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? 1 ? e02115-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. ICX414AL 22 pin dip (cer-dip) optical black position (top view) 2 8 v h pin 1 pin 12 31 2 diagonal 8mm (type 1/2) progressive scan ccd solid-state image sensor with square pixel for eia b/w cameras description the ICX414AL is a diagonal 8mm (type 1/2) interline ccd solid-state image sensor with a square pixel array suitable for eia black-and-white cameras. progressive scan allows all pixel's signals to be output independently within approximately 1/60 second. this chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still images without a mechanical shutter. square pixel makes this device suitable for image input and processing applications. high sensitivity and low dark current are achieved through the adoption of the had (hole-accumulation diode) sensors. this chip is suitable for applications such as fa and surveillance cameras. features ? progressive scan allows individual readout of the image signals from all pixels. high vertical resolution (480 tv-lines) still images without a mechanical shutter square pixel supports vga format horizontal drive frequency: 24.54mhz (max.) no voltage adjustments (reset gate and substrate bias are not adjusted.) high resolution, high sensitivity, low dark current continuous variable-speed shutter low smear excellent anti-blooming characteristics device structure interline ccd image sensor image size: diagonal 8mm (type 1/2) number of effective pixels: 659 (h) 494 (v) approx. 330k pixels total number of pixels: 692 (h) 504 (v) approx. 350k pixels chip size: 7.48mm (h) 6.15mm (v) unit cell size: 9.9? (h) 9.9? (v) optical black: horizontal (h) direction: front 2 pixels, rear 31 pixels vertical (v) direction: front 8 pixels, rear 2 pixels number of dummy bits: horizontal 16 vertical 5 substrate material: silicon
? 2 ? ICX414AL block diagram and pin configuration (top view) pin no. symbol description pin no. symbol description 1 2 3 4 5 6 7 8 9 10 11 nc nc v 3 v 2 v 1 nc gnd nc v out c gg nc vertical register transfer clock vertical register transfer clock vertical register transfer clock gnd signal output output amplifier gate ? 1 12 13 14 15 16 17 18 19 20 21 22 v dd rg v l sub h 1 h 2 nc nc c sub subcir nc supply voltage reset gate clock protective transistor bias substrate clock horizontal register transfer clock horizontal register transfer clock substrate bias ? 2 supply voltage for the substrate voltage generation pin description ? 1 dc bias is applied within the ccd, so that this pin should be grounded externally through a capacitance of 1? or more. ? 2 dc bias is applied within the ccd, so that this pin should be grounded externally through a capacitance of 0.1? or more. note) note) : photo sensor horizontal register vertical register 8 7 6 5 4 3 2 1 nc gnd nc v 1 v 2 v 3 nc nc 17 18 19 20 21 22 h 2 16 h 1 15 sub 11 10 9 nc c gg v out 14 v l 13 rg 12 v dd nc nc c sub subcir nc
? 3 ? ICX414AL absolute maximum ratings item v dd , v out , c gg , subcir ? gnd v dd , v out , c gg , subcir ? sub v 1 , v 2 , v 3 ? gnd v 1 , v 2 , v 3 ? sub substrate clock sub ? gnd supply voltage clock input voltage voltage difference between vertical clock input pins voltage difference between horizongal clock input pins h 1 , h 2 ? v 3 h 1 , h 2 ? gnd h 1 , h 2 ? sub v l ? sub v 2 , v 3 ? v l rg ? gnd v 1 , h 1 , h 2 , gnd ? vl storage temperature performance guarantee temperature operating temperature ? 0.3 to +55 ? 0.3 to +18 ? 55 to +10 ? 15 to +20 to +10 to +15 to +17 ? 16 to +16 ? 10 to +15 ? 55 to +10 ? 65 to +0.3 ? 0.3 to +27.5 ? 0.3 to +22.5 ? 0.3 to +17.5 ? 30 to +80 ? 10 to +60 ? 10 to +75 v v v v v v v v v v v v v v c c c ? 1 ratings unit remarks ? 1 +27v (max.) when clock width < 10?, clock duty factor < 0.1%. +16v (max.) is guaranteed for power-on and power-off.
