a] single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 2 10 1 10 0 10 -1 10 -2 10 -3 10 -4 10 -5 10 3 10 2 10 1 10 0 t p [s] z thja [k/w] rev.2.1 page 6 2009-02-11
BSD235C 9 typ. output characteristics (p) 10 typ. output characteristics (n) i d =f( v ds ); t j =25 c i d =f( v ds ); t j =25 c parameter: v gs parameter: v gs 11 typ. drain-source on resistance (p) 12 typ. drain-source on resistance (n) r ds(on) =f( i d ); t j =25 c r ds(on) =f( i d ); t j =25 c parameter: v gs parameter: v gs 1.8 v 2 v 2.3 v 2.5 v 3 v 3.5 v 4.5 v 10 v 0 1 2 3 4 5 012345 v ds [v] i d [a] 1.8 v 2 v 2.3 v 2.5 v 3 v 3.5 v 4.5 v 10 v 0 1 2 3 4 5 012345 v ds [v] i d [a] 2.2 v 2.5 v 3 v 3.3 v 3.5 v 4.5 v 10 v 0 200 400 600 800 1000 1200 1400 1600 1800 2000 01234 i d [a] r ds(on) [m ? ] 2.2 v 2.5 v 3 v 3.3 v 3.5 v 4.5 v 10 v 0 100 200 300 400 500 600 700 01234 i d [a] r ds(on) [m ? ] rev.2.1 page 7 2009-02-11
BSD235C 13 typ. transfer characteristics (p) 14 typ. transfer characteristics (n) i d =f( v gs ); | v ds |>2 | i d | r ds(on)max i d =f( v gs ); |v ds |>2 | i d | r ds(on)max parameter: t j parameter: t j 15 drain-source on-state resistance (p) 16 drain-source on-state resistance (n) r ds(on) =f( t j ); i d =-0.53 a; v gs =-4.5 v r ds(on) =f( t j ); i d =0.95 a; v gs =4.5 v 25 c 150 c 0 0.25 0.5 0.75 1 0123 v gs [v] i d [a] 25 c 150 c 0 0.25 0.5 0.75 1 0123 -v gs [v] -i d [a] 98% typ 0 200 400 600 800 1000 1200 1400 1600 1800 -60 -20 20 60 100 140 180 t j [c] r ds(on) [m ? ] typ 98% 0 100 200 300 400 500 600 -60 -20 20 60 100 140 180 t j [c] r ds(on) [m ? ] rev.2.1 page 8 2009-02-11
BSD235C 21 forward characteristics of reverse diode (p) 22 forward characteristics of reverse diode (n) i f =f( v sd ) i f =f( v sd ) parameter: t j parameter: t j 23 avalanche characteristics (p) 24 avalanche characteristics (n) i as =f( t av ); r gs =25 ? i as =f( t av ); r gs =25 ? parameter: t j(start) parameter: t j(start) 25 c 150 c 25 c, 98% 150 c, 98% 10 1 10 0 10 -1 10 -2 0 0.4 0.8 1.2 1.6 -v sd [v] -i f [a] 25 c 100 c 125 c 10 3 10 2 10 1 10 0 10 0 10 -1 10 -2 t av [s] -i av [a] 25 c 100 c 125 c 10 3 10 2 10 1 10 0 10 0 10 -1 10 -2 t av [s] i av [a] 25 c 150 c 25 c, 98% 150c,98% 10 1 10 0 10 -1 10 -2 0 0.4 0.8 1.2 1.6 v sd [v] i f [a] rev.2.1 page 9 2009-02-11
BSD235C 17 typ. gate threshold voltage (p) 18 typ. gate threshold voltage (n) v gs(th) =f( t j ); v gs = v ds ; i d =-1.5 a v gs(th) =f( t j ); v gs = v ds ; i d =1.6 a 19 typ. capacitances (p) 20 typ. capacitances (n) c =f( v ds ); v gs =0 v; f =1 mhz c =f( v ds ); v gs =0 v; f =1 mhz ciss coss crss 10 2 10 1 10 0 0 5 10 15 20 v ds [v] c [pf] 2% typ 98% 0 0.4 0.8 1.2 1.6 -60 -20 20 60 100 140 180 t j [c] -v gs(th) [v] typ 2% 98% 0 0.4 0.8 1.2 1.6 -60 -20 20 60 100 140 180 t j [c] v gs(th) [v] ciss coss crss 10 2 10 1 10 0 0 5 10 15 20 v ds [v] c [pf] rev.2.1 page 10 2009-02-11
BSD235C 25 typ. gate charge (p) 26 typ. gate charge (n) v gs =f( q gate ); i d =-0.53 a pulsed v gs =f( q gate ); i d =0.95 a pulsed parameter: v dd parameter: v dd 27 drain-source breakdown voltage (p) 28 drain-source breakdown voltage (n) v br(dss) =f( t j ); i d =-250 a v br(dss) =f( t j ); i d =250 a 16 17 18 19 20 21 22 23 24 25 -60 -20 20 60 100 140 180 t j [c] -v br(dss) [v] 16 17 18 19 20 21 22 23 24 25 -60 -20 20 60 100 140 t j [c] v br(dss) [v] -4 v -10 v -16 v 0 1 2 3 4 5 6 0 0.1 0.2 0.3 0.4 0.5 0.6 -q gate [nc] -v gs [v] 4 v 10 v 16 v 0 1 2 3 4 5 6 0 0.1 0.2 0.3 0.4 0.5 0.6 q gate [nc] v gs [v] rev.2.1 page 11 2009-02-11
BSD235C sot-363 package outline: footprint: packing: reflow soldering: dimensions in mm rev.2.1 page 12 2009-02-11
BSD235C published by infineon technologies ag 81726 munich, germany ? 2008 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office (www.infineon.com). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev.2.1 page 13 2009-02-11

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