ammc-6232 8 to 32 ghz gaas high linearity low noise amplifer data sheet features ? 800m x 2000m die size ? unconditionally stable specifcations (vdd = 4.0v, idd = 135ma) ? rf frequencies: 18 - 32 ghz ? high output ip3: 29dbm ? high small-signal gain: 27db ? typical noise figure: 2.8db ? input, output match: -10db applications ? microwave radio systems ? satellite vsat, dbs up/down link ? lmds & pt-pt mmw long haul ? broadband wireless access (including 802.16 and 802.20 wimax) ? wll and mmds loops note: 1. this mmic uses depletion mode phemt devices. description avago technologies ammc-6232 is an easy-to-use broadband, high gain, high linearity low noise amplifer that operates from 18 ghz to 32ghz. the wide band and unconditionally stable performance makes this mmic ideal as a primary or sub-sequential low noise block or a transmitter or lo driver. the mmic has 4 gain stages and requires a 4v, 135ma power supply for optimal performance. the two gate bias voltages can be combined for ease of use or separated for more control fexibility. dc- block capacitors are integrated at the input and output stages. since this mmic covers several bands, it can reduce part inventory and increase volume purchase options the mmic is fabricated using phemt technology to provide exceptional low noise, gain and power performance. the backside of the chip is both rf and dc ground which helps simplify the assembly process and reduce assembly related performance variations and cost. chip size: 800 m x 2000m (31.5 x 78.74 mils) chip size tolerance: 10 m (0.4 mils) chip thickness: 100 10 m (4 0.4 mils) pad dimensions: 100 x 100 m (4 x 4 mils) attention:observe precautions for handling electrostaticsensitive devices. esd machine model (class a) esd human body model (class a) refer to avago application note a004r: electrostatic discharge damage and control
2 absolute maximum ratings [1] parameters / conditions symbol unit max drain to ground voltage vdd v 5.5 gate-drain voltage vgd v -8 drain current idd ma 200 gate bias voltage vg v +0.8 gate bias current ig ma 1 rf cw input power max pin dbm 15 max channel temperature tch c +150 storage temperature stg c -65 +150 maximum assembly temp tmax c 260 for 20s notes 1. operation in excess of any of these conditions may result in permanent damage to this device. the absolute maximum ratings for vdd, vgd, idd vg, ig and pin were determined at an ambient temperature of 25 c unless noted otherwise. dc specifcations/ physical properties [2] parameter and test condition symbol unit min typ max drain supply current (vd=4.0 v) idd ma 135 150 drain supply voltage vd v 3 4 5 gate bias current ig ma 0.1 gate bias voltage vg v -1.3 -0.95 -0.55 thermal resistance(3) jc c/w 35.1 2. ambient operational temperature ta=25 c unless noted 3. channel-to-backside thermal resistance (tchannel = 34 c) as measured using infrared microscopy. thermal resistance at backside temp. (tb) = 25 c calculated from measured data. ammc-6232 rf specifcations [4] t a = 25 c, vdd = 4.0 v, idd = 135ma, zo=50 ? parameters and test conditions symbol unit frequency (ghz) spec min typ max small signal gain (4) again db 20 23 32 26 23 26.7 31 23 24.6 noise figure into 50 w (4) nf db 20 3.2 4.5 26 3.3 4.5 31 4 4.5 output power at 1db gain compression (4) p1db dbm 20, 26, 31 15 20 output third order intercept point (4) oip3 dbm 20 26 28 26 26 28 31 26 27 isolation s12 db 20, 26, 31 -50 input return loss s11 db 20, 26, 31 -10 output return loss s22 db 20, 26, 31 -10 4. all tested parameters guaranteed with measurement accuracy 5dbm for opi3 and 2db for gain, nf and p1db.
