mos integrated circuit pd65881gb-p03 pd71055-compliant parallel interface unit gate array data sheet document no. a18501ej3v0ds00 (3rd edition) date published march 2008 ns printed in japan ? nec electronics corporation 2007 the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. following the phase-out of its popular pd71055 standard programmable parallel in terface unit, nec electronics is now offering the pd65881gb-p03 programmable parallel in terface gate array, a functional low-cost substitute for the pd71055. to verify the applicability of the pd65881gb-p03 gate array as a replacement for the pd71055, you must first test an equivalent prototype in the system being developed. if the in-system test is deemed successful, then you may proceed to purchase mass production versions of the product. description internal block functions and commands are the same as those of the pd71055. differences between the two products are listed below. before adopting this product, carefu lly read the disclaimer below and the caution in section 3 (cautions when considering adoption of this product) . the pd65881gb-p03 integrates an na55a ip macro in a cmos-n5 gate array. with three i/o ports, the gate array is capable of operations ranging from basic input/output operations to high-level operations using handshaking protocols. features ? three 8-bit i/o ports ? three programmable operation modes ? bit manipulation command ? microcontroller-compatible ? no-wait operation ? cmos technology ? single power supply: 5v 10% ? industrial temperature r ange (ambient): ?40 to 85c ? 44-pin qfp package ? rohs-compliant
data sheet a18501ej3v0ds 2 pd65881gb-p03 disclaimer ? this product is not functiona lly equivalent to any similar non-nec electr onics product. nec electronics shall assume no responsibility for any loss or damage incurred by customers or thir d parties resulting from the replacement of products similar to, but other than, the pd71055gb-10-3b4. ? nec electronics shall assume no responsibility for any loss or dam age incurred by customers or third parties resulting from t he use of this product outside the conditi ons described in the absolute maximum ratings, recommended operation range, and quality grades. comparison of pd65881gb-p03 and pd71055 feature this product pd71055 reference part number (mark) pd65881gb-p03-3bs-a (658n55) pd71055gb-10-3b4 (standard nec electronics mark) ? package type only 44-pin qfp qfp, dip, qfj ? package shape (comparison of 44-pin qfp) the body size and package width are the same, but the pin lengths and pin bending method are different. 4. package drawing function of pin 1 ic (connec tion with external pin prohibited) nc 1. pin layout lead-free support yes no ordering information recommended soldering conditions ir60-207-3, partial heating ir35-00-3, vp15-00-3, ws60-00-1, partial heating 5. recommended soldering conditions absolute maximum ratings power supply voltage ? 0.5 to + 6.0 (v) ? 0.5 to + 7.0 (v) input voltage ? 0.5 to + 6.0 (v) ? 0.5 to v dd + 0.3 (v) output voltage ? 0.5 to + 6.0 (v) ? 0.5 to v dd + 0.3 (v) recommended operating range t a = ? 40 to + 85 c, v dd = 5 v 10% this product does not guarantee operation at less than 4.5 v. dc characteristics partially different ac characteristics this product has the following restrictions on load capacitance. d7 to d0: 150 pf or less p07 to p00, p17 to p10, p27 to p20: 40 pf or less 2. electrical specifications ordering information part number package pd65881gb-p03-3bs-a 44-pin plastic qfp (10 x 10 mm) remark products with -a at the end of t he part number are lead-free products. quality grades "standard" this product is intended to be used for applications su ch as computers, office equipment, communications equipment, test and measurement equipment, and home electr onic appliances. it theref ore cannot be used for the following applications. applications requiring special or spec ific grades, such as transportation equi pment (automobiles, trains, ships, etc.), traffic control systems, medical equi pment, aircraft equipment, and aerospace equipment. remark for details of quality grades, refer to quality grades on nec semiconductor devices (document number: c11531e) .
