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test and measurement products 1 www .semtech.com edge819 octal, 18v pin electronics driver description features functional block diagram applications revision 2 / august 16, 2004 the edge819 is an octal pin electronics driver fabricated in a wide voltage cmos process. it is designed specifically for test during burn in (tdbi) applications, where cost, functional density, and power are all at a premium. the edge819 incorporates eight channels of programmable drivers into one 14 mm x 20 mm 100 pin mqfp package. each channel has per pin driver levels, data, and high impedance control. the edge819 uses "flex in" digital inputs and, therefore, can mate directly with any digital technology. the edge819 is pin and functionally compatible with the edge818, except the edge819 does not have any comparators. the 18v driver output range allows the edge819 to interface directly with ttl, ecl, cmos (3.3v and 5v), lvcmos, and custom level circuitry, as well as the high voltage (super voltage) level required for many special test modes for flash device s. ? 18v i/o range ? 50 mhz operation ? per pin flexibility ? flex in digital inputs ? small footprint (100 pin mqfp) ? burn in ate ? low cost ate ? instrumentation 8 8 8 data en* vh vl dout
2 ? 2004 semtech corp. / rev. 2, 8/16/04 www .semtech.com test and measurement products edge819 pin description e m a n n i p# n i pn o i t p i r c s e d ) 7 : 0 ( a t a d1 3 , 7 2 , 3 2 , 9 1 , 2 1 , 8 , 4 , 0 0 1 f o e t a t s w o l / h g i h e h t e n i m r e t e d h c i h w s t u p n i l a t i g i d . d e l b a n e s i t i n e h w r e v i r d e h t ) 7 : 0 ( * n e8 2 , 4 2 , 0 2 , 6 1 , 5 1 , 1 1 , 7 , 3 . r e v i r d e h t e l b a s i d / e l b a n e h c i h w s t u p n i l a t i g i d c / n, 6 , 2 , 0 3 , 6 2 , 2 2 , 8 1 , 3 1 , 9 , 5 , 1 9 2 , 5 2 , 1 2 , 7 1 , 4 1 , 0 1 . t c e n n o c o n ) 7 : 0 ( t u o d2 5 , 6 5 , 0 6 , 4 6 , 7 6 , 1 7 , 5 7 , 9 7. s t u p t u o r e v i r d c / n0 5 , 4 5 , 8 5 , 2 6 , 9 6 , 3 7 , 7 7 , 1 8. t c e n n o c o n ) 7 : 0 ( h v1 5 , 5 5 , 9 5 , 3 6 , 8 6 , 2 7 , 6 7 , 0 8 " h g i h " r e v i r d e h t t e s t a h t s t u p n i g o l a n a d e r e f f u b n u . l e v e l e g a t l o v ) 7 : 0 ( l v3 5 , 7 5 , 1 6 , 5 6 , 6 6 , 0 7 , 4 7 , 8 7 " w o l " r e v i r d e h t t e s t a h t s t u p n i g o l a n a d e r e f f u b n u . l e v e l e g a t l o v c / n4 3 , 6 3 , 2 4 , 4 4 , 7 8 , 9 8 , 5 9 , 7 9. t c e n n o c o n c / n5 3 , 7 3 , 3 4 , 5 4 , 6 8 , 8 8 , 4 9 , 6 9. t c e n n o c o n b b v5 8 , 6 4e h t r o f d l o h s e r h t e h t s t e s t a h t e g a t l o v t u p n i g o l a n a . s t u p n i l a t i g i d c / n8 9 , 3 3. t c e n n o c o n c / n9 9 , 2 3. t c e n n o c o n c c v1 9 , 0 9 , 4 8 , 2 8 , 9 4 , 7 4 , 1 4 , 0 4. y l p p u s r e w o p e v i t i s o p e e v3 9 , 2 9 , 3 8 , 8 4 , 9 3 , 8 3. y l p p u s r e w o p e v i t a g e n
3 ? 2004 semtech corp. / rev. 2, 8/16/04 www .semtech.com test and measurement products edge819 pin description (continued) 1 81 51 31 n/c n/c en*0 data1 n/c n/c en*1 data2 n/c n/c en*2 data3 n/c n/c en*3 en*4 n/c n/c data4 en*5 n/c n/c data5 en*6 n/c n/c data6 en*7 n/c n/c vh0 dout0 vl0 n/c vh1 dout1 vl1 n/c vh2 dout2 vl2 n/c vh3 dout3 vl3 vl4 dout4 vh4 n/c vl5 dout5 vh5 n/c vl6 dout6 vh6 n/c vl7 dout7 vh7 data0 n/c n/c n/c n/c n/c n/c vee vee vcc vcc n/c n/c n/c n/c vbb vcc vee vcc n/c data7 n/c n/c n/c n/c n/c n/c vee vee vcc vcc n/c n/c n/c n/c vbb vcc vee vcc n/c 100 lead 14 x 20 mqfp
