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| afbr-5903z/5903ez/5903az fddi, fast ethernet transceivers in 2 x 5 package style data sheet features ?f multisourced f2fxf5f packagef stylefwithf mt-rjffffffffffffff receptacle ?f single f+3.3f vf powerfsupply ?f wave fsolderfandfaqueousf washf processf compatible ?f full f compliancefwithfthefopticalf performancefffffffffff requirements fofftheffddif pmdf standard ?f full f compliancefwithftheffddif lcf-pmdf standard ?f full f compliancefwithfthefopticalf performance ffffffffffffffff requirements foffthef atmf100fmb/sf physicalf layerf ?f full f compliancefwithfthefopticalf performanceffffffffffff requirements foff100f base -fxf versionfoffieeef 802.3u ?f rohs f compliance ?f receiver foutputfsquelchf functionfenabled applications ?f multimode ffberf backboneflinks ?f multimode ffberf wiringfclosetf tof desktopflinks ordering information the fafbr-5903zf1300fnmf productfisf availablef forf pro - duction f ordersf throughfthef avagof technologies f com - ponent f field f sales f ofces f and f aut h orized f distributorsf world f wide. afbr-5903zf =f 0c f tof+70c f f f no fshield f afbr-5903ezf =f 0c f tof+70c f f f extended fshield f AFBR-5903AZf =f -40c f tof+85c f f f no f shield. description the f afbr-5903zf familyf off tran s ceiversf from f avago f tech - nologies f provide f the f system f designer f with f products f to f implement f af range f off fddif andf atm f (asynchronous f transfer f mode)f designsf atfthef100fmb/s-125f mbdf rate. the f transceivers f are f allf suppliedf inf thef newf industry f standard f 2f xf 5f dipf style f withf af mt-rj f fberf connector f interface. fddi pmd, atm and fast ethernet 2 km backbone links the f afbr-5903zf isf af 1300f nmf product f withf opticalf per - formance f compliant f withf thef fddif pmd f standard. f the f fddif pmd f standard f isf iso/iecf 9314-3:f 1990f andf ansif x3.166f-f1990. these f transceivers f for f 2f km f multimodef fberf backbones f are f suppliedf inf thef smallf 2f xf 5f mt-rj f package f style f for f those f designers f who f want f to f avoid f the f larger f mic/r f (media f interface f connector/receptacle) f defnedf inf thef fddif pmdf standard. avago f technologies f also f provides f several f other f fddi f products f compliant f with f the f pmd f and f sm-pmd f standards. f these f products f are f available f withf mic/r,f st ? ,f scf andf fcf connector f styles. f they f are f available f inf thef 1f xf 9,f 1f xf 13f andf 2f xf 11f transceiver f andf 16f pinf transmitter/receiver f pack - agef styles f for f thosef designs f that f require f thesef alternate f confgurations. the f afbr-5903zf isf alsof usefulf for f bothf atm f 100f mb/sf interfaces f andf fast f ethernet f 100f base-fx f interfaces. f the f atm f forum f user-network f interface f (uni) f standard, f version f 3.0,f defnesf thef physical f layer f for f 100f mb/sf multimode f fiber f interface f for f atm f inf section f 2.3f to f bef thef fddif pmd f standard. f likewise, f thef fast f ethernet f alliance f defnesf thef physical f layer f for f 100f base-fx f for f fast f ethernet f to f bef thef fddif pmdf standard. atm f applications f for f physical f layers f other f than f 100 f mb/s f multimode f fiber f interface f are f supported f by f avago f technologies. f products f are f available f for f both f thef single-mode f andf thef multimodef fberf sonet f oc-3cf (sts -3c),f sdhf (stm-1) f atm f interfaces f andf thef 155f mb/s- 194 f mbd f mult i mode f fber f atm f interface f as f specifed f infthef atmf forumfuni. contact f yourf avagof technologies fsalesf representa - tive f forf infor ma tionfonfthesef alternativeffddifandf atmf products.
2 transmitter sections the f transmitter f section f of f the f afbr-5903zf utilizes f af 1300f nmf surface f emittingf ingaasp f led. f this f ledf isf packaged f inf thef opticalf subassemblyf portion f off thef transmitter f section. f it f isf driven f by f af custom f silicon f icf whichf converts f diferential f peclf logic f signals, f eclf referenced f (shifted) f to f af+3.3f vf supply,f intofanfanalogfledf drivef current. receiver sections the f receiver f section f of f the f afbr-5903zf utilizes f anf ingaas f pinf phot odiodef coupled f to f af custom f silicon f transimped - ance f preampl iferf ic. f f it f isf packaged f inf thef opticalf sub - assemblyf portionfoffthef receiver. this f pin/preamplifer f co mbi nationf isf coupled f to f af custom f quantizer f icf whichf provides f thef fnalf pulsef shapingf for f thef logic f outputf