micropac industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. micropac industries, inc. microcircuits division 905 e. walnut st., garland, tx 75040 (972) 272 - 3571 fax (972) 494 - 2281 www.micropac.com e - mail: microsales@micropac.com 6/9/03 pg. 1 of 6 53252 90v - 0.8a dual power mosfet optocouplers dscc dwg #5962 - 03247 mii features: 8 - pin dual - in - line hermetic package performance over ? 55c to +125c compact isolation solid state switches continuous output cur rent: 0.8 a (1) optically coupled between input and output isolation tested to 1000 vdc high level of transient immunity 3 a output surge current shock and vibration resistant mil - prf - 38534 screening optional applications: military/high reliability sys tems standard 28 vdc and 48 vdc load driver aircraft controls electromechanical and solid state relay replacement i/o modules switching heaters description the 53252 is two power mosfet optocouplers in a single 8 - pin dual - in - line package suitable for applications where two independent switches are required. the popular hermetic eight - pin dual - in - line ceramic package combined with 1000 vdc isolation between input and output and between two isolated relays, makes this device ideal for solid - state relay a pplications. performance is specified over the full military temperature range. this device is available in a variety of quality levels from cots to class h including any custom screening requirements. gold plated leads are standard, but other lead finishe s per mil - prf - 38534 are also available. functionally, the device operates as two spst, normally open (2 form ?a?) solid - state relays. each relay is actuated by an input current, which can be driven from a standard ttl device. the input current biases a li ght emitting diode that is optically coupled to an integrated photovoltaic diode array. the photovoltaic diode array energizes control circuitry that operates the output mosfet.
53252 90vdc ? 0.8a dual power mosfet optocouplers dscc dwg# 5962 - 03247 micropac in dustries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. micropac industries, inc. microcircuits division 905 e. walnut st., garland, tx 75040 (972) 272 - 3571 fax (972) 494 - 2281 www.micropac.com e - mail: microsales@micropac.com 6/9/03 pg. 2 of 6 absolute maximum ratings: (per relay unless otherwise noted) storage temperature range ..??????????????????????........??............ - 65c to +150c operating ambient temperature - t a ...................???????????????????..?.. - 55c to +125c junction temperature - t j ..............................????????? ???????????.......?........?. +150c lead solder temperature for 10 seconds .......................???????????????....??.............. +260c (1.6 mm below seating plane) average input current - i f ....................?...??????????????????..??......................... 20 ma peak repetitive input current - i fpk .............??????????????...???????................... .. 40 ma (pulse width < 100 ms; duty cycle < 50%) peak surge input current - i fpk surge .............?????????????????????.................. 100 ma (pulse width < 0.2 ms; duty cycle < 0.1%) contin uous output current per relay - i o ...?????????????..????.................................... 0.8 a (1) single shot output current per relay - i opk surge (pulse width < 10 ms) ????..?????..?...????...... 3 a output voltage - v o ..................... .......?...???????????????..??????.??.............. 90 vdc recommended operating conditions: parameter symbol min. max. units input current (on) i f (on) 10 20 ma input voltage (off) v f (off) 0 0.6 vdc operating temperature t a - 55 +125 c
53252 90vdc ? 0.8a dual power mosfet optocouplers dscc dwg# 5962 - 03247 micropac in dustries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. micropac industries, inc. microcircuits division 905 e. walnut st., garland, tx 75040 (972) 272 - 3571 fax (972) 494 - 2281 www.micropac.com e - mail: microsales@micropac.com 6/9/03 pg. 3 of 6 ele ctrical specifications limits test symbol conditions - 55c t a +125c unless otherwise specified. group a subgroups device type min max unit output withstand voltage v o(off) v foff = 0.6 v, i o = 10 m a 1, 2, 3 all 90 v output on - resistance 2/ r (on) i fon = 10 ma, i o = 800 ma, pulse duration 30 ms, duty cycles < 10% 1, 2, 3 all 1.2 w output leakage current i o (off) v foff = 0.6 v, v o = 90 v 1, 2, 3 all 10 m a input forward voltage v foff i fon = 10 ma 1, 2, 3 all 1.0 1.7 v input reverse br eakdown voltage v r i r = 10 m a 1, 2, 3 all 5.0 v input - output isolation current 3/ i i - o v i - o = 1000 v dc, t = 5 s, rh 45%, t a = +25c 1, 2, 3 all 1.0 m a channel - channel isolation current 3/ i iso v iso = 1000 v dc, t = 5 s, rh 45%, t a = +25c 1, 2, 3 all 1.0 m a turn - on time 2/ t on i fon = 10 ma, i o = 800 ma, pulse duration 30 ms, duty cycles < 10% 1, 2, 3 all 6.0 ms turn - off time 2/ t off i fon = 10 ma, i o = 800 ma, pulse duration 30 ms, duty cycles < 10% 1, 2, 3 all 2.0 ms notes: 1. ma ximum average current rating where the case temperature (t c ) is maintained below 120c. 2. during the pulsed r on measurement (i o duration < 30 ms), ambient (t a ) and case temperature (t c ) are equal. 3. this is a momentary withstand test, not a continuous opera ting condition. 4. typical junction to case thermal resistance ( q jc ) for the device is 15c/w, where case temperature (t c ) is measured at the center of the package bottom. caution: care should be taken not to exceed the maximum output power dissipation, ma ximum case temperature, and maximum junction temperature when repetitively switching loads.