4 ? 2004 semtech corp. / rev. 2, 8/16/04 www .semtech.com test and measurement products edge819 circuit description driver description the edge819 supports programmable high and low levels and tristate per channel. there are no shared lines between any drivers. the en* and data signals are wide voltage high impedance analog inputs capable of receiving digital signals over a wide common mode range. vbb is the high impedance analog input which sets the threshold for en* and data. en*, da t a status > vbb "1" < vbb "0" with en* high, the driver goes into a high impedance state. with en* low, data high forces the driver into a high state, and data low forces the driver into a low state. en* da t a dout 1x hiz 01 vh 00 vl driver high and low vh and vl define the logical "1" and "0" levels of the driver, and can be adjusted anywhere over the range determined by vcc and vee. there are no restrictions between vh and vl, other than they must remain within the power supply levels. vee vh vcc vee vl vcc driver output protection in a functional testing environment, where a resistor is added in series with the driver output to create a 50 ? driver, the edge819 can withstand a short to any legal voltage for an indefinite amount of time. in a low impedance application, with no additional output resistance, the system should be designed to check for a short circuit prior to connecting the driver, and tristate the driver if a short is detected.
5 ? 2004 semtech corp. / rev. 2, 8/16/04 www .semtech.com test and measurement products edge819 application information power supply decoupling vcc and vee should be decoupled to gnd with a .1 f chip capacitor in parallel with a .001 f chip capacitor. a vcc and vee plane, or at least a solid power bus, is recommended for optimal performance. vh and vl decoupling as the vh and vl inputs are unbuffered and supply the driver output current, which can be quite large during edge transitions, decoupling capacitors for these inputs are recommended in proportion to the amount of output current requirements. for applications where vh and vl are shared over multiple channels, a solid power plane to distribute these levels is preferred. vbb the two vbb pins are connected together on-chip. therefore, only one vbb needs to be connected to for proper 819 operation. the two pins may be used to daisy chain a vbb signal across a pc board without having to route the actual signal underneath the 819. power supplies the edge819 has several power supply requirements to protect the part in power supply fault situations, as well as during power up and power down sequences. the following power supply requirements must be satisifed at all times: vee all i/o pins vcc at all times the power sequence below can be used as a guideline when operating the edge819: power-on sequencing power-off sequencing 1. vcc (substrate) 1. i/o pins 2. vee 2. vee 3. i/o pins 3. vcc figure 1. power supply protection scheme warning: it is extremely important that the voltage on any device pin does not exceed the range of vee ?.5v to vcc +0.5v at any time, either during power up, normal operation, or during power down. failure to adhere to this requirement could result in latchup of the device, which could be destructive if the system power supplies are capable of supplying large amounts of current. even if the device is not immediately destroyed, the cumulative damage caused by the stress of repeated latchup may affect device reliability. the three diode configuration shown in figure 1 should be used on a once-per-board basis. vcc vdd vee 1n5820 or equivalent external logic supply external system ground
6 ? 2004 semtech corp. / rev. 2, 8/16/04 www .semtech.com test and measurement products edge819 package information pin descriptions d2 e2 d z d z e 4 3 3 CdC 3 CbC 4 CeC CaC e see detail "a" top view 0.25 cd 4x a C b 0.20 4x cd a C b d1 2 5 7 5 7 5 7 e1 c o o bottom view 100-pin mqfp 14 mm x 20 mm