data sheet a18501ej3v0ds 3 pd65881gb-p03 block diagram ( pd71055) 8 8 8 4 or 5 4 or 3 8 8 8 d 7 -d 0 d 7 -d 0 p 17 -p 10 p 27 -p 24 (p 23 ) p 23 (p 22 ) -p 20 data bus buffer (8) read/write control 8 group 0 control group 0 control command register cs reset a1 a0 rd wr port 2 port 1 port 0 4 8 3
data sheet a18501ej3v0ds 4 pd65881gb-p03 1. pin layout for a description of pin functions, refer to the pd71055 data sheet (document number: ic-1921). pin no. i/o pin name name of pin on pd71055 pin no. i/o pin name name of pin on pd71055 1 ? ic (v dd ) note nc 23 ? v dd 2 i csb cs 24 i/o d7 3 ? gnd 25 i/o d6 4 i a1 26 i/o d5 5 i a0 27 i/o d4 6 i/o p27 28 i/o d3 7 i/o p26 29 i/o d2 8 i/o p25 30 i/o d1 9 i/o p24 31 i/o d0 10 i/o p20 32 i reset 11 i/o p21 33 ? nc 12 i/o p22 34 ? nc 13 i/o p23 35 i wrb wr 14 i/o p10 36 i/o p07 15 i/o p11 37 i/o p06 16 i/o p12 38 i/o p05 17 ? ic (gnd) note 39 i/o p04 18 i/o p13 40 i/o p03 19 i/o p14 41 i/o p02 20 i/o p15 42 i/o p01 21 i/o p16 43 i/o p00 22 i/o p17 44 i rdb rd note this pin is connected to gnd or v dd in the chip. to enhance the power supply to handle noise, this pin can be connected to the power supply pin of the board to improve t he noise resistance performance.
data sheet a18501ej3v0ds 5 pd65881gb-p03 2. electrical specifications this section describes only the differences with the pd71055. for electrical specifications ot her than those below, refer to the pd71055 data sheet (document number: ic-1921). absolute maximum ratings parameter symbol conditions ratings unit power supply voltage v dd ? 0.5 to + 6.0 v input voltage v i ? 0.5 to + 6.0 v output voltage v o ? 0.5 to + 6.0 v caution product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. in other words, the absolute maximum ratings ar e values at which the product may begin to suffer degradation. the refore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. recommended operating range this is the same as the pd71055. this product does not guarant ee operation at less than 4.5 v. dc characteristics (v dd = 5 v 10%, t a = ? 40 to + 85 c) this product pd71055 parameter symbol condition min. typ. max. condition min. typ. max. unit input voltage, high v ih 2.29 v dd 2.2 v dd + 0.3 v input voltage, low v il 0.00 0.77 ? 0.5 0.8 v i oh = 0 ma v dd ? 0.1 output voltage, high v oh i oh = 3.0 ma v dd ? 0.4 i oh = ? 400 a 0.7 v dd v output voltage, low v ol i ol = 3 ma 0.4 i ol = 2.5 ma 0.4 v output current, low i ol 3.0 2.5 ma ac characteristics these are similar to the pd71055 characteristics, except for the fo llowing restrictions on load capacitance. operation outside the r ange of these restricti ons is not guaranteed. d7 to d0: 150 pf or less p07 to p00, p17 to p10, p27 to p20: 40 pf or less
data sheet a18501ej3v0ds 6 pd65881gb-p03 3. cautions when considering adoption of this product when considering the adoption of this product, note the following points. (1) functional check using product samples before adopting this product, make sure to request product samples from nec electronics to check the functions. product samples are available free of charge. when mounting this product onto different multiple printed circuit boards, ex tensively check the functions by changing the supply voltage to be supplied to the printed circuit boards as well as the temperature conditions for all printed circuit boards. the standard number of product samples is five. w hen requesting product samples, provide the following information to your nec electronics sales representative. your company name, your name, product application, the period of starting adoption, the number of products to be adopted (2) submitting the approval sheet when normal operation has been confi rmed and the adoption has been decided, complete a copy of the approval sheet (appendix of this document ) and submit it to nec electronics. (3) shipment inspection shipment inspection is perform ed for this product using the pd71055gb-10-3b4 shipment test pattern. the dc characteristics satisfy the gat e array shipment inspection. (4) order amount orders from a minimum of 100 units, and in units of 100 are accepted. (5) package, packing form the dimensions are partia lly different from the pd71055gb-10-3b4. refer to the package drawing and confirm that the product can ac tually be mounted. dry pack tray packing is used for packing. (6) price contact your local nec electronics sales representative for pricing information. (7) obtaining the pd71055 data sheet note the pd71055 (original product) data sheet is ava ilable from the nec electronics web site (http://www.necel.com/) at http://www.necel.com/nes dis/image/ic-1921b.pdf note please make this data sheet a standalone document. do not refer customers to the data sheet for an obsolete device.
