features high brightness alingap material 0805 or 0603 industry standard footprint with 0.4 mm height for top emitting packages also available in right angle emitting and reverse mounting packages diffused optics operating temperatur e range of C40c to +85c compatible with ir soldering available in 4 colors available in 8 mm tape on 7" diameter reel reel sealed in zip locked moisture barrier bags applications membrane switch indicator lcd backlighting push button backlighting front panel indicator symbol backlighting keypad backlighting microdisplays small message panel signage description these chip type leds utilize aluminium indium galium phosphide (alingap) material technology. the alingap material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. the available colors in this surface mount series are 592 nm amber, 605 nm orange, 626 nm red and 639 nm deep red. all packages are binned by both color and intensity, ex- cept for red and deep red color. these chipleds come either in low profile top emit- ting packages (hsmx-c177/c197), in a side emitting package (hsmx-c120) or in a reverse mount package (hsmx-c265). the right angle chipled is suitable for ap- plications such as lcd back lighting. the top emitting chipleds with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. the reverse mount chipled is suitable for space saving. in order to facilitate pick and place operation, these chi- pleds are shipped in tape and reel, with 4000 units per reel for hsmx-c120/c177/c197 and 3000 units per reel for hsmx-c265. these packages are compatible with ir soldering pro- cess. device selection guide dimensions (mm) [1,2] amber red orange deep red package description 1.6 x 1.0 x 0.6 hsma-c120 hsmc-c120 hsml-c120 C untinted, non-diffused 2.0 x 1.25 x 0.4 hsma-c177 hsmc-c177 hsml-c177 hsmt-c177 untinted, diffused 1.6 x 0.8 x 0.4 hsma-c197 hsmc-c197 hsml-c197 hsmt-c197 untinted, diffused 3.4 x 1.25 x 1.1 hsma-c265 hsmc-c265 hsml-c265 hsmt-c265 untinted, non-diffused hsmx-c120, hsmx-c177, hsmx-c197 and hsmx-c265 high performance chip leds data sheet caution: hsma-cxxx, hsmc-cxxx, hsml-cxxx and hsmt-cxxx leds are class 1a esd sensitive per jesd22-a114c.01. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details .
2 package dimensions 0.80 (0.031) 1.60 (0.063) polarity 0.70 (0.028) min. cathode line 0.30 0.15 (0.012 0.006) diffused epoxy pc board 0.40 (0.016) 0.16 (0.006) soldering terminal cathode mark hsmx-c197 cathode mark 1.25 (0.049) 2.00 (0.079) diffused epoxy pc board 0.40 (0.016) 0.16 (0.006) polarity 0.40 0.15 (0.016 0.006) soldering terminal 1.10 (0.043) min. 0.40 0.15 (0.016 0.006) cathode line hsmx-c177 3.4 (0.134) 0.3 (0.012) 0.50 0.15 (0.020 0.006) 1.1 (0.043) polarity cathode mark (etched) 1.1 (0.043) 0.50 0.15 (0.020 0.006) 1.2 (0.047) 1.25 (0.049) led die undiffused epoxy pc board soldering terminal green solder mask cathode line hsmx-c265 1.6 (0.063) 0.5 (0.020) polarity cathode mark (anode mark for hsmh-c120) 1.0 (0.039) 3 C 0.3 (0.012) 1.2 (0.047) 0.3 (0.012) led die clear epoxy pc board soldering terminal 0.6 (0.024) cathode line hsmx-c120 notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified.
