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ICX254AL diagonal 6mm (type 1/3) ccd image sensor for eia b/w video cameras description the ICX254AL is an interline ccd solid-state image sensor suitable for eia b/w video cameras with a diagonal 6mm (type 1/3) system. compared with the current product icx054bl, basic characteristics such as sensitivity, smear, dynamic range and s/n are improved drastically from visible light region to near infrared light region through the adoption of exview had ccd tm technology. this chip features a field period readout system and an electronic shutter with variable charge-storage time. features sensitivity in near infrared light region (+8db compared with the icx054bl, = 945nm) high sensitivity (+6db compared with the icx054bl, no ir cut filter) low smear (?0db compared with the icx054bl) high d range (+2db compared with the icx054bl) high s/n low dark current excellent antiblooming characteristics continuous variable-speed shutter no voltage adjustment (reset gate and substrate bias are not adjusted.) reset gate: 5v drive horizontal register: 5v drive device structure interline ccd image sensor image size: diagonal 6mm (type 1/3) number of effective pixels: 510 (h) 492 (v) approx. 250k pixels total number of pixels: 537 (h) 505 (v) approx. 270k pixels chip size: 6.00mm (h) 4.96mm (v) unit cell size: 9.6m (h) 7.5m (v) optical black: horizontal (h) direction : front 2 pixels, rear 25 pixels vertical (v) direction : front 12 pixels, rear 1 pixel number of dummy bits: horizontal 16 vertical 1 (even fields only) substrate material: silicon ?1 e99520b3z sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. pin 1 v 2 25 1 12 pin 9 h optical black position (top view) ? exview had ccd is a trademark of sony corporation. exview had ccd is a ccd that drastically improves light efficiency by including near infrared light region as a basic structure of had (hole-accumulation-diode) sensor. tm 16 pin dip (plastic)
?2 ICX254AL use restriction notice (december 1, 2003 ver.) this use restriction notice ("notice") is for customers who are considering or currently using the ccd products ("products") set forth in this specifications book. sony corporation ("sony") may, at any time, modify this notice which will be available to you in the latest specifications book for the products. you should abide by the latest version of this notice. if a sony subsidiary or distributor has its own use restriction notice on the products, such a use restriction notice will additionally apply between you and the subsidiary or distributor. you should consult a sales representative of the subsidiary or distributor of sony on such a use restriction notice when you consider using the products. use restrictions the products are intended for incorporation into such general electronic equipment as office products, communication products, measurement products, and home electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by sony from time to time. you should not use the products for critical applications which may pose a life- or injury- threatening risk or are highly likely to cause significant property damage in the event of failure of the products. you should consult your sony sales representative beforehand when you consider using the products for such critical applications. in addition, you should not use the products in weapon or military equipment. sony disclaims and does not assume any liability and damages arising out of misuse, improper use, modification, use of the products for the above-mentioned critical applications, weapon and military equipment, or any deviation from the requirements set forth in this specifications book. design for safety sony is making continuous efforts to further improve the quality and reliability of the products; however, failure of a certain percentage of the products is inevitable. therefore, you should take sufficient care to ensure the safe design of your products such as component redundancy, anti-conflagration features, and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or other social damage as a result of such failure. export control if the products are controlled items under the export control laws or regulations of various countries, approval may be required for the export of the products under the said laws or regulations. you should be responsible for compliance with the said laws or regulations. no license implied the technical information shown in this specifications book is for your reference purposes only. the availability of this specifications book shall not be construed as giving any indication that sony and its licensors will license any intellectual property rights in such information by any implication or otherwise. sony will not assume responsibility for any problems in connection with your use of such information or for any infringement of third-party rights due to the same. it is therefore your sole legal and financial responsibility to resolve any such problems and infringement. governing law this notice shall be governed by and construed in accordance with the laws of japan, without reference to principles of conflict of laws or choice of laws. all controversies and disputes arising out of or relating to this notice shall be submitted to the exclusive jurisdiction of the tokyo district court in japan as the court of first instance. other applicable terms and conditions the terms and conditions in the sony additional specifications, which will be made available to you when you order the products, shall also be applicable to your use of the products as well as to this specifications book. you should review those terms and conditions when you consider purchasing and/or using the products.
