 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mhs varistor series surface mount multilayer varistors (mlvs) > mhs series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mhs.html for current information. mhs series mhs varistor series rohs description the multilayer highCspeed mhs series is a very-low capacitance extension to the littelfuse ml family of transient voltage surge suppression devices available in an 0402 and 0603Csize surface mount chip. the mhs series provides protection from esd and eft in highCspeed data line and other high frequency applications. the low capacitance of the mhs series permits usage in analog or digital circuits where it will not attenuate or distort the desired signal or data. their small size is ideal for highCdensity printed circuit boards, being typically applied to protect intergrated circuits and other sensitive components. they are particularly well suited to suppress esd events including those speci?ed in iec 61000-4-2 or other standards used for electromagnetic compliance (emc) testing. the mhs series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount package. the mhs series is also compatible with modern re?ow and wave soldering prcesses. littelfuse inc. manufactures other multilayer varistor series products, see the ml, mle, mln and auml series data sheets. features t 3 p ) 4 d p n q m j b o u t q '
q '
b o e q ' capacitance versions suitable for highCspeed data rate lines t & 4 % s b u f e u p * & $ 61000-4-2 ( level 4) t & ' 5 # s b u f e u p * & $ 61000-4-4 ( level 4) t - p x m f b l b h f d v s s f o u t t ? $ u p ? $ operating temp. range t * o i f s f o u m z c j e j s f d u j p o b m applications t % b u b
% j b h o p t u j d * 0 1 p s u t t 6 o j w f s t b m 4 f s j b m # v t 6 4 # t 7 j e f p " v e j p 1 p s u t t 1 p s u b c m f ) b o e ) f m e 1 s p e v d u t t . p c j m f communications t $ p n q v u f s % 4 1 1 s p e v d u t t * o e v t u s j b m * o t u s v n f o u t including medical absolute maximum ratings size table metric eia 0402 1608 0603 t ' p s s b u j o h t p g j o e j w j e v b m n f n c f s t p g b t f s j f t t f f e f w j d f s b u j o h t b o e t q f d j m d b u j p o t u b c m f continuous mhs series units steady state applied voltage: % $ 7 p m u b h f 3 b o h f 7 m(dc) ) : 7 . ) 4 42 7 7 . ) 4 18 7 7 . ) 4 09 7 0 q f s b u j o h " n c j f o u 5 f n q f s b u v s f 3 b o h f 5 a ) u p 0 c 4 u p s b h f 5 f n q f s b u v s f 3 b o h f 5 stg ) u p 0 c varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mhs varistor series surface mount multilayer varistors (mlvs) > mhs series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mhs.html for current information. device ratings and speci?cations part number performance speci?cations (25 oc) maximum clamping voltage at 1a (8x20 s) maximum esd clamp voltage (note 1) typical leakage current at speci?ed dc voltage typical capacitance at 1mhz (1v p-p) typical inductance (from impedance analysis) 8kv contact (note 2) 15kv air (note 3) 3.5v 5.5v c (note 4) l clamp clamp p i l min max (v c ) (v) (v) ( a) ( a) (pf) (pf) (nh) 7 . ) 4 / / p u f <300 <400 1. 0 0 2 <1.0 7 . ) 4 / <300 <400 1.00 1 6 <1.0 7 . ) 4 / / p u f <160 1. 0 0 8 16 < 1. 0 7 . ) 4 / <160 1. 0 0 8 16 < 1. 0 7 . ) 4 / / p u f 30 <160 1. 0 0 29 <1.0 7 . ) 4 / 30 <100 1. 0 0 29 <1.0 / 0 5 & 4 5 f t u f e u p * & $ ) v n b o # p e z . p e f m ) # . e j t d i b s h f u f t u d j s d v j u 2. direct discharge to device terminals (iec preferred test method). 