andf thef signal f detect f function. f the f data f outputf isf dif erential. f the f signal f detect f outputf isf single- ended. f both f data f andf signal f detect f outputsf are f peclf compa t ible,f eclf referenced f (shifted) f to f af +3.3f vf power f supply. f the f receiver f outputs, f data f out f andf data f out f bar, f are f squelchedf at f signal f detect f deassert. f that f is, f whenf thef light f inputf power f decreases f to f af typical f -38f dbmf orf less, f thef signal f detect f deasserts, f i.e. f thef signal f detect f outputf goesf to f af peclf low f state. f this f forces f thef receiver f outputs, f data f out f andf data f out f barf to f gof to f steady f peclf levels f high fandf lowf respectively. package the f overall f package f concept f for f the f avago f technologies f transceiver f consists f of f the f following f basic f elements; f two f optical f subassemblies, f an f electrical f subassembly f and f the f housing f as f illustrated f in f figure f 1. the f package f outline f drawing f and f pin f out f are f shown f in f figures f 2 f and f 3. f the f details f of f this f package f outline f and f pin f out f are f compliant f with f the f mult i source f defnition f of f the f 2 f x f 5 f dip. f the f low f profle f of f the f avago f technologies f transceiver f design f complies f with f the f maximum f height f allowed f for f the f mt-rj f connector f over f the f entire f length f of f the f package. the f optical f subassemblies f utilize f a f high-volume f assembly f process f together f with f low-cost f lens f elements f which f result f in f a f cost-efective f building f block. the f electrical f subassembly f co n sists f of f a f high f volume f mul - tilayer f printed f circuit f board f on f which f the f ic f and f various f surface-mounted f passive f circuit f elements f are f attached. the f receiver f section f includes f an f internal f shield f for f the f elec - trical f and f optical f subassemblies f to f ensure f high f immunity f to f external f emi f felds. the f outer f housing f is f electrically f conductive f andf isf at f receiver f signal f ground f potential. f the f mt-rj f port f isf moldedf off flledf nonconductive f plasticf to f provide f mechanicalf strength f andf electrical f isolation. f the f solderf postsf off thef avago f technologies f design f are f isolated f from f thef internal f circuit f offthef transceiver. the f transceiver f isf attached f to f af printed f circuit f board f withf thef ten f signal f pinsf andf thef two f solderf postsf whichf exit f thef bottom f off thef housing. f the f two f solderf postsf provide f thef primary f mechanicalf strength f to f withstandf thef loadsf imposedf onf thef tran s ceiverf by f mating f withf thef mt-rj f connectored ffberf cables. figure 1. block diagram. data out signal detect data in quantizer ic led driver ic pin photodiode pre-amplifier subassembly led optical subassembly data out data in mt-rj receptacle r x supply t x supply r x ground t x ground 3 figure 2. package outline drawing note: yyww manufactured workweek coo country of origin (philippines) front view 13.97 (0.55) min. 4.5 0.2 (0.177 0.008) (pcb to optics center line) 5.15 (0.20) (pcb to overall receptacle center line) dimensions in millimeters (inches) notes: 1. this page describes the maximum package outline, mounting studs, pins and their relationships to each other. 2. toleranced to accommodate round or rectangular leads. 3. all 12 pins and posts are to be treated as a single pattern. 4. the mt-rj has a 750 m fiber spacing. 5. the mt-rj alignment pins are in the module. 6. for sm modules, the ferrule will be pc polished (not angled). 7. see mt-rj transceiver pin out diagram for details. 37.56 (1.479) max. side view 49.56 (1.951) ref. 9.8 (0.386) max. 9.3 (0.366) max. ? 1.07 (0.042) ? 0.61 (0.024) pin 1 top view 9.6 (0.378) max. 13.59 (0.535) max. 12 (0.472) 7.59 (0.299) 8.6 (0.339) ?1.5 (0.059) 17.778 (0.7) 1.778 (0.07) 7.112 (0.28) +0 -0.2 (+000) (-008) 10.16 (0.4) case temperature measurement point min 2.92 (0.115) labelling information 4 figure 3. pin out diagram. pin descriptions: pin 1 receiver signal ground v ee rx: directly f connectfthisfpinf tofthef receiverf groundf plane. pin 2 receiver power supply v cc rx: provide f +3.3f vf dcf viaf thef recommended f receiver f power f supplyf flter f circuit. ff locate f thef power f supplyf flter f circuit f asfclosefasfpossiblef tofthef v cc f rxfpin. pin 3 signal detect sd: normal f opticalf inputf levels f to f thef receiver f result