7 ? 2004 semtech corp. / rev. 2, 8/16/04 www .semtech.com test and measurement products edge819 package information (continued) ?, b, d 3 e / 2 detail "a" C 0.40 min. 0 C 7 ? ? 0.13 / 0.30 r. typ. gage plane base plane seating plane 0.25 1.60 ref. l c c a2 0.10 s 0.13 r. min. detail "b" 0 min. a1 ChC 0.076 CcC 2 8 12 b 12 C 16 ? 12 C 16 ? d c s m s ccc a C b a see detail "b" b 1 base metal 0.13 / 0.17 0.13 / 0.23 1.28 ref. with lead finish section cCc notes: 1. all dimensions and tolerances conform to ansi y14.5-1982. 2. datum plane -h- located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. datums a-b and -d- to be determined where centerline between leads exits plastic body at datum plane -h-. 4. to be determined at seating plane -c-. 5. dimensions d1 and e1 do not include mold protrusion. allowable mold protrusion is 0.254 mm per side. dimensions d1 and e1 do include mold mismatch and are determined at datum plane -h-. 6. ??is the total # of terminals. 7. package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 8. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. dambar cannot be located on the lowerradius or the foot. 9. all dimensions are in millimeters. 10. maximum allowable die thickness to be assembled in this package family is 0.635 millimeters. 11. this drawing conforms to jedec registered outlines ms-108 and ms-022. 12. these dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip. l o b m y sn i mm o nx a me t o ns t n e m m o c a4 0 . 30 4 . 3b c p e v o b a t h g i e h 1 a5 2 . 03 3 . 0b c p e v o b a p a g 2 a7 5 . 21 7 . 27 8 . 2s s e n k c i h t y d o b dc s b 0 2 . 3 24 1 dc s b 0 0 . 0 25n o i s n e m i d y d o b 2 df e r 5 8 . 8 1 d zf e r 8 5 . 0 e0 2 . 7 14 1 ec s b 0 0 . 4 15n o i s n e m i d y d o b 2 ef e r 5 3 . 2 1 e zf e r 3 8 . 0 l3 7 . 08 8 . 03 0 . 1 n0 0 16t n u o c n i p ec s b 5 6 . 0h c t i p d a e l b2 2 . 08 3 . 08 n o i s n e m i d d a p 1 b2 2 . 00 3 . 03 3 . 0n o i s n e m i d d a p c c c3 1 . 0 d n0 3t n u o c n i p e d i s e n0 2t n u o c n i p e d i s variations (all dimensions in millimeters)
8 ? 2004 semtech corp. / rev. 2, 8/16/04 www .semtech.com test and measurement products edge819 recommended operating conditions absolute maximum ratings r e t e m a r a pl o b m y sn i mp y tx a ms t i n u y l p p u s g o l a n a l a t o te e v - c c v0 1 +8 1 +v e r u t a r e p m e t g n i t a r e p o t n e i b m aa t0 7 o c e r u t a r e p m e t n o i t c n u jj t5 2 1 + o c e g a k c a p f o e c n a t s i s e r l a m r e h t ) r i a l l i t s o t n o i t c n u j ( a j 2 . 2 3 o w / c e g a k c a p f o e c n a t s i s e r l a m r e h t ) e s a c o t n o i t c n u j ( c j 4 . 2 1 o w / c r e t e m a r a pl o b m y sn i mx a ms t i n u y l p p u s r e w o p l a t o te e v c c v5 . 0 0 . 9 1v s e g a t l o v t u p n i l a t i g i d* n e , a t a d5 . e e v5 . + c c vv s e g a t l o v t u p n i g o l a n ab b v , l v , h v5 . e e v5 . + c c vv s e g a t l o v t u p t u o g o l a n at u o d5 . e e v5 . + c c vv e r u t a r e p m e t g n i t a r e p o t n e i b m aa t0 5 5 2 1 + o c e r u t a r e p m e t e g a r o t ss t5 6 0 5 1 + o c e r u t a r e p m e t n o i t c n u jj t0 5 1 + o c e r u t a r e p m e t g n i r e d l o s ) n i p e h t m o r f " 5 2 . , s d n o c e s 5 ( l o s t0 6 2 + o c stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. this is a stress rating only, and functional operation of the device at these, or any other conditions beyond those listed, is not implied. exposure to absolute maximum conditions for extended periods may affect device reliability.
