asmt-qxb2-fxxxx super 0.5 w power plcc-4 surface mount led indicator data sheet description the super 0.5 w power plcc-4 smt led is an extension of power plcc-4 smt leds. the package can be driven at high current due to its superior package design. the product is able to dissipate the heat more e?ciently compared to the power plcc-4 smt leds. these leds produce higher light output with better ?ux perfor- mance compared to the power plcc-4 smt led. the super 0.5 w power plcc-4 smt leds are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. the performance characteristics of these new mid-power leds make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. to facilitate easy pick and place assembly, the leds are packed in eia-compliant tape and reel. every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. super 0.5 w power plcc-4 smt led is available in red, red orange and amber colors. features industry standard plcc 4 platform (3.2 x 2.8 x 1.9 mm) high reliability package with enhanced silicone resin encapsulation high intensity brightness with optimum ?ux performance using allngap chip technologies available in red, red orange and amber colors high optical e?ciency available in 8 mm carrier tape and 7 inch reel low thermal resistance super wide viewing angle at 120 degrees longer life time with minimum degradation due to enhanced silicone resin material jedec msl 2a applications exterior automotive - turn signals - side repeaters - chsml - rear combination lamp - side markers - truck clearance lamp electronic signs and signals - channel lettering - contour lighting - indoor variable message sign o?ce automation, home appliances, industrial equipment - front panel backlighting - push button backlighting - display backlighting caution: asmt-qxb2-fxxxx leds are class 2 esd sensitive. please observe appropriate precautions during handling and processing. refer to avago application note an-1142 for additional details.
2 package drawing figure 1. package drawing table 1. device selection guide (t j = 25 c) color part number luminous flux, v [1] (lm) dice technology min. flux (lm) typ. flux (lm) max. flux (lm) test current (ma) amber asmt-qab2-fde0e 9.0 11.4 15.0 150 alingap red orange asmt-qhb2-fef0e 11.5 14.0 19.5 150 alingap red asmt-qrb2-fcd0e 7.0 9.8 11.5 150 alingap notes: 1. v is the total luminous ?ux output as measured with an integrating sphere at mono pulse conditions. 2. tolerance = 12%. 3.6 0.2 0.5 0.1 3.2 0.2 2.8 0.2 2.2 0.2 1.9 0.2 0.15 (typ.) 0.8 0.1 0.8 0.3 aa cc 0.7 0.1 anode marking 2.40 1.15 0.05 2.30 0.05 0.41 (typ.) 0.56 (typ.) 1. all dimensions in millimeters. 2. lead polarity as shown in figure 13. 3. terminal finish: ag plating. 4. encapsulation material: silicone resin. notes: part numbering system a s m t C q x 1 b 2 C f x 2 x 3 x 4 x 5 packaging option color bin selection max. flux bin selection min. flux bin selection color a - amber h - red orange r - red
3 table 4. electrical characteristics (t j = 25c) part number forward voltage v f (volts) @ i f = 150 ma reverse voltage v r @ 100 a thermal resistance r j-p (c/w) typ. max. min. asmt-qab2-fxxxx 2.70 3.25 5 60 asmt-qhb2-fxxxx 2.70 3.25 5 60 asmt-qrb2-fxxxx 3.10 3.55 5 60 table 2. absolute maximum ratings (t a = 25c) parameters asmt-qxb2-fxxxx dc forward current [1] 150 ma peak forward current [2] 200 ma power dissipation 470 mw reverse voltage 5 v junction temperature 125c operating temperature -40c to +110c storage temperature -40c to +110c notes: 1. derate l inearly as shown in figure 6. 2. duty factor = 10%, frequency = 1khz. table 3. optical characteristics (t j = 25c) color part number dice technology dominant wavelength d [1] (nm) viewing angle 2 1 / 2 [2] (degrees) luminous e?ciency e (lm/w) total flux / luminous intensity f v (lm) / i v (cd) typ. typ. typ. typ. amber asmt-qab2-fxxxx alingap 594.5 120 28 3.3 red orange asmt-qhb2-fxxxx alingap 617.0 120 35 3.3 red asmt-qrb2-fxxxx alingap 624.0 120 21 3.3 notes: 1. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the device. 2. 1/2 is the o?-axis angle where the luminous intensity is 1/2 the peak intensity.