data sheet a18501ej3v0ds 7 pd65881gb-p03 4. package drawing 44-pin plastic qfp (10x10) item millimeters a b d g 13.2 0.2 10.0 0.2 0.8 (t.p.) 1.0 j 13.2 0.2 k s44gb-80-3bs-2 c 10.0 0.2 i 0.16 1.6 0.2 l 0.8 0.2 f 1.0 n p q s 0.10 2.7 0.1 0.125 0.075 3.0 max. m 0.17 + 0.06 ? 0.05 h 0.37 + 0.08 ? 0.07 r3 + 7 ? 3 note each lead centerline is located within 0.16 mm of its true position (t.p.) at maximum material condition. 33 34 22 44 1 12 11 23 s s n j detail of lead end c d a b r k m l p i s q g f m h 5. recommended soldering conditions these products should be soldered and mount ed under the following recommended conditions. for soldering methods and conditions other t han those recommended below, please contact an nec electronicssales representative. for technical information, see the following website. semiconductor device mount manual (http ://www.necel.com/pkg/en/mount/index.html) soldering method soldering conditons recommended condition symbol infrared reflow package peak temperature: 260c time: 60 seconds max. (at 220c or higher) count: 3 times or less exposure limit: 7 days note (after that, prebake at 125c for 20 to 72 hours) ir60-207-3 partial heating pin temperature: 350c max. time: 3 seconds max. (per pin row) ? note after opening the dry pack, store it at 25c or le ss and 65% rh or less for the allowable storage period. caution do not use different soldering met hods together (except for partial heating).
data sheet a18501ej3v0ds 8 pd65881gb-p03 appendix approval sheet copy this page and complete and confirm the required items. if you accept the conditions, sign and subm it this sheet to nec electronics. approval sheet to: nec electronics ( ) we have confirmed through sample evaluations that the device functions as stated in the specifications and agree to use the device in accordance with t he boxes checked below in the ?confirmed items? section. company : date (yy/mm/dd): name: signature: department: title: applications (set) check the boxes below, to indicate confirmation of related matters. device (part-number) pd65881gb-p01-3bs-a ( pd71054 function compatible) pd65881gb-p02-3bs-a ( pd71051 function compatible) pd65881gb-p03-3bs-a ( pd71055 function compatible) office nec electronics counterpart name confirmed items confirm the contents below and check the confirmed items. all items must be confirmed and checked. 1. differences from the original product ( pd71051/71054/71055) and notes for use of the function-compatible devic e(s) in the data sheet 2. proper operation in the actual application environment, using samples 3. necessity of re-evaluation before using in a new or different board or application set 4. necessity of using the board with at l east four layers and a stable power supply. conventionally ignored noise entering chips ma y be interpreted as being normal signals when the function-equivalent product is employ ed in a more advanced design process. additional information required: demand/forecast m/p starting time (yy/mm/dd) monthly run-rate (units) comment
data sheet a18501ej3v0ds 9 pd65881gb-p03 1 2 3 4 voltage application waveform at input pin waveform distortion due to input noise or a reflected wave may cause malfunction. if the input of the cmos device stays in the area between v il (max) and v ih (min) due to noise, etc., the device may malfunction. take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between v il (max) and v ih (min). handling of unused input pins unconnected cmos device inputs can be cause of malfunction. if an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd via a resistor if there is a possibility that it will be an output pin. all handling related to unused pins must be judged separately for each device and according to related specifications governing the device. precaution against esd a strong electric field, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade the device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. environmental control must be adequate. when it is dry, a humidifier should be used. it is recommended to avoid using insulators that easily build up static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work benches and floors should be grounded. the operator should be grounded using a wrist strap. semiconductor devices must not be touched with bare hands. similar precautions need to be taken for pw boards with mounted semiconductor devices. status before initialization power-on does not necessarily define the initial status of a mos device. immediately after the power source is turned on, devices with reset functions have not yet been initialized. hence, power-on does not guarantee output pin levels, i/o settings or contents of registers. a device is not initialized until the reset signal is received. a reset operation must be executed immediately after power-on for devices with reset functions. power on/off sequence in the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. when switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. the correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. input of signal during power off state do not input signals or an i/o pull-up power supply while the device is not powered. the current injection that results from input of such a signal or i/o pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. notes for cmos devices 5 6
pd65881gb-p03 the information in this document is current as of march, 2008. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e 02. 11-1 (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific":
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