s m d e s d p r o t e c t i o n d i o d e rohs device page 1 rev :d features -iec61000-4-2 8kv(contact), 15kv(air). -surface mount package. -high component density . mechanical data -case: sot -563 standard package, molded plastic. -t erminals: gold plated, solderable per mil- std-750d, method 2026. -mounting position: any . -w eight: 0.0034 gram (approx.). marking: e5u cpdh6-5v0u d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) s o t - 5 6 3 qw -bp002 comchip t echnology co., l td. e5u . 1 2 3 6 5 4 0.067(1.70) 0.059(1.50) 0.051(1.30) 0.043(1.10) 0.024(0.600) 0.021(0.525) 0.01 1(0.27) 0.007(0.17) 0.002(0.05)max 0.010(0.25)min 0.067(1.70) 0.059(1.50) 0.006(0.16) 0.004(0.09) 0.043(1.10) 0.035(0.90) 1 2 3 6 5 4 t yp parameter min max unit junction capacitance diode breakdown voltage v esd capability clamping voltage 80 pf v kv 6.1 7.1 8 peak pulse power w 80 leakage current ua 1.0 60 8 operation temperature 125 c forward voltage v 1.2 0.1 conditions i r = 1ma v r = 0v ,f = 1mhz i pp = 1a,t p =8/20us c = 150 p f , r = 300ohm, forward and reverse 10 pulses v r = 3v i f = 5ua i pp = 8a,t p =8/20us 10 symbol v bd c t v c esd p pp i l t j v f storage temperature t stg c 150 -55 maximum rating and electrical characteristics (at t a=25c unless otherwise noted)
f i g . 1 - 8 / 2 0 u s p e a k p u l s e c u r r e n t w a v e f o r m a c c . i e c 6 1 0 0 0 - 4 - 5 t ime (us) i p p m 0 % 2 0 % 4 0 % 6 0 % 8 0 % 1 0 0 % 0 1 0 2 0 3 0 4 0 8 us to 100% 20 us to 50us p o w e r r a t i n g ( % ) o ambient temperature ( c) mounting on glass epoxy pcbs ra ting and characteristic cur ves ( ) cpdh6-5v0u 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 c l a m p i n g v o l t a g e , v c ( v ) f i g . 3 - c l a m p i n g v o l a t a g e v s . p e a k p u l s e c u r r e n t peak pulse current,i pp (a) 8 2 0 8 10 12 4 6 6 4 2 0 8/20us waveform 2 5 5 0 7 5 1 0 0 1 5 0 0 1 2 5 f=1mhz o t a =25 c 0 20 40 60 80 0 1 2 3 5 4 100 c a p a c i t a n c e b e t w e e n t e r m i n a l s ( p f ) reverse voltage (v) f i g . 4 - c a p a c i t a n c e b e t w e e n t e r m i n a l s c h a r a c t e r is t i c s f ig . 2 - p o w e r r a ti n g d e r a ti n g c u r v e page 2 comchip t echnology co., l td. qw -bp002 rev :d s m d e s d p r o t e c t i o n d i o d e
page 3 comchip t echnology co., l td. qw -bp002 rev :d b c d d d 2 d 1 s o t - 5 6 3 s y m b o l a ( m m ) ( i n c h ) 1 . 9 6 9 m i n . 1 . 7 8 0 . 0 5 1 . 7 8 0 . 0 5 4 . 0 0 0 . 1 0 1 . 5 0 0 . 1 0 3 . 5 0 0 . 0 5 1 . 7 5 0 . 1 0 5 0 . 0 m i n . 1 3 . 0 0 . 2 0 0 . 6 9 0 . 0 5 4 . 0 0 0 . 1 0 2 . 0 0 0 . 0 5 8 . 0 0 0 . 3 0 1 4 . 4 m a x . 1 7 8 1 0 . 0 7 0 0 . 0 0 2 0 . 0 7 0 0 . 0 0 2 0 . 0 2 7 0 . 0 0 2 0 . 0 5 9 0 . 0 0 4 7 . 0 0 8 0 . 0 4 0 0 . 5 1 2 0 . 0 0 8 s o t - 5 6 3 s y m b o l ( m m ) ( i n c h ) 0 . 3 1 5 0 . 0 1 2 0 . 1 3 8 0 . 0 0 2 0 . 0 6 9 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 2 0 . 5 6 7 m a x e f p p 0 p 1 w w 1 s m d e s d p r o t e c t i o n d i o d e o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d 2 d w 1 t c direction of feed reel t aping specification i n d e x h o l e d e f b w p p 0 p 1 a
suggested p ad layout page 4 comchip t echnology co., l td. qw -bp002 rev :d size (inch) 0.018 (mm) 0.45 0.30 1.00 0.012 0.039 sot -563 1.35 0.053 e 1.80 0.071 b c d a a d c b e marking code part number cpdh6-5v0u marking code e5u e5u . 1 2 3 6 5 4 s m d e s d p r o t e c t i o n d i o d e standard packaging c a s e t y p e 3 , 0 0 0 r e e l ( p c s ) reel size (inch) 7 r e e l p a c k s o t - 5 6 3
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