doc. no : qw0905-: rev. : a date : 11 -dec. - 2008 LYG2662-PF bipolar type led lamps pb data sheet LYG2662-PF lead-free part s ligitek electronics co.,ltd. property of ligitek only
4.3 1.0min 3.1 25.0min note : 1.all dimension are in millimeter tolerance is ligitek electronics co.,ltd. property of ligitek only directivity radiation 1 2 2.54typ part no. y 1 2 g page 1/6 30 ?
tstg storage temperature -40 ~ +100 forward voltage @20ma(v) 1.7 1.7 min. note : 1.the forward voltage data did not including ? ? ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip 3/6 page LYG2662-PF part no.
1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 500 0.0 0.5 wavelength (nm) 650 550 600 -40 fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 ligitek electronics co.,ltd. property of ligitek only 3.5 page 4/6 LYG2662-PF part no.
note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max page 5/6 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 150 260 100 5 50 preheat 2 260 120 0 0 25
mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard ligitek electronics co.,ltd. property of ligitek only this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solder resistance test 1.t.sol=260
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