?3 ICX254AL block diagram and pin configuration (top view) 6 7 nc v 1 v 2 v 3 v 4 v dd gnd sub v l rg h 2 2 3 4 gnd 8 1 v out nc 10 11 12 14 9 16 13 15 nc 5 h 1 note) horizontal register vertical register note) : photo sensor pin no. 1 2 3 4 5 6 7 8 v 4 v 3 v 2 v 1 gnd nc nc v out vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock gnd signal output 9 10 11 12 13 14 15 16 v dd gnd sub v l rg nc h 1 h 2 supply voltage gnd substrate clock protective transistor bias reset gate clock horizontal register transfer clock horizontal register transfer clock symbol description pin no. description pin description symbol absolute maximum ratings ? 1 +24v (max.) when clock width < 10s, clock duty factor < 0.1%. against sub against gnd against v l between input clock pins storage temperature operating temperature ?0 to +8 ?0 to +15 ?0 to +0.3 ?0 to +0.3 ?.3 to +20 ?0 to +18 ?0 to +6 ?.3 to +28 ?.3 to +15 to +15 ? to +6 ?4 to +14 ?0 to +80 ?0 to +60 v v v v v v v v v v v v ? ? v dd , v out , rg ? sub v 1 , v 3 ? sub v 2 , v 4 , v l ? sub h 1 , h 2 , gnd ? sub v dd , v out , rg ?gnd v 1 , v 2 , v 3 , v 4 ?gnd h 1 , h 2 ?gnd v 1 , v 3 ?v l v 2 , v 4 , h 1 , h 2 , gnd ?v l voltage difference between vertical clock input pins h 1 ?h 2 h 1 , h 2 ?v 4 item ratings unit remarks ? 1
?4 ICX254AL bias conditions clock voltage conditions item readout clock voltage v vt v vh1 , v vh2 v vh3 , v vh4 v vl1 , v vl2 , v vl3 , v vl4 v v v vh3 ?v vh v vh4 ?v vh v vhh v vhl v vlh v vll v h v hl v rg v rglh ?v rgll v rgl ?v rglm v sub 14.55 ?.05 ?.2 ?.0 6.3 ?.25 ?.25 4.75 ?.05 4.5 21.0 15.0 0 0 ?.0 7.0 5.0 0 5.0 22.0 15.45 0.05 0.05 ?.5 8.05 0.1 0.1 0.3 0.3 0.3 0.3 5.25 0.05 5.5 0.4 0.5 23.5 v v v v v v v v v v v v v v v v v 1 2 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v v = v vh n ?v vl n (n = 1 to 4) high-level coupling high-level coupling low-level coupling low-level coupling input through 0.1f capacitance low-level coupling low-level coupling horizontal transfer clock voltage reset gate clock voltage substrate clock voltage vertical transfer clock voltage symbol min. typ. max. unit waveform diagram remarks dc characteristics item supply current i dd 36ma symbol min. typ. max. unit remarks item supply voltage protective transistor bias substrate clock reset gate clock v dd v l sub rg 14.55 15.0 ? 1 ? 2 ? 2 15.45 v symbol min. typ. max. unit remarks ? 1 v l setting is the v vl voltage of the vertical transfer clock waveform, or the same power supply as the v l power supply for the v driver should be used. ? 2 do not apply a dc bias to the substrate clock and reset gate clock pins, because a dc bias is generated within the ccd.
?5 ICX254AL r h r h h 2 h 1 c h1 c h2 c hh v 1 c v12 v 2 v 4 v 3 c v34 c v23 c v41 c v13 c v24 c v1 c v2 c v4 c v3 r gnd r 4 r 1 r 3 r 2 vertical transfer clock equivalent circuit horizontal transfer clock equivalent circuit r rg rg c rg reset gate clock equivalent circuit item capacitance between vertical transfer clock and gnd c v1 , c v3 c v2 , c v4 c v12 , c v34 c v23 , c v41 c v13 c v24 c h1 , c h2 c hh c rg c sub r 1 , r 3 r 2 , r 4 r gnd r h r rg 1500 1000 560 330 150 270 47 22 5 320 75 100 100 10 50 pf pf pf pf pf pf pf pf pf pf ? ? ? ? ? capacitance between vertical transfer clocks capacitance between horizontal transfer clock and gnd capacitance between horizontal transfer clocks capacitance between reset gate clock and gnd capacitance between substrate clock and gnd vertical transfer clock series resistor vertical transfer clock ground resistor horizontal transfer clock series resistor reset gate clock series resistor symbol min. typ. max. unit remarks clock equivalent circuit constant
?6 ICX254AL drive clock waveform conditions (1) readout clock waveform (2) vertical transfer clock waveform ii ii 100% 90% 10% 0% v vt tr twh tf m 0v m 2 v 1 v 3 v 2 v 4 v vhh v vh v vhl v vhh v vhl v vh1 v vl1 v vlh v vll v vl v vhh v vh3 v vhl v vh v vhh v vhl v vl3 v vl v vll v vlh v vhh v vhh v vh v vhl v vhl v vh2 v vlh v vl2 v vll v vl v vhh v vhh v vhl v vh4 v vhl v vh v vl v vlh v vll v vl4 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v v = v vh n ?v vl n (n = 1 to 4)
?7 ICX254AL tr twh tf 90% 10% twl v h v hl (3) horizontal transfer clock waveform point a twl v rg v rgh v rgl v rglh rg waveform v rgll h 1 waveform twh tr tf 10% v rglm (4) reset gate clock waveform v rglh is the maximum value and v rgll is the minimum value of the coupling waveform during the period from point a in the above diagram until the rising edge of rg. in addition, v rgl is the average value of v rglh and v rgll . v rgl = (v rglh + v rgll )/2 assuming v rgh is the minimum value during the interval twh, then: v rg = v rgh ?v rgl negative overshoot level during the falling edge of rg is v rglm . (5) substrate clock waveform 90% 100% 10% 0% v sub tr twh tf m m 2 v sub (a bias generated within the ccd)