? 4 ? ICX414AL bias conditions ? 1 v l setting is the v vl voltage of the vertical transfer clock waveform, or the same voltage as the v l power supply for the v driver should be used. ? 2 indications of substrate voltage setting value set subcir pin to open when applying a dc bias the substrate clock pin. adjust the substrate voltage because the setting value of the substrate voltage is indicated on the back of image sensor by a special code when applying a dc bias the substrate clock pin. v sub code ? two characters indication integer portion decimal portion the integer portion of the code and the actual value correspond to each other as follows. dc characteristics supply current item i dd symbol 7.0 min. unit remarks typ. max. ma supply voltage protective transistor bias substrate clock reset gate clock item v dd v l sub rg symbol 15.0 ? 1 ? 2 ? 3 min. v unit remarks typ. max. 14.55 15.45 9.0 4.0 a 5 c 6 d 7 e 8 f 9 g 10 h 11 j 12 integer portion of code value [example] "a5" v sub = 5.5v ? 3 do not apply a dc bias to the reset gate clock pins, because a dc bias is generated within the ccd.
? 5 ? ICX414AL clock voltage conditions readout clock voltage vertical transfer clock voltage horizontal transfer clock voltage reset gate clock voltage substrate clock voltage item v vt v vh02 v vh1 , v vh2 , v vh3 v vl1 , v vl2 , v vl3 v vl1 , v vl2 , v vl3 v 1 , v 2 , v 3 | v vl1 ? v vl3 | v vhh v vhl v vlh v vll v h v hl v cr v rg v rglh ? v rgll v rgl ? v rglm v sub symbol 14.55 ? 0.05 ? 0.2 ? 7.8 ? 8.0 6.8 4.75 ? 0.05 0.8 4.5 21.5 min. 15.0 0 0 ? 7.5 ? 7.5 7.5 5.0 0 2.5 5.0 22.5 ty p . 15.45 0.05 0.05 ? 7.2 ? 7.0 8.05 0.1 0.5 0.5 0.5 0.5 5.25 0.05 5.5 0.8 0.5 23.5 max. unit 1 2 2 2 2 2 2 2 2 2 2 3 3 3 4 4 4 5 waveform diagram v vh = v vh02 v vl = (v vl1 + v vl3 )/2 (during 24.54mhz) v vl = (v vl1 + v vl3 )/2 (during 12.27mhz) high-level coupling high-level coupling low-level coupling low-level coupling cross-point voltage low-level coupling low-level coupling remarks v v v v v v v v v v v v v v v v v v
? 6 ? ICX414AL clock equivalent circuit constants c v1 c v2 c v3 c v12 c v23 c v31 c h1 , c h2 c hh c rg c sub r 1 , r 2 r 3 r gnd r h1 , r h2 r rg symbol capacitance between vertical transfer clock and gnd capacitance between vertical transfer clocks capacitance between horizontal transfer clock and gnd capacitance between horizontal transfer clocks capacitance between reset gate clock and gnd capacitance between substrate clock and gnd vertical transfer clock series resistor vertical transfer clock ground resistor horizontal transfer clock series resistor reset gate clock series resistor item min. 3900 3300 3300 2200 2200 1800 47 30 6 390 27 22 100 16 39 ty p. max. pf pf pf pf pf pf pf pf pf pf ? ? ? ? ? unit remarks horizontal transfer clock equivalent circuit reset gate clock equivalent circuit vertical transfer clock equivalent circuit v 3 r gnd c v3 c v1 c v2 c v23 c v31 c v12 r 3 r 1 r 2 v 2 v 1 h 1 h 2 c h1 c h2 c hh r h2 r h1 r rg c rg
? 7 ? ICX414AL drive clock waveform conditions (1) readout clock waveform (2) vertical transfer clock waveform 100% 90% 10% 0% tr tf 0v twh m 2 m v vt note) readout clock is used by composing vertical transfer clocks v 2 and v 3 . v vlh v vl03 v vll v vh = v vh02 v vl = (v vl01 + v vl03 )/2 v vl3 = v vl03 v vl v vh1 v vhh v vh v vhl v vlh v vl1 v vl01 v vl v vll v vh3 v vhh v vh v vhl v vlh v vl2 v vll v vl v vh v vhh v vh02 v vh2 v vhl v v1 = v vh1 ? v vl01 v v2 = v vh02 ? v vl2 v v3 = v vh3 ? v vl03 v 1 v t v 2 v 3
