njl5196k / 97k -1- general purpose photo reflector ? general description the njl5196k/5197k are miniature and thin general purpose photo reflectors, which can be soldering by reflow-method. these are compatible to njl5181k/5183k in the characteristics, and attain high cost performance. in order to prevent from degradation of this device in moisturing at reflow-method, so that keep the precaution for handling. ? features ? ? miniature, thin type ? built-in visible light cut-off filter ? high output, high s/n ratio ? applications ? end detector of video, audio tape ? rotation detection and control of various motors, audio turntables ? paper edge detection and mechanism timing detec tion of facsimile, printer, x-y recorder ? reading film information and mechanism timing detection of camera ? reading out the characters of bar code reader, encoder and automatic vending machine ? various detection of industrial system, such as fdd, robot ? absolute maximum ratings (ta=25 c) parameter symbol ratings unit emitter forward current (continuous) reverse voltage (continuous) power dissipation i f v r p d 30 6 45 ma v mw detector collector-emitter voltage emitter-collector voltage collector current collector power dissipation v ceo v eco i c p c 16 6 10 25 v v ma mw coupled total power dissipation operating temperature storage temperature reflow soldering temperature p tot t opr t stg t sol 60 -20 to +85 -40 to +85 260(10sec. 1.5mm from body) mw c c c ? electro-optical characteristics (ta=25 c) parameter symbol test condition min typ typ unit emitter forward voltage reverse current capacitance v f i r c t i f =4ma v r =6v v r =0v,f=1mhz ? ? ? ? ? 25 1.4 10 ? v a pf detector dark current collector-emitter voltage i ceo v ceo v ce =10v i c =100 a ? 16 ? ? 0.2 ? a v coupled output current operating dark current rise time fall time i o i ceod t r t f i f =4ma,v ce =2v,d=0.7mm i f =4ma,v ce =2v i o =100 a,v ce =2v,rl=1k ? ,d=0.7mm i o =100 a,v ce =2v,rl=1k ? ,d=0.7mm 50 ? ? ? ? ? 30 30 150 0.2 ? ? a a s s
njl5196k / 97k -2- ? outline (typ.) unit:mm 3.4 2.5 2.6 2.5 1.4 0.85 0.5 0.15 0.7 0.45 0.6 2.0 1.6 0.8 njl5196k-f10 3.4 2.6 0.15 0.75 1.6 0.2 3.8 5.5 0.7 0.45 0.6 2.0 0.5 njl5196k-f20 3.4 2.6 0.75 1.6 3.0 0.7 0.45 0.6 2.0 0.5 1.0 njl5196k-f25 3.4 2.5 2.6 2.5 1.4 0.85 0.5 0.15 0.7 0.45 0.6 1.8 1.6 0.8 NJL5197K-F10 3.4 2.6 0.15 0.75 1.6 0.2 3.8 5.5 0.7 0.45 0.6 1.8 0.5 njl5197k-f20 3.4 2.6 0.75 1.6 3.0 0.7 0.45 0.6 1.8 0.5 1.0 njl5197k-f25 anode cathode emitter collector anode cathode emitter collector anode cathode emitter collector anode cathode collector emitter anode cathode collector emitter anode cathode collector emitter
njl5196k / 97k - 3 - i f light shield box v ce i ceod lead edge d=0.7mm aluminum evaporation suface l aluminum evaporation suface i f io v ce 0.7mm power dissipation vs. temperature 0 10 20 30 40 50 60 70 80 90 100 0 20406080100 ambient temperature ta( c) power dissipation p(mw) forward current vs. temperature 0 5 10 15 20 25 30 35 40 45 50 0 20406080100 ambient temperature ta(c) forward current if(ma) aluminum evaporation suface i f 0.7mm v+ rl io rd p.g. osc 10% 90% tf input tw output t r measuring specification for output current the output current can be measured when reflected at the aluminum measuring circuit for operating dark current measuring specification for edge response measuring circuit for response time maximum rating curves total p ower dissipation collector power dissipation
njl5196k / 97k -4- forward voltage vs. forward current 1 10 100 012 forward voltage vf(v) forward current if(ma) forward voltage vs. temperature 0.8 1 1.2 1.4 1.6 -40-200 20406080100 ambient temperature ta( c) forward voltage vf(v) dark current vs. temperature 0.001 0.01 0.1 1 10 100 1000 10000 -40-20 0 20406080100 ambient temperature ta(c) dark current iceo(na) operating dark current vs. temperature 0.01 0.1 1 10 100 1000 -40 -20 0 20 40 60 80 100 ambient temperature ta(c) operating dark current iceod(na) output current vs. forward current (ta=25 c) 0 50 100 150 200 250 300 0246810 forward current if(ma) output current io( a) output current vs. temperature 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 ambient temperature ta( c) relative output current io/io(25 c)(%) if=4ma if=30ma vce=10v if=4ma,vce=2v if=4ma,vce=2v typical characteristics vce=2v,d=0.7m
njl5196k / 97k - 5 - output characteristics (ta =25c) 0 50 100 150 200 250 300 350 400 012345 collector-emitter voltage vce(v) output current io( a) vce saturation (ta=25c) 0 0.1 0.2 0.3 0.1 1 10 forward current if(ma) collector-emitter voltage vce(v) output current vs. dista nce (ta=25c) 0 20 40 60 80 100 120 012345 reflector distance d(mm) relative output current io/io(max.)(% ) output current vs. edge distance (ta=25c) 0 20 40 60 80 100 120 -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 edge distance l(mm) relative output current io/io(max.)(% ) spectral response (ta=25 c) 0 20 40 60 80 100 120 500 600 700 800 900 1000 wavelength (nm) relative response (%) switching time vs. load resistance (ta=25 c) 1 10 100 1000 0.1 1 10 load resistance rl(k ? ) switching time t( s) vce=2v if=4ma if=2ma if=6ma if=8ma if=4ma,vce=2v if=4ma,vce=2v,d=0.7mm vce=2v,io=100 a td tf tr io=10 a io=200 a io=30 a io=50 a if=10ma io=70 a io=100 a io=150 a