?8 ICX254AL clock switching characteristics item readout clock vertical transfer clock reset gate clock substrate clock v t v 1 , v 2 , v 3 , v 4 h h 1 h 2 rg sub 2.3 37 11 1.5 2.5 41 5.6 15 2.0 38 75 42 5.6 79 0.5 12 0.012 0.012 6.5 15 0.5 15 0.5 10 0.012 0.012 4.5 250 15 0.5 ? ns ns ? ns ? during readout ? 1 ? 2 when draining charge symbol twh min. typ. max. min. typ. max. min. typ. max. min. typ. max. twl tr tf unit remarks ? 1 when vertical transfer clock driver cxd1267an is used. ? 2 tf tr ?2ns. horizontal transfer clock during imaging during parallel-serial conversion
?9 ICX254AL ?9 10 9 492 (v) 8 10 510 (h) v 10 h 8 h 8 v 10 effective pixel region ignored region zone 0, i zone ii, ii ' zone definition of video signal shading image sensor characteristics (ta = 25?) item sensitivity 1 sensitivity 2 saturation signal smear video signal shading dark signal dark signal shading flicker lag s1 s2 vsat sm sh vdt ? vdt f lag 1300 3000 1000 1600 4000 ?20 ?03 20 25 2 1 2 0.5 mv mv mv db % % mv mv % % 1 2 3 4 5 5 6 7 8 9 ta = 60? zone 0 and i zone 0 to ii ' ta = 60? ta = 60? symbol min. typ. max. unit measurement method remarks
?10 ICX254AL image sensor characteristics measurement method measurement conditions 1) in the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) in the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black (ob) level is used as the reference for the signal output, and the value measured at point [ ? a] in the drive circuit example is used. definition of standard imaging conditions 1) standard imaging condition i : use a pattern box (luminance: 706cd/m 2 , color temperature of 3200k halogen source) as a subject. (pattern for evaluation is not applicable.) use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter and image at f8. the luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) standard imaging condition ii : indicate the state which removes an ir cut filter of standard imaging condition i . 3) standard imaging condition iii : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. sensitivity 1 set to standard imaging condition i . after selecting the electronic shutter mode with a shutter speed of 1/250s, measure the signal output (vs 1) at the center of the screen and substitute the value into the following formula. 2. sensitivity 2 set to standard imaging condition ii . after selecting the electronic shutter mode with a shutter speed of 1/1000s, measure the signal output (vs 2 ) at the center of the screen and substitute the value into the following formula. 3. saturation signal set to standard imaging condition iii . after adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 200mv, measure the minimum value of the signal output. 4. smear set to standard imaging condition iii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity to 500 times the intensity with average value of the signal output, 200mv. when the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective h blankings, measure the maximum value ysm [mv] of the signal output and substitute the value into the following formula. s1 = vs 1 [mv] 60 250 s2 = vs 2 [mv] 60 1000 sm = 20 log [db] (1/10v method conversion value) 500 1 200 vsm 10 1 ?10
?11 ICX254AL ylag (lag) y signal output 200mv light fld v1 strobe light timing output 5. video signal shading set to standard imaging condition iii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity so that the average value of the signal output is 200mv. then measure the maximum (vmax [mv]) and minimum (vmin [mv]) values of the signal output and substitute the values into the following formula. sh = (vmax ?vmin)/200 100 [%] 6. dark signal measure the average value of the signal output (vdt [mv]) with the device ambient temperature 60? and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 7. dark signal shading after measuring 6, measure the maximum (vdmax [mv]) and minimum (vdmin [mv]) values of the dark signal output and substitute the values into the following formula. ? vdt = vdmax ?vdmin [mv] 8. flicker set to standard imaging condition iii . adjust the luminous intensity so that the average value of the signal output is 200mv, and then measure the difference in the signal level between fields ( ? vf [mv]). then substitute the value into the following formula. f = ( ? vf/200) 100 [%] 9. lag adjust the signal output value generated by strobe light to 200mv. after setting the strobe light so that it strobes with the following timing, measure the residual signal (vlag). substitute the value into the following formula. lag = (vlag/200) 100 [%]
?12 ICX254AL cxd1267an 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 22/16v 0.1 ?.0v 3.3/16v 1/35v 0.1 1m icx254 (bottom view) 14 13 12 11 10 9 12 345 67 h 1 h 2 rg v l sub gnd v dd v 4 v 3 v 2 v 1 gnd nc v out 22/20v ccd out 15v xsub xv2 xv1 xsg1 xv3 xsg2 xv4 h 1 h 2 rg 1500p 100k 3.3/20v 0.01 100 3.9k 2sk523 [ ? a] 8 15 16 nc nc drive circuit