? 8 ? ICX414AL h 2 h 1 two twh tr tf 90% 10% twl v cr v hl v h v h 2 rg waveform v rglh v rgll v rglm v rgh tr tf twh twl v rgl point a v rg v sub (a bias generated within the ccd) 100% 90% 10% 0% tr tf twh m 2 m v sub (3) horizontal transfer clock waveform cross-point voltage for the h 1 rising side of the horizontal transfer clocks h 1 and h 2 waveforms is v cr . the overlap period for twh and twl of horizontal transfer clocks h 1 and h 2 is two. (4) reset gate clock waveform v rglh is the maximum value and v rgll is the minimum value of the coupling waveform during the period from point a in the above diagram until the rising edge of rg. in addition, v rgl is the average value of v rglh and v rgll . v rgl = (v rglh + v rgll )/2 assuming v rgh is the minimum value during the interval twh, then: v rg = v rgh ? v rgl negative overshoot level during the falling edge of rg is v rglm . (5) substrate clock waveform h 1 , h 2 rg sub
? 9 ? ICX414AL ? 1 the overlap period of twh and twl of horizontal transfer clocks h 1 and h 2 is two. clock switching characteristics (horizontal drive frequency: 24.54mhz) min. twh typ. max. min. typ. max. min. typ. max. min. typ. max. twl tr tf 2.3 10.5 10.5 6 0.75 2.5 14.6 14.6 8 0.9 10.5 10.5 14.6 14.6 25.8 0.5 6.4 6.4 4 10.5 10.5 0.5 15 0.5 6.4 6.4 3 250 10.5 10.5 0.5 unit ? ns ns ns ? remarks during readout when using cxd3400n tf tr ? 2ns during drain charge item readout clock vertical transfer clock horizontal transfer clock reset gate clock substrate clock symbol v t v 1 , v 2 , v 3 h 1 h 2 rg sub min. two typ. max. 10.5 14.6 unit ns remarks item horizontal transfer clock symbol h 1 , h 2 ? 1 clock switching characteristics (horizontal drive frequency: 12.27mhz) min. twh typ. max. min. typ. max. min. typ. max. min. typ. max. twl tr tf 4.6 24 26.5 11 1.5 5.0 30 31.5 13 1.8 25 25 31.5 30 62.5 0.5 10 10 3 17.5 15 0.5 15 0.5 10 10 3 350 17.5 15 0.5 unit ? ns ns ns ? remarks during readout when using cxd3400n tf tr ? 2ns during drain charge item readout clock vertical transfer clock horizontal transfer clock reset gate clock substrate clock symbol v t v 1 , v 2 , v 3 h 1 h 2 rg sub min. two typ. max. 21.5 25.5 unit ns remarks item horizontal transfer clock symbol h 1 , h 2 ? 1
? 10 ? ICX414AL note) all image sensor characteristic data noted above is for operation in 1/60s progressive scan mode. image sensor characteristics (ta = 25 c) item sensitivity saturation signal smear video signal shading dark signal dark signal shading lag symbol s vsat sm sh vdt ? vdt lag min. 700 500 ty p . 880 ? 100 max. 1150 ? 92 25 2 1 0.5 unit mv mv db % mv mv % measurement method 1 2 3 4 5 6 7 remarks 1/30s accumulation conversion value ta = 60 c zone 0 ta = 60 c ta = 60 c 45 4 2 ignored region effective pixel region zone 0 659 (h) 494 (v) zone definition of video signal shading measurement system ccd c.d.s s/h amp ccd signal output [ ? a] signal output [ ? b] note) adjust the amplifier gain so that the gain between [ ? a] and [ ? b] equals 1.