f inf af logic f 1 f output.f low f opticalf inputf levels f to f thef receiver f result f inf af faultf condition f indicatedf byfaf logicf 0 f output. this f signal f detect f outputf canf bef usedf to f drive f af peclf inputf onf anf upstream f circuit, f suchf asf signal f detect f inputf orf lossfoff signal-bar. pin 4 receiver data out bar rd-: nof internal f terminations f are f provided. f see f recommended f circuit f schematic. pin 5 receiver data out rd+: nof internal f terminations f are f provided. f see f recommended f circuit f schematic. pin 6 transmitter power supply v cc tx: provide f +3.3f vf dcf viaf thef recommended f transmitter f power f supplyf flter f circuit. ff locate f thef power f supplyf flter f circuit f asfclosefasfpossiblef tofthef v cc f tx fpin. pin 7 transmitter signal ground v ee tx: directly f connect f this f pin f to f the f transmitter f ground f plane. pin 8 transmitter disable t dis : nof internal f connection. f optionalf feature f for f laserf basedf products f only. f for f laserf basedf products f connect f thisf pinf to f +3.3f vf ttl f logic f highf 1 f to f disablef module. f to f enablef modulef connectf tof ttl f logicf lowf 0. pin 9 transmitter data in td+: nof internal f terminations f are f provided. f see f recommended f circuit f schematic. pin 10 transmitter data in bar td-: nof internal f terminations f are f provided. f see f recommended f circuit f schematic. mounting studs/solder posts the f mounting f studsf are f provided f for f transceiver f mechani - calf attachment f to f thef circuit f board. ff it f isf recommended f that f thef holesf inf thef circuit f board f bef connected f to f chassisf ground. transmitter data in bar transmitter data in transmitter disable (laser based products only) transmitter signal ground transmitter power supply rx tx o o o o o 1 2 3 4 5 o o o o o 10 9 8 7 6 receiver signal ground receiver power supply signal detect receiver data out bar receiver data out top view mounting studs/solder posts 5 figure 4. typical optical power budget at bol versus fiber optic cable length. optical power budget (db) 0 fiber optic cable length (km) 0. 5 1 .5 2. 0 2 .5 12 10 8 6 4 2 1. 0 0. 3 hfbr-5903, 62.5/125 m hfbr-5903 50/125 m application information the f applications f engineering f group ff isf available f to f assistf you f with f the f technical f unde r standing f and f design f trade-ofs f associated f withf thesef tran s ceivers.f you f canf contact f themf through f yourf avagof technologies fsalesf representative. the f following f information f is f provided f to f answer f some f of f the f mostf commonfquestionsfaboutfthefusefoffthesef parts. transceiver optical power budget versus link length opticalf power f budgetf (opb) f isf thef available f opticalf power f for f a f fber f optic f link f to f accommodate f fber f cable f losses f plus f lossesf duef to f in-linef connectors, f splices, f opticalf switches, f andf to f provide f margin f for f linkf aging f andf unplannedf lossesf duef tofcablef plantf reconfgurationforf repair. figure f 4f illustrates f thef pr e dictedf opbf associated f withf thef transceiver f specifedf inf thisf data f sheetf at f thef beginning f off life f (bol).f these f curves f represent f thef attenuation f andf chromatic f plusf modalf dispersionf lossesf associated f withf thef 62.5/125f mf andf 50/125f mf fberf cablesf only. f the f area f underf thef curves f represents f thef remaining f opbf at f any f linkf length,f whichf isf available f for f overcoming f non-fberf cablef related f losses. avago f technologies f ledf techno logyf hasf produced f 1300f nmf ledf devices f withf lower f aging f characteristics f thanf nor - mallyf associated f withf thesef technologies f inf thef industry. f the f industry f conve n tionf isf 1.5f dbf aging f for f 1300f nmf leds. f the f avago f technologies f 1300 f nm f leds f will f experience f less f thanf 1f dbf off aging f over f normal f co mmer cialf equip mentf missionf life f periods. f contact f your f avago f technologies f salesf repr e sentativef forfadditionalf details. figure f 4f was f generated f withf af avago f technologies f fberf opticf linkf modelf containing f thef current f industry f conven - tionsf for f fberf cablef specifcations f andf thef fddif pmd f andf lcf-pmd f opticalf parameters. f these f parameters f are f refected f inf thef guaranteed f performance f off thef trans - ceiver f specifcations f inf thisf data f sheet. f this f samef modelf hasf beenf usedf extensively f inf thef ansif andf ieeef commit - tees, f includingf thef ansif x3t9.5f committee, f to f establishf thef opticalf performance f requir e mentsf for f various f fberf optic f interface f standards. f the f cable f parameters f used f come f from f thef iso/iecf jtc1/sc f 25/wg3f generic f cabling f for f customer f premises f perf disf 11801f docu mentf andf the f eia/tia-568-a f commercial f buildingf teleco m municationsf cabling f standardfperf sp-2840. 