53252 90vdc ? 0.8a dual power mosfet optocouplers dscc dwg# 5962 - 03247 micropac in dustries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. micropac industries, inc. microcircuits division 905 e. walnut st., garland, tx 75040 (972) 272 - 3571 fax (972) 494 - 2281 www.micropac.com e - mail: microsales@micropac.com 6/9/03 pg. 4 of 6 case outlines x, y terminal number terminal symbol 1 2 3 4 5 6 7 8 + in 1 - in 1 - out 2 + out 2 + in 2 - in 2 - out 1 + out 1 4 3 2 1 5 6 7 8 figure 2. terminal c onnections. input output off off on on figure 3. truth table(s).
53252 90vdc ? 0.8a dual power mosfet optocouplers dscc dwg# 5962 - 03247 micropac in dustries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. micropac industries, inc. microcircuits division 905 e. walnut st., garland, tx 75040 (972) 272 - 3571 fax (972) 494 - 2281 www.micropac.com e - mail: microsales@micropac.com 6/9/03 pg. 5 of 6 case outline x s d e b a a1 l e e1 5 0 seating plane c base plane millimeters inches symbol min max min max a 6.99 .275 a1 1.40 1.65 .055 .065 b 0.41 0.53 .016 .021 c 0.18 0.33 .007 .013 d 9.40 9.91 .370 .390 e 2.2 9 2.79 .090 .110 e 9.65 9.91 .380 .390 e1 8.13 .320 l 1.07 1.32 .042 .052 s 0.89 1.27 .035 .050 case outline y s e d a b ea e q base plane setting plane a1 c l millimeters inches symbol min max min max a 6.60 .260 a1 0.76 1.27 .030 .050 b 0.41 0.53 .016 .021 c 0.18 0.33 .007 .013 d 9.40 9.91 .370 .390 e 2.29 2.79 .090 .110 e 8.13 .320 ea 7.37 7.87 .290 .310 l 12.70 .500 q 0.51 .020 s 0.89 1.27 .035 .050 notes: 1. the u.s. government preferred system of measurement is the metric si. this item was designed using inch - pound units of measurement. in case of problems involving conflicts between the metric and in - pound units, the inch - pound units shall rule. 2. pin 1 is indicated by the esd triangle(s) marked on top of the package.
53252 90vdc ? 0.8a dual power mosfet optocouplers dscc dwg# 5962 - 03247 micropac in dustries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. micropac industries, inc. microcircuits division 905 e. walnut st., garland, tx 75040 (972) 272 - 3571 fax (972) 494 - 2281 www.micropac.com e - mail: microsales@micropac.com 6/9/03 pg. 6 of 6 the following chart explains the ordering pr ocedure for micropac part numbers. please contact micropac for other desired options. mii dash no. case outline lead finish screening level per mil - prf - 38534 53252 - 101 y solder dip no screening 53252 - 102 y gold plate no screening 53252 - 103 y solder di p screening per table c1x h level 53252 - 104 y gold plate screening per table c1x h level 53252 - 105 y solder dip screening per table c1x k level 53252 - 106 y gold plate screening per table c1x k level 53252 - 107 y solder dip compliant to h level 53252 - 10 8 y gold plate compliant to h level 53252 - 111 x solder dip screening per table c1x h level 53252 - 112 x gold plate screening per table c1x h level 53252 - 113 x solder dip screening per table c1x k level 53252 - 114 x gold plate screening per table c1x k le vel 53252 - 115 x solder dip no screening 53252 - 116 x gold plate no screening 53252 - 117 x solder dip compliant to h level 53252 - 118 x gold plate compliant to h level
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