? 11 ? ICX414AL 1. progressive scan mode in this mode, all pixel signals are output in non-interlace format in 1/60s. all pixel signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing. 2. field readout mode all pixels are readout, 2-line transfer is performed during h blanking period and 2 pixels are added by horizontal register. (however, guarantees only at the time of a 12mhz drive.) image sensor readout mode the diagram below shows the output methods for the following three readout modes. (1) progressive scan mode (2) field readout mode v out 3. center scan mode this is the center scan mode using the progressive scan method. the undesired portions are swept by vertical register high-speed transfer, and the picture center portion is cut out. there are the mode (120 frames/s) which outputs 222 lines of an output line portion, and the mode (240 frames/s) which outputs 76 lines. (3) center scan mode undesired portions (swept by vertical register high-speed transfer) picture center cut-out portion v out
? 12 ? ICX414AL image sensor characteristics measurement method measurement conditions (1) in the following measurements, the substrate voltage is set to the value indicated on the device, and the device drive conditions are at the typical values of the bias and clock voltage conditions. (2) in the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (ob) is used as the reference for the signal output, which is taken as the value measured at point [ ? b] of the measurement system. (3) in the following measurements, this image sensor is operated in 1/60s progressive scan mode. definition of standard imaging conditions (1) standard imaging condition i : use a pattern box (luminance: 706cd/m 2 , color temperature of 3200k halogen source) as a subject. (pattern for evaluation is not applicable.) use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter and image at f8. the luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. (2) standard imaging condition ii : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. sensitivity set to standard imaging condition i . after setting the electronic shutter mode with a shutter speed of 1/250s, measure the signal voltage (vs) at the center of the screen, and substitute the value into the following formula. s = vs [mv] 2. saturation signal set to standard imaging condition ii . after adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 150mv, measure the minimum value of the signal output. 3. smear set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, first adjust the luminous intensity to 500 times the intensity with the average value of signal output, 150mv. then after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective h blankings, measure the maximum value (vsm [mv]) of the signal output and substitute the value into the following formula. sm = 20 log [db] (1/10v method conversion value) 4. video signal shading set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity so that the average value of the signal output is 150mv. then measure the maximum (vmax [mv]) and minimum (vmin [mv]) values of the signal output and substitute the values into the following formula. sh = (vmax ? vmin)/150 100 [%] 250 30 1 500 vsm 150 1 10
? 13 ? ICX414AL 5. dark signal measure the average value of the signal output (vdt [mv]) with the device ambient temperature 60 c and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 6. dark signal shading after measuring 5, measure the maximum (vdmax [mv]) and minimum (vdmin [mv]) values of the dark signal output and substitute the values into the following formula. ? vdt = vdmax ? vdmin [mv] 7. lag adjust the signal output generated by strobe light to 150mv. after setting the strobe light so that it strobes with the following timing, measure the residual signal (vlag). substitute the value into the following formula. lag = (vlag/150) 100 [%] light signal output 150mv vlag (lag) vd v2 strobe light timing output
? 14 ? ICX414AL drive circuit xsub xv3 xsg3 xv2 xsg2 xv1 h 2 h 1 rg ccd out ? 7.5v 0.1 0.1 0.1 1/10v 0.1 0.01 2200p 0.1 3.3/16v 3.3/20v 0.1 1/35v 100k 1m 4.7k 2sc4250 1 2 3 4 5 6 7 8 22 21 20 19 18 17 16 15 9 10 11 14 13 12 icx414 (bottom view) nc nc v 3 v 2 v 1 nc gnd nc v out c gg nc nc subcir c sub nc nc h 2 h 1 sub v l rg v dd 11 12 13 14 15 16 17 18 19 20 10 9 8 7 6 5 4 3 2 1 cxd3400n 15v 3.3v
? 15 ? ICX414AL spectral sensitivity characteristics (includes lens characteristics, excludes light source characteristics) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 wave length [nm] relative response 800 900 1000
? 16 ? ICX414AL drive timing chart (vertical sync) progressive scan mode 494 1 2 6 5 494 1 2 7 8 1 2 3 4 6 5 7 8 1 2 3 4 1 2 3 vd hd "a" v1 v2 v3 out 525 510 1 7 508 510 1 525 7
? 17 ? ICX414AL drive timing chart (vertical sync "a" enlarged) progressive scan mode/center scand mode "a" enlarged 12 12 12 12 12 12 12 12 12 12 12 12 50 62 520 582 h1 v1 v2 v3
? 18 ? ICX414AL drive timing chart (horizontal sync) progressive scan mode 1 1 36 36 1 1 12 1 36 24 12 12 1 1 24 36 1 1 1 123 780 1 1 35 1 123 125 107 72 1 16 clk h1 h2 shp shd v1 v2 v3 sub rg 37