6 figure 6. bit error rate vs. relative receiver input optical power. bit error rate -6 4 1 x 10 -2 relative input optical power - db -4 2 -2 0 1 x 10 -4 1 x 10 -6 1 x 10 -8 1 x 10 -10 1 x 10 -11 conditions: 1. 125 mbd 2. prbs 2 7 -1 3. center of symbol sampling 4. t a = +25 ?c 5. v cc = 3.3 v dc 6. input optical rise/fall times = 1.0/ 2.1 ns. 1 x 10 -12 1 x 10 -9 1 x 10 -7 1 x 10 -5 1 x 10 -3 center of symbol hfbr-5903 series figure 5. transceiver relative optical power budget at constant ber vs. signaling rate. conditions: 1. prbs 2 7 -1 2. data sampled at center of dat a symbol . 3. ber = 10 -6 4. t a = +25 ?c 5. v cc = 3.3 v dc 6. input optical rise/fall times = 1.0/ 2.1 ns. -1 -0.5 0 0.5 1 1.5 2 2.5 0 25 50 75 100 125 150 175 200 signal rate (mbd ) transceiver relative power budge t at constant ber (db) transceiver signaling operating rate range and ber performance for f purposes f off defnition,f thef symbolf (baud)f rate, f alsof called f signaling f rate, f is f the f reciprocal f of f the f shortest f symbolf time. f data f rate f (bits/sec)f isf thef symbolf rate f di - videdf by f thef encoding f factor f usedf to f encode f thef data f (symbols/bit). when f usedf inf fddif andf atm f 100f mb/sf applications f thef performance f off thef 1300f nmf transceivers f isf guaranteed f over f the f signaling f rate f of f 10 f mbd f to f 125 f mbd f to f the f full f con - ditionsf listedfinfindividualf productf specifcationf tables. the f transceivers f may f bef usedf for f otherf applications f at f signa lingf rates f outsidef off thef 10f mbd f to f 125f mbd f range f withf somef penalty f inf thef linkf opticalf power f budgetf pri - marily f causedf by f af reduction f off receiver f sensitivity. f figure f 5f gives f anf indication f off thef typical f performance f off thesef 1300fnmf productsf atf diferentf rates. these f transceivers f canf alsof bef used f for f applications f which f require f diferent f bitf error f rate f (ber)f performance. f figure f 6f illustrates f thef typical f trade-of f between f linkf berf andf thef receivers finputfopticalf powerf level. transceiver jitter performance the f avago f technologies f 1300 f nm f transceivers f are f designed f to f operate f perf thef system f jitter f allocations f stated f inf table f e1foff annexfefofftheffddif pmdfandf lcf-pmdf standards. the f avago f technologies f 1300 f nm f transmitters f will f tolerate f thef worst f casef inputf electrical f jitter f allowed f inf thesef tablesf without f violating f the f worst f case f output f jitter f requirements f off sections f 8.1f active f output f interface f off thef fddif pmd f andf lcf-pmdf standards. the f avago f technologies f 1300 f nm f receivers f will f tolerate f the f worst f case f input f optical f jitter f allowed f in f sections f 8.2 f active f input f interface f off thef fddif pmd f andf lcf-pmd f standards f withoutf violating f thef worst f casef outputf electrical f jitter f allowed finf table fe1foff annexf e. the f jitter f specifcations f stated f inf thef following f 1300f nmf transceiver f specifcation f tables f are f derived f from f the f values f inf table f e1f off annex f e. f they f represent f thef worst f casef jitter f contribution f that f thef tran s ceiversf are f allowed f to f makef to f thef overall f system f jitter f withoutf violating f thef annex f ef allocation f example. f in f practice f thef typical f contribution f off thef avago f technologies f tran s ceiversf isf well f below f thesef maximumf allowedf amounts. recommended handling precautions avago f technologies f recommends f that f normal f static f precautions f be f taken f in f the f handling f and f assem - bly f of f these f transceivers f to f prevent f damage f which f may f be f induced f by f electrostatic f discharge f (esd). f the f afbr-5903z f series f of f transceivers f meet f mil-std-883c f method f3015.4fclassf2f products. care f shouldf bef usedf to f avoid f shorting f thef receiver f data f orf signal f detect f outputsf directly f to f ground f withoutf proper f current flimitingf impedance. solder and wash process compatibility the f transceivers f are f delivered f withf protective f process f plugsf inserted f into f thef mt-rj f connector f receptacle. f this f process f plugf protects f thef opticalf subassembliesf during f wave f solderf andf aqueousf wash f processing f andf acts f asf af dustf coverf duringf shipping. these f transceivers f are f compa tiblef withf eitherf industry f standard f waveforfhandfsolderf processes. shipping container the f transceiver f isf packaged f inf af shippingf container f de - signed f to f protect f itf from f mechanicalf andf esdf damagef during f shipmentforf storage. 