4 figure 2. relative intensity vs. wavelength figure 3. forward current vs. forward voltage figure 4. relative intensity vs. forward current figure 5. relative intensity vs. temperature figure 6a. maximum forward current vs. ambient temperature. derated based on t jmax = 125c, r j-a = 130c/w, 110c/w, 100c/w and 80c/w. waveleng th C nm rela ti ve i n t ens ity 1 .0 0.8 0 380 480 580 680 7 30 7 80 630 530 430 0.6 0.4 0.2 a li ngap red 0. 1 0.3 0.5 0. 7 0. 9 a li ngap amber a li ngap red - orange 0 f orward vol t age C v 0 40 1 40 1 60 1 80 200 f orward c u rren t C ma 80 20 1 00 60 1 20 4 3 1 2 a li ngap red a li ngap amber a li ngap red - orange 050 dc f orward c u rren t C ma 0 0.4 rela ti ve l u m i no u s i n t ens ity (normal iz ed a t 1 50 ma) 200 1 00 1 50 0.2 0.8 0.6 1 .0 1 .2 red/red - orange amber - 50 - 25 0 j u nc ti on t empera tu re C c 0 0.4 rela ti ve l u m i no u s i n t ens ity (normal iz ed a t 25 c) 1 25 25 50 7 5 1 00 0.2 0.8 0.6 1 .0 2.2 1 .2 1 .4 1 .6 1 .8 2.0 red amber red - orange 0 160 0 20 60 80 120 maxim u m forward c u rrent C ma j u nction temperat u re C c 40 100 120 60 80 40 20 140 100 r ja = 80 c/w r ja = 110 c/w r ja = 100 c/w r ja = 130 c/w figure 6b. maximum forward current vs. solder point temperature. derated based on t jmax = 125c, r jp = 60c/w. 0 160 0 20 60 80 120 c u rrent C ma temperat u re C c 40 100 120 60 80 40 20 140 100 amber / red-orange red
5 figure 7 a. maximum pulse current vs. ambient temperature. derated based on t a = 25c, r j-a =110c/w. figure 7 b. maximum pulse current vs. ambient temperature.derated vased on t a = 85c, r j-p =110c/w. 0.00 0. 1 0 0.20 0.30 1 .00e - 05 1 .00e - 03 1 .00e - 0 11 .00e + 0 1 t p - t ime - (s) c u rren t - a d = t p t t p i f t d = 0.05 0. 1 0 0.25 0.50 1 0.00 0. 1 0 0.20 0.30 1 .00e - 05 1 .00e - 03 1 .00e - 0 11 .00e + 0 1 t p - t ime - (s) c u rren t - a d = t p t t p i f t d = 0.05 0. 1 0 0.25 0.50 1 figure 9 . forward voltage shift vs. temperature figure 10. radiation pattern figure 8. dominant wavelength vs. forward current C alingap devices dom i nan t waveleng th C nm 0 580 f orward c u rren t C ma 200 620 50 630 1 00 600 1 50 5 9 0 6 1 0 a li ngap red a li ngap red - orange a li ngap amber f orward vol t age s hift (v) - 50 - 0. 1 5 t j C j u nc ti on t empera tu re C c 1 00 0.05 0. 1 0 - 25 0. 1 5 02550 7 5 - 0.05 - 0. 1 0 0 normal iz ed i n t ens ity -9 0 0 ang u lar d i splacemen t C degrees 9 0 0. 9 0.6 1 .0 - 60 - 30 0.4 30 60 0 0.3 0.2 0. 1 0.5 0.8 0. 7
6 figure11. recommended pick and place nozzle size figure 12. recommended pb-free re?ow soldering pro?le note: for detail information on re?ow soldering of avago sur- face mount leds, do refer to avago application note an 1060 surface mounting smt led indicator components. 217 c 200 c 150 c 60 - 120 sec. -6 c/sec. max. 3 c/sec. max. 3 c/sec. max. 255 - 260 c 100 sec. max. 10 - 30 sec. time temperature (acc. to j-std-020c) note: diameter "d" should be smaller than 2.2mm d figure 13. recommended soldering pad pattern anode marking 0.4 0.3 minim u m 55 mm 2 of cathode pad for improved heat dissipation 2.4 0.6 0. 9 x 6 4.6 1.1 1.3 x 6 anode marking a c c c a a a a solder mask anode cathode cc aa