3. corona discharge through air (represents actual esd event). $ b q b d j u b o d f n b z c f d v t u p n j [ f e d p o u b d u z p v s - j u u f m g v t f 4 b m f t 3 f q s f t f o u b u j w f 7 . ) 4 y y y t j [ f e f w j d f t b w b j m b c m f b t 3 q b d l b h j o h p q u j p o p o m z & y b n q m f 7 . ) 4 / 3 4 f f 1 b d l b h j o h b o e 5 b q f b o e 3 f f m t f d u j p o t m b t u q b h f g p s b e e j u j p o b m j o g p s n b u j p o ' p s b q q m j d b u j p o t f y d f f e j o h ? $ b n c j f o u u f n q f s b u v s f u i f peak surge current and energy ratings must be reduced as shown below. peak current and energy derating curve 60 10 1 number of pulses nominal voltage at 1madc 10 100 1000 10000 20 30 40 50 v0402mhs03 v0402mhs12 v0603mhs03 v0603mhs12 0 v0402mhs22 v0603mhs22 nominal voltage stability to multiple esd impulses (8kv contact discharges per iec 61000-4-2) standby current at normalized varistor voltage and temperature insertion loss (s21) characteristics 1. 2 0.0 0.0001 25 0.001 0.01 0.1 1 current (ma) normalized varistor voltage (v) 1. 0 0.8 0.6 0.4 0.2 85 125 o o o 100 80 60 40 20 0 -55 50 60 70 80 90 100 110 120 130 140 150 percent of rated value ambient temperature ( o c) -30 frequency (mhz) insertion loss (db) 10 100 1000 10000 -20 -10 0 v0402mhs22 v0603mhs22 v0402mhs12 v0402mhs03 v0603mhs12 v0603mhs03 figure 1 figure 2 figure 3 figure 4 varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mhs varistor series surface mount multilayer varistors (mlvs) > mhs series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mhs.html for current information. mhs series lead (pb) soldering recommendations the principal techniques used for the soldering of d p n q p o f o u t j o t v s g b d f n p v o u u f d i o p m p h z b s f * 3 3 f n p x and wave soldering. typical pro?les are shown on the right. the recommended solder for the mhs suppressor is b 4 o 1 c " h 4 o 1 c p s 4 o 1 c - j u u f m g v t f b m t p s f d p n n f o e t b o 3 . " t p m e f s n v y wave soldering is the most strenuous of the processes. to avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. when using a re?ow process, care should be taken to ensure that the mhs chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. during the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. 0 o d f u i f t p m e f s j o h q s p d f t t i b t c f f o d p n q m f u f e j u j t still necessary to ensure that any further thermal shocks b s f b w p j e f e 0 o f q p t t j c m f d b v t f p g u i f s n b m t i p d l j t i p u printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. the boards must be allowed to cool gradually u p m f t t u i b o ? $ c f g p s f d m f b o j o h 230 re?ow solder pro?le wave solder pro?le device characteristics " u m p x d v s s f o u m f w f m t u i f 7 * d v s w f p g u i f n v m u j m b z f s transient voltage suppressor approaches a linear (ohmic) relationship and shows a temperature dependent effect. at or below the maximum working voltage, the suppressor is in a high resistance model (approaching 10 6 at its maximum rated working voltage). leakage currents at maximum rated voltage are below 100 " u z q j d b m m z a; for 0402 size below 20 " u z q j d b m m z a. 100% 1e -9 1e -8 suppressor current (a dc ) 10% 1e -7 1e -6 1e -5 1e -4 1e -3 1e -2 25 50 75 100 125 o c suppressor voltage in percent of v nom value at 25 o c (%) o o o o typical temperature dependance of the characteristic $ v s w f j o u i f - f b l b h f 3 f h j p o speed of response the multilayer suppressor is a leadless device. its response time is not limited by the parasitic lead inductances found in other surface mount packages. the response time of the z n 0 e j f m f d u s j d n b u f s j b m j t m f t t u i b o o t b o e u i f . - & d b o d m b n q w f s z g b t u e 7 e 5 f w f o u t such as esd. additionally, in real world applications, the associated circuit wiring is often the greatest factor effecting speed of response. therefore, transient suppressor placement within a circuit can be considered important in certain instances. grains depletion fired ceramic dielectric region metal electrodes depletion region metal end termination multilayer internal construction figure 5 figure 6 figure 7 figure 8 varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mhs varistor series surface mount