3 absolute maximum ratings at t a = 25?c parameter hsmx-cxxx units dc forward current [1] 25 ma power dissipation 60 mw reverse voltage (i r = 100 a) 5 v led junction temperature 95 ?c operating temperature range C40 to +85 ?c storage temperature range C40 to +85 ?c soldering temperature see reflow soldering profile (figures 8 & 9) notes: 1. derate linearly as shown in figure 4. electrical characteristics at t a = 25?c part number forward voltage v f (volts) @ i f = 20 ma reverse breakdown v r (volts) @ i r = 100 a capacitance c (pf), v f = 0, f = 1 mhz thermal resistance r jCpin (?c/w) typ. max. min. typ. typ. hsma-c120 1.9 2.4 5 11 400 hsma-c177/197 1.9 2.4 5 11 300 hsma-c265 1.9 2.4 5 11 550 hsmc-c120 1.9 2.4 5 15 400 hsmc-c177/197 1.9 2.4 5 15 300 hsmc-c265 1.9 2.4 5 15 550 hsml-c120 1.9 2.4 5 20 400 hsml-c177/197 1.9 2.4 5 20 300 hsml-c265 1.9 2.4 5 20 550 hsmt-c177/197 1.9 2.4 5 15 300 hsmt-c265 1.9 2.4 5 15 550 v f tolerance: 0.1 v
4 optical characteristics at t a = 25?c part number color luminous intensity i v (mcd) @ 20 ma [1] color, peak wavelength peak (nm) dominant wavelength d [2] (nm) viewing angle 2 1/2 degrees [3] luminous efficacy v (lm/w) min. typ. typ. typ. typ. typ. hsma-c120 amber 28.5 90 595 592 155 480 hsma-c177/197 amber 28.5 90 595 592 130 480 hsma-c265 amber 28.5 75 595 592 150 480 hsmc-c120 red 28.5 90 637 626 155 155 hsmc-c177/197 red 28.5 90 637 626 130 155 hsmc-c265 red 28.5 75 637 626 150 155 hsml-c120 orange 28.5 90 609 605 155 370 hsml-c177/197 orange 28.5 90 609 605 130 370 hsml-c265 orange 28.5 75 609 605 150 370 hsmt-c177/197 deep red 11.2 30 660 639 130 70 hsmt-c265 deep red 11.2 25 660 639 150 70 notes: 1. the luminous intensity, i v , is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
5 light intensity (iv) bin limits [1] intensity (mcd) bin id min. max. a 0.11 0.18 b 0.18 0.29 c 0.29 0.45 d 0.45 0.72 e 0.72 1.10 f 1.10 1.80 g 1.80 2.80 h 2.80 4.50 j 4.50 7.20 k 7.20 11.20 l 11.20 18.00 m 18.00 28.50 n 28.50 45.00 p 45.00 71.50 q 71.50 112.50 r 112.50 180.00 s 180.00 285.00 t 285.00 450.00 u 450.00 715.00 v 715.00 1125.00 w 1125.00 1800.00 x 1800.00 2850.00 y 2850.00 4500.00 notes: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your avago representative for information on currently available bins. 2. the iv binning specification set-up is for lowest allowable iv binning only. there are no upper iv bin limits. amber color bins [1] dom. wavelength (nm) bin id min. max. a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 orange color bins [1] dom. wavelength (nm) bin id min. max. a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 f 612.0 615.0 tolerance: 1 nm note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your avago representative for information on currently available bins. tolerance: 1 nm tolerance: 15% color bin limits red color bins [1] dom. wavelength (nm) bin id min. max. - 620.0 635.0 tolerance: 1 nm
6 figure 4. maximum forward current vs. ambient temperature. figure 3. luminous intensity vs. forward current. figure 2. forward current vs. forward voltage. figure 1. relative intensity vs. wavelength. 100 90 80 70 60 50 40 30 20 10 0 wavelength C nm relative intensity C % 500 550 600 650 700 as amber as orange as red as deep red 100 10 1 0 1.5 1.7 1.9 2.1 2.3 v f C forward voltage C v i f C forward current C ma 1.6 1.8 2.0 2.2 as alingap 0 0 20 60 80 90 5 i f max C maximum forward current C ma t a C ambient temperature C c 40 15 30 10 20 hsmx-c120/177/197 hsmx-c265 25 10 30 50 70 figure 5. relative intensity vs. angle for hsmx-c120. 100 90 80 70 60 50 40 30 20 10 0 relative intensity -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 angle 100 90 80 70 60 50 40 30 20 10 0 relative intensity -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 angle 05 15 i f C forward current C ma 0 0.4 1.0 luminous intensity (normalized at 20 ma) 20 0.6 0.2 0.8 10 30 1.4 25 1.2 as amber as orange, red and deep red
7 217 c 200 c 60 - 120 sec. 6 c/sec. max. 3 c/sec. max. 3 c/sec. max. 150 c 255 - 260 c 60 sec. max. 10 sec. max. time temperature figure 6. relative intensity vs. angle for hsmx-c177/197. figure 9. recommended pb-free reflow soldering profile. figure 10. recommended soldering pattern for hsmx-c177. figure 11. recommended soldering pattern for hsmx-c197. figure 7. relative intensity vs. angle for hsmx-c265. relative intensity C % 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 figure 8. recommended reflow soldering profile. 230c max. 10 sec. max. 4c/sec. max. over 2 min. time temperature 4c/sec. max. 140-160c 3c/sec. max. relative intensity C % 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 1.2 (0.04 7 1.2 (0.047) 0.9 (0.035) 1.2 (0.047) centering board 0.8 (0.03 1 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) centering board note: 1. all dimensions in millimeters (inches).