7 figure 7. recommended decoupling and termination circuits o v ee r x o v cc r x o sd o rd- o rd+ z = 50 ? z = 50 ? terminate at transceiver inputs z = 50 ? z = 50 ? 10 9 8 7 6 sd lvpecl v cc (+3.3 v) terminate at device inputs lvpecl v cc (+3.3 v) phy device td+ td- rd+ rd- v cc (+3.3v) 82 ? 130 ? z = 50 ? 1 2 3 4 5 td- o t d+ o n/c o v ee t x o v cc t x o 1 h c2 1 h c1 c3 10 f v cc (+3.3 v) tx rx note: c1 = c2 = c3 = 10 nf or 100 nf 100 100 ? 130 ? 130 ? 130 ? 130 ? board layout - decoupling circuit, ground planes and termination circuits it f is f important f to f take f care f in f the f layout f of f your f circuit f board f to f achieve f optimum f perfor m ance f from f these f transceivers. f figure f 7f provides f af goodf example f off af schematic f for f af power f supply f decoupling f circuit f that f works f well f with f these f parts. f it f is f further f recommended f that f a f continuous ff ground f planef bef provided f inf thef circuit f board f directly f underf thef transceiver f to f provide f af low f inductance f ground f for f signal f return f current. f this f recomme n dation f isf inf keepingf withf goodf highf frequency f board f layout f practices. f figures f 7f andf 8f showf twof recommendedf terminationf schemes. board layout - hole pattern the f avago f technologies f tran s ceiverf complies f withf thef circuit f board f common f transceiver f footprint f hole f pattern f defnedf inf thef original f multisource f announc e mentf whichf defnedf thef 2f xf 5f package f style. f this f drawing f isf repr o ducedf inf figure f 9f withf thef additionf off ansif y14.5mf compliant f dimensioningf to f bef usedf asf af guidef inf thef mechanicalf layout foff yourf circuitf board. 8 figure 9. recommended board layout hole pattern dimensions in millimeters (inches) notes: 1. this figure describes the recommended circuit board layout for the mt-rj transceiver placed at .550 spacing. 2. the hatched areas are keep-out areas reserved for housing standoffs. no metal traces or ground connection in keep-out areas. 3. 10 pin module requires only 16 pcb holes, including 4 package grounding tab holes connected to signal ground. 4. the solder posts should be soldered to chassis ground for mechanical integrity and to ensure footprint compatibility with other sff transceivers. spacing of front housing leads holes holes for housing leads 13.34 (0.525) keep out area for port plug 7.59 (0.299) 3 (0.118) 3 (0.118) 6 (0.236) 4.57 (0.18) 17.78 (0.7) 27 (1.063) 1.778 (0.07) 7.112 (0.28) ? 0.81 0.1 (0.032 0.004) 3.08 (0.121) ? 2.29 (0.09) 7.11 (0.28 ) 9.59 (0.378 ) 3.08 (0.121 ) ? 1.4 0.1 (0.055 0.004) ? 1.4 0.1 (0.055 0.004) ? 1.4 0.1 (0.055 0.004) 10.16 (0.4) 13.97 (0.55) min. 3.56 (0.14) 7 (0.276) 10.8 (0.425) 2 (0.079 ) figure 8. alternative termination circuits o v ee r x o v cc r x o sd o rd- o rd+ z = 50 ? 130 ? v cc (+3.3 v) 10 nf z = 50 ? 130 ? 82 ? 82 ? terminate at transceiver inputs z = 50 ? z = 50 ? 10 9 8 7 6 sd lvpecl v cc (+3.3 v) terminate at device inputs lvpecl v cc (+3.3 v) phy device td+ td- rd+ rd- z = 50 ? 1 2 3 4 5 td- o t d+ o n/c o v ee t x o v cc t x o 1 h c2 1 h c1 c3 10 f v cc (+3.3 v) tx rx note: c1 = c2 = c3 = 10 nf or 100 nf 10 nf 130 ? 82 ? v cc (+3.3 v) 130 ? 82 ? v cc (+3.3 v) 82 ? 130 ? 10 nf 9 regulatory compliance these f transceiver f products f are f intended f to f enablef com - mercial f system f designers f to f develop f equipment f that f com - pliesf withf thef various f international f regulations f governing f certifc a tionf off information f technology f equipment. f see f thef regulatory f compliance f table f for f details. f additional f information f isf available f from f your f avago f technologies f salesf representative. electrostatic discharge (esd) there f are f two f design f casesf inf whichf immunity f to f esdf damagefisf important. the f frstf casef isf during f handlingf off thef transceiver f prior f to f moun tingf itf onf thef circuit f board. f it