page . 1 rev.0-mar.19.2005 data sheet features ? plastic package has underwriters laboratory flammability classification 94v-o. flame retardant epoxy molding compound. exceeds environmental standards of mil-s-19500/228 low power loss, high efficiency. low forwrd voltge, high current ca pability high surge capacity. for use in low voltage,high frequency inverters free wheeling , and polarlity protection applications. pb free product are available : 99% sn above can meet rohs environment substance directive request sb1020f~sb10150f isolation schottky barrier rectifiers .189(4.8) .406(10.3) .130(3.3) .114(2.9) .055(1.4) .055(1.4) .035(0.9) .011(0.3) (2.55) (2.55) .1 .1 .032(.8) .112(2.85) .272(6.9) .606(15.4) .543(13.8) .161(4.1)max .134(3.4) .165(4.2) .381(9.7) .114(2.9) .098(2.5) .039(1.0) .039(1.0) max .100(2.55) .248(6.3) .583(14.8) .512(13.0) .118(3.0) ito-220ac unit : inch (mm) voltage 20 to 150 volts 10 amperes current mechanical data case: ito-220ac molded plastic terminals: solder plated, solderable per mil-std-202g, method 208 polarity: as marked. standard packaging: any weight: 0.08 ounces, 2.24grams. maximum ratings and electrical characteristics ratings at 25c ambient temperature unless otherwise specified. single phase, half wave, 60 hz, resistive or inductive load. for capacitive load, derate current by 20% r e t e m a r a pl o b m y sf 0 2 0 1 b sf 0 3 0 1 b sf 0 4 0 1 b sf 0 5 0 1 b sf 0 6 0 1 b sf 0 8 0 1 b sf 0 0 1 0 1 b sf 0 5 1 0 1 b ss t i n u e g a t l o v e s r e v e r k a e p t n e r r u c e r m u m i x a m v rrm 0 20 30 40 50 60 80 0 10 5 1v e g a t l o v s m r m u m i x a m v rms 4 11 28 25 32 46 50 75 0 1v e g a t l o v g n i k c o l b c d m u m i x a m v dc 0 20 30 40 50 60 80 0 10 5 1v ) m m 5 . 9 ( " 5 7 3 . t n e r r u c d r a w r o f e g a r e v a m u m i x a m t t a h t g n e l d a e lc0 0 1 = o c i av 0 1a e v a w - e n i s f l a h e l g n i s s m 3 . 8 : t n e r r u c e g r u s d r a w r o f k a e p ) d o h t e m c e d e j ( d a o l d e t a r n o d e s o p m i r e p u s i fsm 0 5 1a , a 0 1 t a e g a t l o v d r a w r o f m u m i x a m v f 5 5 . 05 7 . 05 8 . 02 9 . 0v 5 2 = a t t a t n e r r u c e s r e v e r c d m u m i x a m o c 0 0 1 = a t e g a t l o v g n i k c o l b c d d e t a r o c i r 5 . 0 0 5 a m c n a t s i s e r l a m r e h t l a c i p y te r c j0 . 3 o w / c e g n a r e r u t a r e p m e t e g a r o t s d n a n o i t c n u j g n i t a r e p o t j t , stg 5 2 1 + o t 0 5 - o c note. both bonding and chip structure are available.
page . 2 rev.0-mar.19.2005 rating and characteristic curves average forward current fig.1- forward current derating curve case temperature, c o 0 50 100 150 25.0 20.0 15.0 10.0 5.0 0 fig.4- typical instantaneous forward characteristic fig.2- maximum non - repetitive surge current fig.3- typical reverse characteristic peak forward surge current , no. of cycle at 60hz 150 120 110 90 70 50 30 20 10 1 2 5 10 20 50 100 8.3ms single half since-wave jedec method 20 0 10 -3 10 -2 10 -1 10 0 40 60 80 100 t=25c j o t =100 c j o v =20-40v v =50-100v rrm rrm reverse current, ma percent of rated peak reverse voltage, % 0.2 0.1 1.0 10 100 0.4 0.6 0.8 1.0 20-40v 80-100v 50-60v forward current, amperes forward voltage, volts
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