? 19 ? ICX414AL drive timing chart (vertical sync) center scan mode 1 356 357 136 137 1 356 357 1 vd hd "d" "b" "c" v1 v2 v3 out "a" "d" "b" "a" 246 245 261 262 1 2 3 4 5 6 7 8 20 21 24 246 245 261 262 1 2 3 4 5 6 7 8
? 20 ? ICX414AL drive timing chart (horizontal sync) center scan mode 1 (frame shift) ("b") 12 12 12 12 #1 12 12 12 12 12 12 12 12 h1 h2 v1 v2 v3 #142 35 72 10920 bits = 14h
? 21 ? ICX414AL drive timing chart (horizontal sync) center scan mode 1 (high-speed sweep) ("d") 12 12 12 12 #1 12 12 12 12 12 12 12 12 h1 h2 v1 v2 v3 #167 35 72 12480 bits = 16h
? 22 ? ICX414AL drive timing chart (vertical sync) center scan mode 2 283 284 209 210 1 283 284 1 vd hd "d" "b" "c" v1 v2 v3 out "a" "d" "b" "a" 106 105 130 131 1 2 3 4 5 6 7 8 30 27 26 129 106 105 130 131 1 2 3 4 5 6 7 8 129
? 23 ? ICX414AL drive timing chart (horizontal sync) center scan mode 2 (frame shift) ("b") 12 12 12 12 #1 12 12 12 12 12 12 12 12 h1 h2 v1 v2 v3 #215 35 72 15600 bits = 20h
? 24 ? ICX414AL drive timing chart (horizontal sync) center scan mode 2 (high-speed sweep) ("d") 12 12 12 12 #1 12 12 12 12 12 12 12 12 h1 h2 v1 v2 v3 #255 35 72 18720 bits = 24h
? 25 ? ICX414AL drive timing chart (vertical sync) field readout mode 12 34 494 493 56 78 12 34 56 78 23 493 494 1 45 67 81 23 45 67 8 vd fld hd "a" v1 v2 v3 out "b" 525 1 7 274 270 264 263 273
? 26 ? ICX414AL drive timing chart (vertical sync "a", "b" enlarged) field readout mode 666666666666 666666666666 50 62 520 582 h1 v1 v2 v3 v1 v2 v3 "b" enlarged "a" enlarged
? 27 ? ICX414AL drive timing chart (horizontal sync) field readout mode 118 118 118 118 118 118 1 6 118112 6 12 118 118 1 12 18 1 1 1 123 780 1 1 35 1 123 125 107 72 1 16 clk h1 h2 shp shd v1 v2 v3 sub rg 37
? 28 ? ICX414AL notes on handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non-chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensor. e) for the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) soldering a) make sure the package temperature does not exceed 80 c. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a 30w soldering iron with a ground wire and solder each pin in less than 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an image sensor, do not use a solder suction equipment. when using an electric desoldering tool, use a thermal controller of the zero cross on/off type and connect it to ground. 3) dust and dirt protection image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. clean glass plates with the following operation as required, and use them. a) perform all assembly operations in a clean room (class 1000 or less). b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if the grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) when a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. do not reuse the tape. 4) installing (attaching) a) remain within the following limits when applying a static load to the package. do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (this may cause cracks in the package.) b) if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portions. therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. 39n lower ceramic upper ceramic compressive strength low melting point glass 29n shearing strength 29n tensile strength 0.9nm torsional stregth
? 29 ? ICX414AL c) the adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution. d) the notch of the package is used for directional index, and that can not be used for reference of fixing. in addition, the cover glass and seal resin may overlap with the notch of the package. e) if the leads are bent repeatedly and metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) acrylate anaerobic adhesives are generally used to attach ccd image sensors. in addition, cyano- acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) others a) do not expose to strong light (sun rays) for long periods. for continuous using under cruel condition exceeding the normal using condition, consult our company. b) exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. c) brown stains may be seen on the bottom or side of the package. but this does not affect the ccd characteristics.
? 30 ? ICX414AL sony corporation package outline unit: mm 0.7 3 14.6 1.27 0.46 0.3 0.69 4.0 ?0.3 3.4 ?0.3 1.27 15.1 ?0.3 7.55 9.0 18.0 ?0.4 17.6 22 pin dip (600mil) b v h 22 12 11 1 2-r0.7 22 12 11 1 a ' (for the 1st.pin only) 0.3 m 1. " a " is the center of the effective image area. 2 . the two points " b " of the package are the horizontal reference. the point " b " of the package is the vertical reference. 3. the bottom " c " of the package is the height reference. 4. the center of the effective image area,relative to " b " and " b' " is (h, v) = ( 9.0, 7.55) 0.15mm 5. the rotation angle of the effective image area relative to h and v is ?1? 6. the height from bottom " c " to the effective image area is 1.41 ?0.15mm 7. the tilt of the effective image area relative to the bottom " c " is less than 60?. 8. the thickness of the cover glass is 0.75mm,and the refractive index is 1.5. 9. the notches on the bottom must not be used for reference of fixing. 0.7 3 11.55 3 0.55 b ~ 0.25 15.24 c 0 ? to 9? package material lead treatment lead material package mass drawing number cer-dip tin plating 42 alloy 2.60g as-b15-01(e)

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