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package outline ? 2009 nxp b.v. all rights reserved. reproduction in whole or in part is prohibited without prior consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of it?s use. publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights. printed in the netherlands www.nxp.com references outline version european projection issue date iec jedec jeita SOT926-1 - - - - - - - - - SOT926-1 05-12-09 05-12-22 unit a max mm 1.2 0.4 0.3 0.8 0.65 0.5 0.4 9.1 8.9 9.1 8.9 a 1 dimensions (mm are the original dimensions) tfbga100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm a 2 b d e e 2 7.2 e 0.8 e 1 7.2 v 0.15 w 0.05 y 0.08 y 1 0.1 0 2.5 5 mm scale b e 2 e 1 e e 1/2 e 1/2 e a c b ? v m c ? w m ball a1 index area a b c d e f h k g j 2 4 6 8 10 1 3 5 7 9 ball a1 index area b a e d c y c y 1 x detail x a a 1 a 2
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