njl5196k / 97k - 6 - temparature (oc) time less than 30 sec. 3 to 5 sec. 100 50 0 preparatory heating 60 to 120 sec. 250 200 150 precaution for handling 1. soldering to actual circuit board soldering condition - lead?s of soldering temperature and heating time. 260 c maximum, less than 10 seconds, at least 1.5mm from body. - heated condition of plastic package. lower then 240 c of maximum surface temperature, less than 30 seconds of time kept higher then 200 c. soldering method 1) reflow method recommended temperature profile of its method. preparatory heating condition : 120 to 150 c about 60 sec. recommended soldering temperature : 230 to 240 c about 3 to 5 sec. slowly cool down right after soldering. soldering to be done within twice under this condition. 2) reflow method (in case of infrared heating) - temparature profile : same to the above - avoid direct i rradiation to the plastic package because it is blac k colored, absorbs the infrared radiation and its s urface temperature will be higher than lead itself. 3) the other method avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (vps). if the device is heated to high temperature and kept in its cond ition for longer time, it would affect to its reliability. it is necessary to solder in short time as soon as possible. 2. cleaning avoid washing the device after soldering by reflow method. 3. attention in handling 1) treat not to touch the lens surface. 2) avoid dust and any other foreign mate rials (paint, bonding materials) on the lens surface. 3) never to apply reverse voltage (v ec ) of more then 6v on the photo transistor when measuring the characteristics or adjusting the system. if applied, it causes to lower the sensitivity. 4) when mounting, special care has to be taken on the mounting position and tilting on the device because it is very important to place the device to the optimum position to the object. 4. storage in order to prevent from degradation of this device in moistu ring at reflow method, so that this device is contained in deaeration packing. and the leads are silver plated and they are discolored if the device is left open to the air for long afte r taken out of the envelope. it causes deterioration of soldering char acteristics. so that mount the device as short as possible after opening the envelope.
njl5196k / 97k -7- 2.0 4.0 8.0 12.0 5.5 12.0 1.75 3.8 0.3 1.8 carrier tape cover tape 1.5 13.5 19.5 80 330 13 label thick paper styrofoam njl5196k-f10 / NJL5197K-F10 taping specification (te1) 1. taping size 1) carrier tape is used with styrene type carbonated plastic. 2) cover tape is used with electro statistically prevention treated polyester type tape. 3) product taping direction is to place the index mark against the pull out direct ion of the tape as in the drawing. 2. taping strength pullup the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength is to be within the power of 20 to 70g. 3. packaging 1) the taped products are to be rolled up on the taping reel as on the drawing 2) rolling up specification start rolling : carrier tape open space more than 20 peaces. end of rolling : carrier tape open space more than 20 peaces, and 2 round of reel space at the cover tape only. 3) taping quantity : 3,000 pieces 4) seal off after putting each reels in a vinyl bag with silica gel (3 bags).
njl5196k / 97k - 8 - 2.0 4.0 5.9 8.0 5.5 12.0 1.75 3.8 0.3 2.0 carrier tape cover tape 1.5 13.5 19.5 80 330 13 label thick paper styrofoam njl5196k-f20 / njl5197k-f20 taping specification (te1) 1. taping size 1) carrier tape is used with styrene type carbonated plastic. 2) cover tape is used with electro statistically prevention treated polyester type tape. 3) product taping direction is to place the index mark against the pull out direct ion of the tape as in the drawing. 2. taping strength pullup the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength is to be within the power of 20 to 70g. 3. packaging 1) the taped products are to be rolled up on the taping reel as on the drawing 2) rolling up specification start rolling : carrier tape open space more than 20 peaces. end of rolling : carrier tape open space more than 20 peaces, and 2 round of reel space at the cover tape only. 3) taping quantity : 4,000 pieces 4) seal off after putting each reels in a vinyl bag with silica gel (3 bags).
njl5196k / 97k - 9 - 2.0 4.0 3.4 8.0 5.5 12.0 1.75 3.8 0.3 2.0 1.5 carrier tape cover tape 13.5 19.5 80 330 13 label thick paper styrofoam njl5196k-f25 / njl5197k-f25 taping specification (te1) 1. taping size 1) carrier tape is used with styrene type carbonated plastic. 2) cover tape is used with electro statistically prevention treated polyester type tape. 3) product taping direction is to place the index mark against the pull out direct ion of the tape as in the drawing. 2. taping strength pullup the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength is to be within the power of 20 to 70g. 3. packaging 1) the taped products are to be rolled up on the taping reel as on the drawing 2) rolling up specification start rolling : carrier tape open space more than 20 peaces. end of rolling : carrier tape open space more than 20 peaces, and 2 round of reel space at the cover tape only. 3) taping quantity : 4,000 pieces 4) seal off after putting each reels in a vinyl bag with silica gel (3 bags). [caution] the specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. the application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights.
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