multilayer varistors (mlvs) > mhs series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mhs.html for current information. product dimensions (mm) note: avoid metal runs in this area, parts are not recommended for use in applications using silver (ag) epoxy paste. d e w l dimension 0402 size 0603 size in mm in mm a 0.100 b 0.020 0.030 c 0.024 0.610 0.890 d (max.) 0.024 0.600 0.040 1.000 e l w 1 " % - " : 0 6 5 % & . & / 4 * 0 / 4 $ ) * 1 - " : 0 6 5 % * . & / 4 * 0 / 4 5.0 6.0 7.0 maximum temperature 260?c 20 - 40 seconds within 5?c preheat zone ramp rate <3?c/s 60 - 150 sec > 217?c leadCfree (pb-free) soldering recommendations - j u u f m g v t f p g g f s t u i f / j d l f m # b s s j f s 5 f s n j o b u j p o m o j t i g p s u i f optimum leadCfree solder performance. 5 i f q s f g f s s f e t p m e f s j t 4 o " h $ v x j u i b o 3 . " ?ux, but there is a wide selection of pastes and ?uxes b w b j m b c m f x j u i x i j d i u i f / j d l f m # b s s j f s q b s u t t i p v m e c f compatible. the re?ow pro?le must be constrained by the maximums j o u i f - f b e o g s f f 3 f n p x 1 s p m m f ' p s - f b e o g s f f x b w f t p m e f s j o h u i f 8 b w f 4 p m e f s 1 s p m m f t u j m m b q q m j f t note: the leadCfree paste, ?ux and pro?le were used for evaluation purposes by littelfuse, based upon industry standards and practices. there are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. leadCfree re-?ow pro?le figure 10 varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mhs varistor series surface mount multilayer varistors (mlvs) > mhs series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mhs.html for current information. mhs series part numbering system v 0402 packing options (see quantities in packaging section) device family littelfuse tvss device r device size 0402 = .04 inch x .02 inch (1.0 mm x 0.5 mm) 0603 = .063 inch x .031 inch (1.6 mm x 0.8 mm) mhs 03 n capacitance designation 03 = 3pf 12 = 12pf 22 = 22pf end termination option n = nickel barrier (ni/sn) series designator mhs = multilayer hi-speed t = (0603 device only)13in (330mm) diameter reel, plastic carrier tape h = (0603 device only) 7in (178mm) diameter reel, plastic carrier tape r = (available for 0402 and 0603 devices) 7in (178mm) diameter reel, paper carrier tape packaging* quantity device size 13 inch reel ("t" option) 7 inch reel ("h" option) 7 inch reel ("r" option) 0603 10,000 4,000 0402 not available not available 10,000 k 0 t 1 d 0 p 0 d 1 p 1 a 0 p 2 b 0 f e w t tape and reel speci?cations symbol description dimensions in millimeters 0402 size 0603 size a 0 width of cavity % f q f o e f o u p o $ i j q 4 j [ f u p . j o j n j [ f 3 p u b u j p o b 0 length of cavity % f q f o e f o u p o $ i j q 4 j [ f u p . j o j n j [ f 3 p u b u j p o k 0 depth of cavity % f q f o e f o u p o $ i j q 4 j [ f u p . j o j n j [ f 3 p u b u j p o w width of tape f % j t u b o d f # f u x f f o % s j w f ) p m f $ f o u f s t b o e $ b w j u z $ f o u f s t e % j t u b o d f # f u x f f o % s j w f ) p m f $ f o u f s t b o e 5 b q f & e h f p 1 % j t u b o d f # f u x f f o $ b w j u z $ f o u f s t p 2 " y j b m % s j w f % j t u b o d f # f u x f f o % s j w f ) p m f $ f o u f s t $ b w j u z $ f o u f s t p 0 " y j b m % s j w f % j t u b o d f # f u x f f o % s j w f ) p m f $ f o u f s t d 0 drive hole diameter d 1 % j b n f u f s p g $ b w j u z 1 j f s d j o h / " t 1 top tape thickness 0.1 max 0.1 max t nominal carrier tape thickness 1.1 1.1 notes: t $ p o g p s n t u p & * " 3 f w j t j p o " t $ b o c f t v q q m j f e u p * & $ q v c m j d b u j p o 1 b d l b h j o h * u j t s f d p n n f o e f e u i b u q b s u t c f l f q u j o u i f t f b m f e c b h q s p w j e f e b o e u i b u q b s u t c f v t f e b t t p p o b t q p t t j c m f x i f o s f n p w f e g s p n c b h t |
Price & Availability of V0402MHS03N
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |