spl mnxx no optics spl myxx fast-axis collimation passively cooled diode laser bar sp-pack. (left), dl-pack. (right) preliminary data 2000-01-01 1 opto semiconductors features ? uncollimated (mn-series) or fast-axis collimated radiation (my-series) ? 1 cm-laser bar mounted on passive heat sink, no water required ? highly reliable strained layer inga(al)as/gaas material ? standard wavelength selection is 3 nm, others on request ? low smile (< 1 m m) and low mechanical tolerances applications ? pumping of solid state lasers (nd: yag, yb: yag, ) ? direct industrial applications (soldering, surface treatment, marking, ) ? heating, illumination ? medical and printing applications safety advices depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. products which incorporate these devices have to follow the safety precautions given in iec 60825-1 safety of laser products.
2000-01-01 2 opto semiconductors spl mnxx, spl myxx type designation system spl m y xx - g y) collimation beam divergence / 1/e 2 n C no optics 30 5 y C fast axis collimation < 0.5 (15 mrad) 5 x) wavelength 81 C 808 nm 83 C 830 nm 94 C 940 nm 98 C 975 nm g) package/power package features d C dl-type/30 w cw compact size 12 22 8 mm g C sp-type/40 w cw reduced thermal resistance 25 25 12 mm recommended types wavelength 1) 1) other wavelengths in the range of 780 nm 980 nm are available on request. max. output power ordering code spl mn81-d 808 nm 30 w, cw q62702-p3555 spl mn81-g 808 nm 40 w, cw q62702-p5312 both packages are available on request with any other unmounted bar from data sheet spl byxx. maximum ratings ( t a = 20 c mount temperature) parameter symbol values unit min. max. operating temperature 1) 1) condensation must be avoided. t op C 10 + 60 c storage temperature 1) t stg C 40 + 85 c
spl mnxx, spl myxx 2000-01-01 3 opto semiconductors characteristics ( t a = 20 c mount temperature) parameter symbol values unit min. typ. max. output power 1) dl-pack. sp-pack. 1) depending on wavelength. p op C C 25 35 30 40 w wavelength l C C C 808 940 975 C C C nm spectral width (fwhm) dl C3Cnm threshold current 1) dl-pack. sp-pack. i th 8 15 10 17 12 20 a differential efficiency uncollimated 1) h d 0.8 0.9 1 w/a fast-axis collimation efficiency my-series into beam divergence h col C 93 C % operating current dl-pack. sp-pack. i op C C 38 45 40 50 a operating voltage v op C 1.8 Cv conversion efficiency 1) h c 35 43 C % beam divergence 1/e 2 2) mn-series my-series 2) far field divergence refers to half angle at 1/e 2 relative intensity. q ^ q || 30 5 0.5 5 deg. thermal resistance dl-pack. sp-pack. r th 1 0.8 k/w temperature coefficient of wavelength dl / d t 0.27 nm/k mount dimensions dl-pack. sp-pack. w d h 12 22 8 25 25 12 mm
spl mnxx, spl myxx 2000-01-01 4 opto semiconductors optical characteristics ( t a = 20 c mount temperature) optical output power p opt vs. forward current i f cw-device, mount: sp optical output power p opt vs. forward current i f qcw-device, mount: dl i ohw00950 0 0 0 0.5 1 1.5 2 v opt p v 10 20 30 40 50 60 10 20 30 40 50 w a v p i ohw00951 0 0 0 v opt p v 20 40 60 80 120 20 40 60 80 100 w a 0.5 1 1.5 2 2.5 v p
spl mnxx, spl myxx 2000-01-01 5 opto semiconductors package outlines (dl-type package) dimensions in mm, unless otherwise specified (10 mm = 0.39 inch / 1 inch = 25.4 mm). gwo06039 8 5 12 6 22 30 din 74 - k m 2.5 amp - contact output laser base of package is anode (+)
2000-01-01 6 opto semiconductors spl mnxx, spl myxx package outlines (sp-type package) dimensions in mm, unless otherwise specified (10 mm = 0.39 inch / 1 inch = 25.4 mm). for safety, unpacking, handling, mounting and operating issues, please carefully read our notes for operation ii . gwo06040 12 7.7 laser output 6.4 14.2 20.3 24.9 3.2 12.45 21.7 24.9 4-40 unc-2b shorting contact ?2.4 base of package is anode (+) 4 x ?4.4
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