7 figure 14. tape leader and trailer dimensions 200 mm m i n. f or ? 1 80 reel. 200 mm m i n. f or ? 330 reel. t ra i ler componen t leader 480 mm m i n. f or ? 1 80 reel. 9 60 mm m i n. f or ? 330 reel. c a u ser f eed d i rec ti on figure 15. tape dimensions figure 16. reeling orientation ca th ode s i de pr i n t ed label u ser f eed d i rec ti on 3.8 0. 1 2.2 9 0. 1 0.22 9 0.0 1 all d i mens i ons i n mm. 2 0.05 4 0. 1 4 0. 1 3.05 0. 1 3.5 0.05 8 + 0.3 C0. 1 1 . 7 5 0. 1 ? 1 .5 + 0. 1 C0 8 ? 1 + 0. 1 C0 aa cc
8 device color (x 1 ) a amber h red orange rred flux bin select (x 2 x 3 ) individual reel will contain parts from one bin only. x 2 min flux bin x 3 max flux bin flux bin limits bin id min. (lm) max. (lm) a 4.30 5.50 b 5.50 7.00 c 7.00 9.00 d 9.00 11.50 e 11.50 15.00 f 15.00 19.50 g 19.50 25.50 h 25.50 33.00 j 33.00 43.00 k 43.00 56.00 l 56.00 73.00 tolerance of each bin limit = 12%. color bin select (x 4 ) individual reel will contain parts from one full bin only. x 4 0 full distribution a 1 and 2 only b 2 and 3 only c 3 and 4 only d 4 and 5 only e 5 and 6 only g 1, 2 and 3 only h 2, 3 and 4 only j 3, 4 and 5 only k 4, 5 and 6 only m 1, 2, 3 and 4 only n 2, 3, 4 and 5 only p 3, 4, 5 and 6 only r 1, 2, 3, 4 and 5 only s 2, 3, 4, 5 and 6 only z special color bin color bin limits amber/ y ellow min. (nm) max. (nm) 2 583.0 586.0 3 586.0 589.0 4 589.0 592.0 5 592.0 595.0 6 595.0 598.0 red orange min. (nm) max. (nm) 1 611.0 616.0 2 616.0 620.0 3 620.0 625.0 red min. (nm) max. (nm) full distribution 620.0 635.0 tolerance of each bin limit = 1 nm.
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. av02-0232en - april 8, 2010 v f binning bin min. max. 2d 2.35 2.50 2e 2.50 2.65 2f 2.65 2.80 2g 2.80 2.95 2h 2.95 3.10 2j 3.10 3.25 2k 3.25 3.40 2l 3.40 3.55 tolerance of each bin = 0.1 v. packaging option (x 5 ) option test current package type reel size e 150 ma top mount 7 inch handling precaution the encapsulation of the product is made of silicone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. this might damage the product and cause premature failure. during assembly or handling, the unit should be held on the body only. please refer to avago application note an 5288 for detailed information. moisture sensitivity this product is quali?ed as moisture sensitive level 2a per jedec j-std-020. precaution when handling this moisture sensitive product is important to ensure the reliability of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use - unopen moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the hic indicates that baking is not required, then it is safe to re?ow the leds per the original msl rating. b. control after opening the mbb - the humidity indicator card (hic) shall be read im- mediately upon opening of mbb. - the leds must be kept at <30c/60%rh at all times and all high temperature related processes, includ- ing soldering, curing or rework, need to be com- pleted within 672 hours. c. control for un?nished reel - for any unused leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembled boards - if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb needs to be stored in sealed mbb with desiccant or desic- cator at <5% rh to ensure no leds have exceeded their ?oor life of 672 hours. e. baking is required if: - 10% is not green and 5% hic indicator is azure. - the leds are exposed to condition of >30c/60% rh at any time. - the leds ?oor life exceeded 672 hours. recommended baking condition: 60 5c for 20 hours.
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