?13 ICX254AL 0 0.2 0.4 0.6 0.8 1.0 400 500 600 700 800 900 1000 wave length [nm] relative response 0.1 0.3 0.5 0.7 0.9 unit : s odd field even field v1 v2 v3 v4 v1 v2 v3 v4 2.5 1.5 2.5 2.0 1.2 0.3 31.3 spectral sensitivity characteristics (excludes both lens characteristics and light source characteristics) sensor readout clock timing chart
?14 ICX254AL hd 520 525 1 2 3 4 5 10 15 20 260 265 270 275 280 blk vd fld v1 v2 v3 v4 492 491 24 6 2 4 6 1 3 5 1 5 3 491 492 1 5 3 1 5 3 24 6 24 6 ccd out drive timing chart (vertical sync)
?15 ICX254AL blk hd h1 h2 rg v1 v2 v3 v4 sub 500 505 510 1 2 5 10 15 20 25 3 1 2 3 5 10 15 16 1 2 1 2 3 5 10 drive timing chart (horizontal sync)
?16 ICX254AL notes on handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non-chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensor. e) for the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) soldering a) make sure the package temperature does not exceed 80?. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a ground 30w soldering iron and solder each pin in less than 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an image sensor, do not use a solder suction equipment. when using an electric desoldering tool, use a thermal controller of the zero cross on/off type and connect it to ground. 3) dust and dirt protection image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. clean glass plates with the following operation as required, and use them. a) perform all assembly operations in a clean room (class 1000 or less). b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if the grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) when a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. do not reuse the tape. 4) installing (attaching) a) remain within the following limits when applying a static load to the package. do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (this may cause cracks in the package.) compressive strength 50n cover glass plastic package 50n 1.2nm torsional strength
?17 ICX254AL b) if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. c) the adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) the notch of the package is used for directional index, and that can not be used for reference of fixing. in addition, the cover glass and seal resin may overlap with the notch of the package. e) if the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) acrylate anaerobic adhesives are generally used to attach ccd image sensors. in addition, cyano- acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) others a) do not expose to strong light (sun rays) for long periods. for continuous using under cruel condition exceeding the normal using condition, consult our company. b) exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. c) the brown stain may be seen on the bottom or side of the package. but this does not affect the ccd characteristics. d) this ccd image sensor has sensitivity in the near infrared area. its focus may not match in the same condition under visible light /near infrared light because of aberration. incident light component of long wavelength which transmits the silicon substrate may have bad influence upon image. e) this package has 2 kinds of internal structure. however, their package outline, optical size, and strength are the same. structure a structure b chip metal plate (lead frame) package cross section of lead frame the cross section of lead frame can be seen on the side of the package for structure a.
?18 ICX254AL package outline unit: mm 0.3 1. ? is the center of the effective image area. 2. the two points ? of the package are the horizontal reference. the point ?' of the package is the vertical reference. 3. the bottom ? of the package, and the top of the cover glass ? are the height reference. 4. the center of the effective image area relative to ? and ?' is (h, v) = (6.1, 5.7) 0.15mm. 5. the rotation angle of the effective image area relative to h and v is 1?. 6. the height from the bottom ? to the effective image area is 1.41 0.10mm. the height from the top of the cover glass ? to the effective image area is 1.94 0.15mm. 7. the tilt of the effective image area relative to the bottom ? is less than 50 m. the tilt of the effective image area relative to the top ? of the cover glass is less than 50 m. 8. the thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. the notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. m package structure package material lead treatment lead material package mass drawing number plastic gold plating 42 alloy 0.90g as-c2.2-03(e) 18 9 16 a b c 81 16 9 d 10.3 5.7 6.1 9.5 2.5 0.5 8.4 2.5 1.2 2.5 9.2 2.5 1.2 3.1 1.27 0.3 0.46 0.69 1.27 0.25 11.43 11.6 ~ ~ 12.2 0.1 11.4 0.1 0? to 9? 2-r0.5 b' ~ 3.35 0.15 3.5 0.3 16 pin dip (450mil) h v (first pin only) sony corporation

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