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  september 2012 ? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 FDZ2040L integrated load switch fdz 2040 l integrated load switch features ? optimized for low - voltage core ics in portable systems ? very small package dimension: wl - csp 0.8x0.8x0.5 mm 3 ? current = 1.2 a, v in max = 4 v ? current = 2 a, v in max = 4 v (pulsed) ? r ds(on) = 80 m at v on = 0 v, v in = 4 v ? r ds(on) = 85 m at v on = 0 v, v in = 3.6 v ? r ds(on) = 90 m at v on = 0 v, v in = 3 v ? rohs compliant general description this device is particularly suited for compact power management in portable application where 1.6v to 4v input and 1.2a output current capability are needed. this load switch integrates a level shifting function that drives a p - channel power mosfet in the very small 0.8x0.8x0.5 mm 3 wl - csp package. application s ? load switch ? power management in portable applications ordering information part number device marking ball pitch operating temperature range switch eco status package packing method fdz2040 l zl 0.4 mm - 25 to 7 5c 8 0 m, p - ch fet rohs 0.8x0.8x0.5 mm 3 wl - csp tape and reel for fairchilds definition of eco status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html .
? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 2 f dz 2040l integrated load switch application diagram and block diagram figure 1. block diagram and typical application pin configuration figure 2. pin assignment pin definitions pin # name description a 1 v in supply input: input to the load switch a 2 v out switch output: output of the load switch b1 on on/off control input, active low b2 gnd ground
? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 3 f dz 2040l integrated load switch absolute maximum ratings parameter min. max. unit v in , v out , on to gnd - 0.3 4. 2 v i out C load current (continuous) (note 1a) 1 .2 a i out C load current (pulsed) (note 2 ) 2 a power dissipation @ t a = 25c (note 1 a ) 0.9 w operating temperature range - 40 105 c storage temperature - 65 150 c electrostatic discharge capability human body model, jesd22 - a114 8 k v charged device model, jesd22 - c101 2 thermal characteristics thermal resistance, junction to ambient (note 1 a ) 117 c/w r ecommended operating conditions parameter min. typ. max. unit v in 1 .6 4 v ambient operating temperature, t a - 25 7 5 c
? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 4 f dz 2040l integrated load switch notes: 1. r ? ja is the sum of the junction - to - case and case - to - ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. r ? jc is guaranteed by design while r ? ja is determined by the users board design. 2. pulse test: pulse width < 300s, duty cycle < 2.0%. electrical characteristics t j = 25 c unless otherwise noted symbol parameter test conditions min typ max unit s v in operation voltage 1.6 4 v v il on input logic low voltage v in = 1.6v, ramp down v on from 1v to 0v, v out low to high, t j = - 25 to 75 c 0.35 v v in = 4v, ramp down v on from 1v to 0v, v out low to high, t j = - 25 to 75 c 0.35 v v ih on input logic high voltage v in = 1.6v, ramp up v on from 0v to 1v, v out high to low, t j = - 25 to 75 c 1.35 v v in = 4v, ramp up v on from 0v to 1v, v out high to low, t j = - 25 to 75 c 1.35 v i q quiescent current v in = 3v, v on = 0.35v, i out = 0a, t j = - 25 to 75 c 1.55 2.5 a i q_off off supply current v in = 3v, v on = 1.3v, i out = 0a, t j = - 25 to 75 c 2.4 6.5 a i sd_off off switch current v in = 3v, v on = 1.3v, v out = 0v, t j = - 25 to 75 c 0.1 3.5 a i q_off (von float) off supply current with on pin floating v in = 3v, v on = floating, i out = 0a, 1.6 2.3 a v in = 3v, v on = floating, i out = 0a, t j = - 25 to 75 c 1.6 4 a r ds(on) on resistance v in = 1.6v, v on = 0v, i out = 300ma v in = 3v, v on = 0v, i out = 300ma v in = 3.6v, v on = 0v, i out = 300ma v in = 4v, v on = 0v, i out = 300ma , t j = - 25 to 75 c 68 50 48 47 120 90 85 80 m ? v - on(inp) on input capacitance t j = - 25 to 75 c 5 pf i on(pull - up) on pull up current v in = 3v, v on = 0v , t j = - 25 to 75 c 0.3 0.76 1.2 a switching characteristics t on turn on time ( v on 50% to v out 90%) v in =3v, v on = 0v as logic low and 1.3v as logic high, c out = 1nf, r l = 30, t j = - 25 to 75 c 45 150 ns t don turn on delay time ( v on 50% to v out 10%) 35 100 ns t r ise turn on rise time ( v out 10% to 90%) 10 50 ns t off turn off time (v on 50% to v out 10%) 60 150 ns t doff turn off delay time ( v on 50% to v out 90%) 25 100 ns t f all turn off fall time ( v out 90% to 10%) 35 65 ns t don C doff turn on turn off delay delta time 50 ns
? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 5 f dz 2040l integrated load switch typical performance characteristics figure 3. quiescent current vs. temperature figure 4. quiescent current vs. supply voltage figure 5. off supply current vs. temperature figure 6. off supply current vs. supply voltage figure 7. off supply current(v on float) vs. temperature figure 8. off supply current(v on float) vs. supply voltage 1.00 1.25 1.50 1.75 2.00 2.25 2.50 - 55 - 35 - 15 5 25 45 65 85 105 125 quiescent current, i q (ua) junction temperature, t j ( o c) v in = 3v v on = 0.35v i out = 0a 0.0 0.5 1.0 1.5 2.0 2.5 1 1.5 2 2.5 3 3.5 4 4.5 quiescent current, i q (ua) supply voltage, v in (v) t a = 25 ( o c) 1 3 5 7 9 11 13 15 - 55 - 35 - 15 5 25 45 65 85 105 125 off supply current, i q_off ( ua) junction temperature, t j ( o c) v in = 3v v on = 1.3v i out = 0a 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 1 1.5 2 2.5 3 3.5 4 4.5 off supply current, i q_off (ua) supply voltage, v in (v) t a = 25 ( o c) 1 3 5 7 9 11 13 15 - 55 - 35 - 15 5 25 45 65 85 105 125 off supply current, i q_off (von float) (ua) junction temperature, t j ( o c) v in = 3v v on = float i out = 0a 0.0 0.5 1.0 1.5 2.0 2.5 1 1.5 2 2.5 3 3.5 4 4.5 off supply current, i q_off (von float) (ua) supply voltage, v in (v) t a = 25 ( o c)
? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 6 f dz 2040l integrated load switch typical performance characteristics (continued) figure 9. on pin pull up current vs. temperature figure 10. on pin pull up current vs. supply voltage figure 11. on pin logic h igh voltage vs. temperature figure 12. on pin logic h igh voltage vs. supply voltage figure 13. on pin logic low voltage vs. temperature figure 14. on pin logic low voltage vs. supply voltage - 1.5 - 1.2 - 0.9 - 0.6 - 0.3 0.0 - 55 - 35 - 15 5 25 45 65 85 105 125 on pin pull up current, i on(pull - up) (ua) junction temperature, t j ( o c) v in = 3v v on = 0v i out = 0a - 1.5 - 1.2 - 0.9 - 0.6 - 0.3 0.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 on pin pull up current, i on(pullup) (ua) supply voltage, v in (v) t a = 25 ( o c) 0.50 0.55 0.60 0.65 0.70 - 55 - 35 - 15 5 25 45 65 85 105 125 on pin logic high voltage, v ih (v) junction temperature, t j ( o c) v in = 3v 0.50 0.55 0.60 0.65 0.70 1 1.5 2 2.5 3 3.5 4 4.5 on pin logic high voltage, v ih (v) supply voltage, v in (v) t a = 25 ( o c) 0.50 0.55 0.60 0.65 0.70 - 55 - 35 - 15 5 25 45 65 85 105 125 on pin logic low voltage, v il (v) junction temperature, t j ( o c) v in = 3v 0.50 0.55 0.60 0.65 0.70 1 1.5 2 2.5 3 3.5 4 4.5 on pin logic low voltage, v il (v) supply voltage, v in (v) t a = 25 ( o c)
? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 7 f dz 2040l integrated load switch typical performance characteristics ( continued) figure 15. output pull down resistance vs. temperature figure 16. output pull down resistance vs. supply voltage figure 17. static drain to source on resistance vs. temperature figure 18. static drain to source on resistance vs. supply voltage 10 15 20 25 30 35 - 55 - 35 - 15 5 25 45 65 85 105 125 output pull down resistance ( ) junction temperature, t j ( o c) v in = 3v 10 15 20 25 30 35 1 1.5 2 2.5 3 3.5 4 4.5 output pull down resistance, ( ) supply voltage, v in (v) t a = 25 ( o c) 30 35 40 45 50 55 60 65 70 - 55 - 35 - 15 5 25 45 65 85 105 125 static drain to source on resistance, r dson (m ) junction temperature, t j ( o c) v in = 3v i out = 300ma 30 35 40 45 50 55 60 65 70 75 80 1 1.5 2 2.5 3 3.5 4 4.5 static drain to source on resistance, r dson (m ) supply voltage, v in (v) t a = 25( o c) i out = 300ma
? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 8 f dz 2040l integrated load switch typical performance characteristics (continued) v in = 3.3v, v on = 0 v, c in = 1uf, c out = 1n f, r l = 30 figure 19. t on response v in = 3.3v, v on = 0 v, c in = 1uf, c out = 1n f, r l = 30 figure 20. t off response
? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 9 f dz 2040l integrated load switch operation description the fdz 2040 l is a low r ds(on) p - channel load swit ch packaged in space saving 0.8x0.8 wl - csp. the core of the device is a 8 0 m p - channel mosfet and capable of functioning over a wide input operating range of 1 .6 - 4 v. applications informatio n figure 21. typical application input capacitor to reduce device inrush current effect , a 0.1uf ceramic capacitor, c in is recommended close to v in pin. a higher value of c in can be used to further reduce the voltage drop experienced as the switch is turned on into a large capacitive load. output capacitor fdz2040 l switch works without an output capacitor. however, if parasitic board inductance forces vout below gnd when switc hing off, a 1n f capacitor, c out , should be placed between vout and gnd. note s : the intrinsic diode for p - channel load switch would conduct if v out is greater than v in , by a diode drop demo board layout figure 22. top v iew figure 23. bottom v iew
? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 10 f dz 2040l integrated load switch dimensional outline and pad layout figure 24. official fsc drawings product - specific dimensions product d e x y fdz2040 l 0.8 0.03 mm 0.8 0.03 mm 0.21 mm 0.21 mm package drawings are provided as a service to customers considering fairchild components. drawings may change in any manner w ithout notice. please note the revision and /or date on the drawing and contact a fairchild semiconductor representative to verify o r obtain the most recent revision. package specifications do not expand the terms of fairchilds worldwide terms and conditions, specifically the warranty there in, which covers fairchild products. always visit fairchild semiconductors online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ . for current tape and reel specifications, visit fairchild semiconductors online packaging area: http://www.fairchildsemi.com/products/analog/pdf/mlp_tr.pdf (xxx this link should be specific to the package! )
? 20 12 f airchild semiconductor corporation www.fairchildsemi.com FDZ2040L rev. b1 11 f dz 2040l integrated load switch


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