8 figure 14. reeling orientation. figure 15. reel dimensions. figure 12. recommended soldering pattern for hsmx-c120. figure 13. recommended soldering pattern for hsmx-c265. 0.7 (0.028) 0.8 (0.031) 0.8 (0.031) 1.2 (0.047) 0.4 (0.016) 0.15 (0.006) 0.4 (0.016) centering board 1.25 (0.049 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) 2.2 (0.087) dia. pcb h o 10.50 1.0 (0.413 0 59.60 1.00 (2.346 0.039) ? 20.20 min. (? 0.795 min.) 6 ps 178.40 1.00 (7.024 0.039) 3.0 0.5 (0.118 0.020) 4.0 0.5 (0.157 0.020) 5.0 0.5 (0.197 0.020) ? 13.1 0.5 (? 0.516 0.020) 8.0 1.0 (0.315 0.0 cathode side user feed direction printed label note: 1. all dimensions in millimeters (inches).
9 figure 16. tape dimensions. 8.00 0.30 (0.315 0.012) user feed direction dim. a (see table 1) 3.50 0.05 (0.138 0.002) 1.75 (0.069) dim. c (see table 1) 0.20 0.05 (0.008 0.00 carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 0.05 (0.079 0.002) 4.00 (0.157) 1.50 (0.059) cathode table 1 dimensions in millimeters (inches) dim. a 0.10 (0.004) dim. b 0.10 (0.004) part number dim. c 0.10 (0.004) hsmx-c120 position in carrier tape dim. b (see table 1) dim. a (see table 1) hsmx-c120 series hsmx-c177 series hsmx-c197 series hsmx-c120 r 0.5 0.05 (0.020 0.002) 0.75 (0.030) 0.60 (0.024) 0.60 (0.024) 1.90 (0.075) 2.30 (0.091) 1.75 (0.069) 1.15 (0.045) 1.40 (0.055) 0.95 (0.037) 8.00 0.30 (0.315 0.012) user feed direction dim. a (see table 1) 3.50 0.05 (0.138 0.002) 1.75 (0.069) dim. c (see table 1) 0.20 0.05 (0.008 0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 0.05 (0.079 0.002) 4.00 (0.157) 1.50 (0.059) hsmx-c265 series 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) table 1 dimensions in millimeters (inches) cathode dim. a 0.10 (0.004) dim. b 0.10 (0.004) part number dim. c 0.10 (0.004) notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified.
figure 17. tape leader and trailer dimensions. end start there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. mounted with components there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. minimum of 230 mm (9.05 inch) may consist of carrier and/or cover tape. for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. obsoletes av01-0520en av02-0975en - may 5, 2010 convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components . storage condition: 5 to 30c @ 60% rh max. baking is required under the condition: a) humidity indicator card is >10% when read at 23 5c b) device exposed to factory conditions <30c/60% rh more than 672 hours. baking recommended condition: 60 5c for 20 hours.
|