9 ? 2004 semtech corp. / rev. 2, 8/16/04 www .semtech.com test and measurement products edge819 dc characteristics r e t e m a r a pl o b m y sn i mp y tx a ms t i n u r e v i r d e g a t l o v h g i h e g a t l o v w o l g n i w s t u p t u o t n e r r u c e g a k a e l z i h e c n a d e p m i t u p t u o ) 1 e t o n ( t n e r r u c t u p t u o c d ) 2 e t o n ( t n e r r u c t u p t u o c a h v l v l v h v k a e l i t u o r c d t u o i c a t u o i e e v e e v e e v 0 . 2 0 . 9 5 2 1 0 0 4 0 2 1 c c v c c v c c v 0 . 2 + 5 1 5 2 1 + 0 0 4 + v v v a n ? a m a m s t u p n i l a t i g i d e g a t l o v h g i h t u p n i e g a t l o v w o l t u p n i t n e r r u c t u p n i e g n a r e d o m n o m m o c b b v - a t a d , * n e a t a d , * n e b b v n i i * n e , a t a d 0 . 1 0 . 1 0 0 1 e e v 00 0 1 + c c v v v a n v s e i l p p u s r e w o p ) 3 e t o n ( t n e r r u c y l p p u s e v i t i s o p ) 3 e t o n ( t n e r r u c y l p p u s e v i t a g e n c c i e e i 6 3 6 3 7 5 7 5 8 7 8 7 a m a m test conditions (unless otherwise specified): "recommended operating conditions". vcc = +15v, vee = 3v. note 1: dc output current is specified per individual driver. note 2: surge current capability for durations of < 2 seconds. note 3: vcc = +15v, vee = 3v.
10 ? 2004 semtech corp. / rev. 2, 8/16/04 www .semtech.com test and measurement products edge819 ac characteristics r e t e m a r a pl o b m y sn i mp y tx a ms t i n u r e v i r d ) 4 , 2 s e t o n ( t u o d o t a t a d ) 1 e t o n ( ) z i h o t e v i t c a ( t u o d o t * n e ) e v i t c a o t z i h ( t u o d o t * n e d p t d p t d p t 5 . 9 0 1 1 1 5 . 4 1 0 2 6 1 5 . 9 1 0 3 1 2 s n s n s n ) 2 e t o n ( s e m i t l l a f / e s i r ) % 0 8 - % 0 2 ( g n i w s v 1 ) % 0 9 - % 0 1 ( g n i w s v 3 ) % 0 9 - % 0 1 ( g n i w s v 5 ) % 0 9 - % 0 1 ( g n i w s v 0 1 ) % 0 9 - % 0 1 ( g n i w s v 5 1 f t / r t f t / r t f t / r t f t / r t f t / r t 0 . 3 5 . 3 0 . 4 5 . 4 0 . 5 s n s n s n s n s n ) 3 e t o n ( y c n e u q e r f g n i t a r e p o m u m i x a mx a m f0 5z h m h t d i w e s l u p m u m i n i m 81 1s n test conditions (unless otherwise specified): "recommended operating conditions". vcc = +15v, vee = 3v. note 1: load = 10 ma and measured when a 1v change at the output is detected. (vh = 3v, vl = 0v, vfloat = 1.5v, tested at 1v and 2v.) note 2: into 18 cm of 50 ? transmission line terminate with 1 k ? and 5 pf, with proper series termination resistor. guaranteed by characterization. this parameter is not tested in production. note 3: this parameter is production tested at 40 mhz. note 4: from vbb threshold of data to 50% level of dout.
11 ? 2004 semtech corp. / rev. 2, 8/16/04 www .semtech.com test and measurement products edge819 ordering information r e b m u n l e d o me g a k c a p f h a 9 1 8 e p f q m d a e l 0 0 1 e z i s y d o b m m 0 2 x m m 4 1 r e d a e r p s t a e h l a n r e t n i / w f h a 9 1 8 m v ed r a o b n o i t a u l a v e 9 1 8 e g d e contact information for semtech international ag taiwan branch korea branch shanghai office tel: 886-2-2748-3380 fax: 886-2-2748-3390 tel: 82-2-527-4377 fax: 82-2-527-4376 tel: 86-21-6391-0830 fax: 86-21-6391-0831 semtech switzerland gmbh japan branch semtech limited (u.k.) semtech france sarl semtech germany gmbh tel: 81-3-6408-0950 fax: 81-3-6408-0951 tel: 44-1794-527-600 fax: 44-1794-527-601 tel: 33-(0)169-28-22-00 fax: 33-(0)169-28-12-98 tel: 49-(0)8161-140-123 fax: 49-(0)8161-140-124 semtech inter national ag is a wholly-owned subsidiar y of semtech corporation, which has its headquar ters in the u.s.a.

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