f isf important f to f usef normal f esd f handling f precautions f for f esd f sensitive f devices. f these f pr ecautionsf includef usingf grounded f wrist f straps, f work f benches,fandf foor f mats f in f esd f controlled f areas. the f second f casef to f consider f isf static f discharges f to f thef ex - terior f off thef equipment f chassisf co n tainingf thef transceiver f parts. f to f thef extent f that f thef mt-rj f connector f isf exposed f to f thef outsidef off thef equipment f chassisf itf may f bef subject f to f whatever f esdf system f level f test f criteria f that f thef equipment f isf intendedf tof meet. electromagnetic interference (emi) most f equipment f designs f utilizingf thisf highf speedf trans - ceiver f from f avago f technologies f willf bef required f to f meetf thef requir e mentsf off fcc f inf thef united f states, f cenelecf en55022f (cisprf22)finf europefandf vcci finfjapan. immunity equipment f utilizingf thesef transceivers f willf bef subject f to f radio-frequency f electromagnetic f feldsf inf somef environ - ments. f these f transceivers f have f af highf immunity f to f suchf felds. regulatory compliance table feature test method performance electrostatic f discharge (esd) f to f the f electrical f pins mil-std-883c method f3015.4 meets fclassf2f(2000f tof3999f volts). f f withstand fupf tof2200f vfappliedf betweenf electricalf pins.ff electrostatic f dischargef esd) f tofthef mt-rjf receptacle variation fof f iecf801-2 typically fwithstandf atfleastf25fkvfwithoutfdamagefwhenfthef mt- rjf connectorf receptaclefisf contactedf byfafhumanf bodyf modelf probe. electromagnetic f interference f(emi) fcc fclassfb f cenelecfcen55022 vcci fclassf2 typically f providefaf10fdbf marginf tofthef notedf standards,f however, fitfshouldfbef notedf thatffnalf marginfdependsfonfthef customers f boardfandfchasisf design. immunity variation foffiec61000-4-3 typically f showfnof measurablef efectf fromfaf10f v/mffeldf sweptf from f10f tof450f mhzfappliedf tofthef transceiverfwhenf mountedf tof af circuitf cardfwithoutfafchassisf enclosure. eye f safety iecf825fissuef1f1993:11 classf1 f cenelecfen60825fclassf1 compliant fperf avago f technologies f testing funderfsingleffaultf conditions. f tuvf certifcation:fledfclassf1 rohs f compliance reference f tofeuf rohsf directivef2002/95/ec transceiver reliability and performance qualifcation data the f 2f xf 5f transceivers f have f passedf avago f technologies f reliabi l ityf andf performance f qualifcation f testing f andf are f undergoing f ongoingf quality f andf reliability f monitoring. f details f are f avai lablef from f your f avago f technologies f salesf representative. f applications support materials contact f your f localf avago f technologies f component f field f sales f ofce f for f information f onf how f to f obtain f evaluation f boards f forfthef2fxf5f transceivers. 10 figure 11. transmitter output optical spectral width (fwhm) vs. transmit - ter output optical center wavelength and rise/fall times. 1380 200 100 - transmitter output optical center wavelength - nm 1200 1300 1320 180 160 140 120 1360 1340 ? - transmitter output optical spectral width (fwhm) - nm t r/f - transmitter output optical rise/fall times - ns 1.5 2.0 3.0 3.5 2.5 3.0 3.5 hfbr-5903 fddi transmitter test results of c, ? and tr/f are correlated and comply with the allowed spectral width as a function of center wavelength for various rise and fall times. c relative input optical power (db) -4 4 eye sampling time position (ns) -3 -1 0 1 6 3 -2 2 5 4 3 2 1 0 2.5 x 10 -1 0 ber 1.0 x 10 -12 ber conditions: 1.t a = +25 ?c 2. v cc = 3.3 v dc 3. input optical rise/fall times = 1.0/ 2.1 ns. 4. input optical power is normalized to center of data symbol. 5. note 19 and 20 apply. figure 10. recommended panel mounting dimensions in millimeters (inches) 10.8 0.1 (0.425 0.004) 13.97 (0.55) min. 0.25 0.1 (0.01 0.004) (top of pcb to bottom of opening) 9.8 0.1 (0.386 0.004) 14.79 (0.589 ) 1 (0.039 ) 3.8 (0.15 ) figure 13. relative input optical power vs. eye sampling time position. 11 figure 12. output optical pulse envelope. 40 0.7 10.0 4.850 1.525 0.525 5.6 100% tim e interval 0.725 0.725 4.40 1.975 0.075 0.50 0.025 - 0.025 0.0 - 0.05 0.10 10.0 5.6 1.525 0.525 4.850 80 500 ppm 4.40 1.975 0.075 0.90 1.025 1.25 time - ns 0% tim e interval 1.00 0.975 relative amplitude the afbr-5903 output optical pulse shape shall fit within the boundaries of the pulse envelope for rise and fall time measurements. -31.0 dbm -45.0 dbm signal _ detect(on) signal _ detect (off) as _ ma x input optical power ( > 1.5 db step increase) input optical power ( > 4.0 db step decrease) p o = max (p s or -45.0 dbm) (p s = input power for ber < 10 2 ) min (p o + 4.0 db or -31.0 dbm) p a (p o + 1.5 db < p a < -31.0 dbm ) optical power tim e signal detect output as _ max - maximum acquisition time (signal). as _ max is the maximum signal _ detect assertion time for the station . as _ max shall not exceed 100.0 s. the default value of as _ max is 100.0 s. ans _ max - maximum acquisition time (no signal). ans _ max is the maximum signal _ detect deassertion time for the station . ans _ max shall not exceed 350 s. the default value of as _ max is 350 s. ans _ ma x figure 14. signal detect thresholds and timing. 12 absolute maximum ratings stresses f inf excess f off thef absolute f maximumf ratings f canf causef catastrophic f damagef to f thef device. f limitsf applyf to f eachf parameter f inf isolation, f allf otherf parameters f having f values f withinf thef recommended f operating f conditions. f it f shouldf notf bef assumedf that f limitingf values f off more f thanf onef parameter f canf bef appliedf to f thef product f at f thef samef time. f exposure f to fthef absolutefmaximumf ratingsf forf extendedf periodsfcanf adverselyf afectf devicef reliability. parameter symbol minimum typical maximum unit reference storage f temperature t s -40 +100 c lead f solderingf temperature t sold +260 c lead f solderingf time t sold 10 sec. supplyf voltage v cc -0.5 3.6 v data f inputf voltage v i -0.5 v cc v diferential f inputf voltage f (p-p) v d 2.0 v note f1 output f current i o 50 ma parameter symbol minimum typical maximum unit reference ambient f operatingf temperature afbr-5903/5903e afbr-5903a t a t a 0 -40 +70 +85 c c note fa note fb supplyf voltage v cc 3.135 3.465 v data f inputf voltage f-f low v il f-f v cc -1.810 -1.475 v data f inputf voltage f-f high v ih f-f v cc -1.165 -0.880 v data fandf signalf detectf outputf load r l 50 w note f2 diferential f inputf voltage f (p-p) v d 0.800 v recommended operating conditions notes: a.f ambient f operating f temperature ff corresponds ff to f transceiver f casef temperature f off 0cf mininumf to f +85f cf maximumf withf necessary f airfow f applied. f recommendedfcasef temperaturef measurementf pointfcanfbef foundfinf figuref2. b.f ambient f operating f temperature ff corresponds ff to f transceiver f casef temperature f off -40f cf mininumf to f +100f cf maximumf withf necessary f airfow f applied. f recommendedfcasef temperaturef measurementf pointfcanfbef foundfinf figuref2. 13 parameter symbol minimum typical maximum unit reference supplyf current i cc 133 175 ma note f3 power f dissipation p diss 0.45 0.60 w note f5a data f inputf currentf-f low i il -350 -2 a data f inputf currentf-f high i ih 18 350 a parameter symbol minimum typical maximum unit reference supplyf current i cc 65 120 ma note f4 power f dissipation p diss 0.225 0.415 w note f5b data f outputf voltage f-f low v ol f-f v cc -1.83 -1.55 v note f6 data f outputf voltage f-f high v oh f-f v cc -1.085 -0.88 v note f6 data f outputf risef time t r 0.35 2.2 ns note f7 data f outputf fallf time t f 0.35 2.2 ns note f7 signal f detectf outputf voltage f-f low v ol f-f v cc -1.83 -1.55 v note f6 signal f detectf outputf voltage f-f high v oh f-f v cc -1.085 -0.88 v note f6 signal f detectf outputf risef time t r 0.35 2.2 ns note f7 signal f detectf outputf fallf time t f 0.35 2.2 ns note f7 power fsupplyfnoisef rejection psnr 50 mv receiver electrical characteristics afbr-5903z/5903ezf (t a f=f0cf tof+70c,f v cc f=f3.135f vf tof3.465f v) AFBR-5903AZf (t a f=f-40cf tof+85c,f v cc f=f3.135f vf tof3.465f v) transmitter electrical characteristics afbr-5903z/5903ezf (t a f=f0cf tof+70c,f v cc f=f3.135f vf tof3.465f v) AFBR-5903AZf (t a f=f-40cf tof+85c,f v cc f=f3.135f vf tof3.465f v) 14 receiver optical and electrical characteristics afbr-5903z/5903ezf (t a f=f0cf tof+70c,f v cc f=f3.135f vf tof3.465f v) AFBR-5903AZf (t a f=f-40cf tof+85c,f v cc f=f3.135f vf tof3.465f v) parameter symbol minimum typical maximum unit reference input fopticalf power minimum f atf window f edge p inf min f (w) -33.5 -31 dbmf avg note f19 figure f13 input fopticalf power minimum f atf eyef center p inf min f (c) -34.5 -31.8 dbmf avg note f20 figure f13 input fopticalf powerf maximum p inf max -14 -11.8 dbmf avg note f19 operating f wavelength l 1270 1380 nm duty f cyclef distortionf contributed by fthef receiver dcd 0.09 0.4 nsf p-p note f8 data f dependentf jitterf contributed by fthef receiver ddj 0.2 1.0 nsf p-p note f9 random f jitterf contributedf byfthef receiver rj 0.11 2.14 nsf p-p note f10 signal f detectf-f asserted p a p d f+f1.5fdb -33 dbmf avg note f21,f22 figure f14 signal f detectf-f deasserted p d -45 dbmf avg note f23,f24 figure f14 signal f detectf-f hysteresis p a f-fp d 1.5 2.4 db figure f14 signal f detectf assertf time (off tofon) as_max 0 2 100 s note f21,f22 figure f14 signal f detectf deassertf time (onf tof of ) ans_max 0 5 350 s note f23,f24 figure f14 transmitter optical characteristics afbr-5903z/5903ezf (t a f=f0cf tof+70c,f v cc f=f3.135f vf tof3.465f v) AFBR-5903AZf (t a f=f-40cf tof+85c,f v cc f=f3.135f vf tof3.465f v) parameter symbol minimum typical maximum unit reference output fopticalf powerffffffffffffffffffffffbol 62.5/125fm,fnaf=f0.275f fiberffffffffeol p o -19 -20 -15.7 -14 dbmf avg note f11 output fopticalf powerffffffffffffffffffffffbol 50/125fm,fnaf=f0.20f fiberffffffffffffeol p o -22.5 -23.5 -20.3 -14 dbmf avg note f11 opticalf extinctionf ratio 10 -10 % db note f12 output fopticalf powerf at logic f lowf 0 f state p o f(0) -45 dbmf avg note f13 center f wavelength l c 1270 1308 1380 nm note f14 figure f11 spectral f width f-ffwhm fffffffffffffffffffff-frms dl 147 63 nm note f14 figure f11 opticalf risef time t r 0.6 1.9 3.0 ns note f14/15 figure f11,12 opticalf fallf time t f 0.6 1.6 3.0 ns note f14/15 figure f11,12 duty f cyclef distortionf contributed by fthef transmitter dcd 0.16 0.6 nsf p-p note f16 data f dependentf jitterf contributed by fthef transmitter ddj 0.07 0.6 nsf p-p note f17 random f jitterf contributed by fthef transmitter rj 0.12 0.69 nsf p-p note f18 notes: 1.f this f isf thef maximumf voltage f that f canf bef applied f across f the f diferen - tial f transmitter f data f inputs f to f prevent f damagef to f thef inputf esdf protection f circuit. 2.f the foutputsf aref terminatedfwithf50f ?f connectedf tof v cc f-2f v. 3.f the f power f supplyf current f neededf to f operate f thef transmitter f isf provided f to f diferential f eclf circuitry. f this f circuitry f maintains f af nearly f co n stantf current f fow f from f thef power f supply. f constant f current f operation f helpsf to f prevent f unwanted f electrical f noisef from f beingf generated fandf conductedforf emittedf tof neighboringf circuitry. 4.f this f value f isf measured f withf thef outputsf terminated f into f 50f ?f con - nected f to f v cc f -f 2f vf andf anf input f opticalf power f level f off -14f dbmf average. 5a.f the f power f dissipation f off thef transmitter f isf calculated f asf thef sumf off thef productsfoffsupplyf voltagefandf current. 5b.f the f power f dissipation f off thef receiver f is ff calcu latedf asf thef sumf off thef products f off supplyf voltage f andf currents, f minusf thef sumf off thef products foffthefoutputf voltagesfandf currents. 6.f this f value f is f measured f with f respect f to f v cc f with f the f output f terminated f into f50?f connectedf tof v cc f-f2f v. 7.f the f outputf rise f andf fallf timesf are f measured f between f 20%f andf 80%f levels fwithfthefoutputf connectedf tof v cc f-2f vf throughf50f?. 8.f duty f cycle f distortion f contributed f by f thef receiver f isf measured f at f thef 50%f threshold f usingf anf idlef linef state, f 125f mbd f (62.5f mhz f square-wave), f inputf signal. f the f inputf opticalf power f level f isf -20f dbmf average. f see f appl i cationf information f -f transceiver f jitter f section f for f further f information. 9.f data f dependentf jitterf contributedf byf the f receiver f is f specifed f with f thef fddif ddjf test f pattern f described f inf thef fddif pmd f annex f a.5.f the f inputf opticalf power f level f isf -20f dbmf average. f see f application f inform a tionf-f transceiver f jitterf sectionf forf furtherf information. 10.f random f jitter f contributed f by f thef receiver f isf specifedf withf anf idlef linef state, f 125f mbd f (62.5f mhz f square-wave), f inputf signal. f the f inputf opticalf power f level f isf at f maximumf p inf min. f (w). f see f applic a tionf information f-f transceiver f jitterf sectionf forf furtherf information. 11.f these f opticalf power f values f are f measured f withf thef following f condi - tions: ?f the f beginning f off life f (bol)f to f thef endf off life f (eol)f opticalf power f degradation f isf typically f 1.5f dbf perf thef industry f convention f for f long f wavelength f leds. f the f actual f degradation f observed f in f avago f technologies f 1300f nmf ledf products f isf |
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