3 ammc-6232 typical performance[1] (t a = 25 c, vdd=4v, idd=135ma, z in = z out = 50 ? , on-wafer unless noted) figure 1. small-signal gain 0 10 20 30 40 15 20 25 30 35 fr eq ue nc y (g hz ) s 21 (d b) -3 0 -2 0 -1 0 0 15 20 25 30 35 fr eq ue nc y (g hz ) s1 1 (d b) -2 0 -1 5 -1 0 -5 0 15 20 25 30 35 fr eq ue nc y (g hz ) s2 2 (d b) 0 1 2 3 4 5 18 20 22 24 26 28 30 32 fre que nc y (g hz ) no i sef ig ur e (d b) 5 10 15 20 18 20 22 24 26 28 30 32 fr e que nc y (g hz ) op 1d b (d bm ) 0 10 20 30 40 18 20 22 24 26 28 30 32 fr e que nc y (g hz ) oi p3 ( db m) figure 4. output p-1db figure 2. noise figure figure 3. input return loss note 1. noise figure is measured with a 3-db pad at the input . figure 5. output return loss figure 6. output ip3
ammc-6232 typical performance (cont) (t a = 25 c, vdd=4v, idd=135ma, z in = z out = 50 ? , on-wafer unless noted) figure 7. isolation -7 0 -6 0 -5 0 -4 0 -3 0 -2 0 15 20 25 30 35 fre que nc y (g hz ) s1 2 (d b) 0 10 20 30 40 15 20 25 30 35 fr eq ue n cy (g hz ) s 21 (d b) 4v 5v 3v -30 -20 -10 0 15 20 25 30 35 fr eq ue nc y (g hz ) s1 1 (d b) 4v 3v 5v 50 80 11 0 14 0 17 0 20 0 3 3 .5 4 4 .5 5 v dd (v ) id d (m a) 0 1 2 3 4 5 18 20 22 24 26 28 30 32 fr eq ue nc y (g hz ) no i sef ig ur e (d b ) 3v 4v 5v -30 -20 -10 0 15 20 25 30 35 fr e que nc y (g hz ) s 22 (d b) 4v 5v 3v figure 10. noise figure over vdd figure 8. idd over vdd (same vg) figure 9. small-signal gain over vdd figure 11. input return loss over vdd figure 12. output returrn loss over vdd
ammc-6232 typical performance (cont) (t a = 25 c, vdd=4v, idd=135ma, z in = z out = 50 ? , on-wafer unless noted) figure 13. output p1db over vdd 5 10 15 20 25 18 20 22 24 26 28 30 32 fr eq ue nc y (g hz ) op 1d b (d bm ) 3v 4v 5v 0 10 20 30 40 15 20 25 30 35 fr eq ue n cy (g hz ) s2 1 (d b) 25 c 85 c -4 0c -30 -20 -10 0 15 20 25 30 35 fr eq ue nc y (g hz ) s 11 (d b) 25c -4 0c 85c 0 10 20 30 40 18 20 22 24 26 28 30 32 fr eq ue nc y (ghz ) oi p3 ( db m) 3v 4v 5v 0 1 2 3 4 5 18 20 22 24 26 28 30 32 fre que nc y (g hz ) no is ef ig ur e (d b) -4 5c 25 c 85 c -30 -20 -10 0 15 20 25 30 35 fr eq ue nc y (g hz ) s2 2 (d b) 25c 85c - 40c figure 16. noise figure over temperature figure 14. output ip3 over vdd figure 15. small-signal gain over temperature figure 17. output p-1db over vdd figure 18. output ip3 over vdd
ammc-6232 typical s-parameters (t a = 25 c, vdd=4v, idd=135ma, z in = z out = 50 ? unless noted) freq s11 s21 s12 s22 mag db phase mag db phase mag db phase mag db phase 1.0 0.818 -1.746 -60.021 0.025 -31.992 -173.734 0.003 -49.134 72.088 0.954 -0.405 -72.004 3.0 0.804 -1.897 -116.721 0.014 -36.892 -107.504 0.002 -54.203 -170.740 0.590 -4.586 -135.849 5.0 0.887 -1.039 -156.457 0.002 -52.654 165.254 0.002 -52.786 169.502 0.836 -1.555 -171.399 7.0 0.899 -0.929 173.389 0.001 -61.276 178.332 0.002 -52.130 89.767 0.784 -2.113 157.037 9.0 0.886 -1.052 146.339 0.016 -35.917 -29.907 0.001 -64.067 -146.750 0.743 -2.583 136.088 11.0 0.777 -2.188 121.351 0.193 -14.294 -3.415 0.001 -58.094 -30.428 0.743 -2.575 110.111 13.0 0.735 -2.669 90.767 0.661 -3.593 -106.340 0.002 -55.057 41.432 0.661 -3.600 78.986 14.0 0.678 -3.381 71.345 1.397 2.907 -146.177 0.004 -49.054 -113.664 0.609 -4.312 62.630 15.0 0.638 -3.905 50.092 3.160 9.993 173.145 0.003 -51.286 12.903 0.547 -5.241 47.093 16.0 0.613 -4.256 22.797 7.829 17.874 127.412 0.003 -50.242 -7.415 0.496 -6.087 28.418 17.0 0.660 -3.612 -17.199 21.310 26.572 66.397 0.004 -48.669 132.091 0.448 -6.966 11.714 18.0 0.529 -5.528 -78.705 40.832 32.220 -25.727 0.002 -54.514 -150.466 0.385 -8.281 -4.471 18.5 0.406 -7.827 -102.424 41.585 32.379 -68.344 0.001 -56.637 -23.683 0.384 -8.305 -12.762 19.0 0.354 -9.008 -119.585 40.952 32.246 -103.547 0.002 -53.933 125.705 0.365 -8.753 -22.510 19.5 0.312 -10.119 -133.759 41.088 32.274 -134.623 0.004 -48.533 -99.868 0.359 -8.899 -30.282 20.0 0.290 -10.761 -151.887 41.954 32.455 -163.735 0.003 -50.000 -84.512 0.332 -9.567 -38.594 20.5 0.283 -10.954 -175.381 42.834 32.636 166.906 0.003 -51.175 101.027 0.321 -9.865 -53.085 21.0 0.268 -11.450 161.839 42.840 32.637 136.860 0.004 -47.869 -35.577 0.295 -10.589 -58.661 21.5 0.232 -12.699 147.124 41.949 32.455 108.907 0.003 -50.079 141.804 0.319 -9.931 -73.699 22.0 0.196 -14.174 120.747 40.151 32.074 80.907 0.004 -49.044 -66.647 0.305 -10.307 -75.111 22.5 0.142 -16.979 98.811 37.945 31.583 55.254 0.003 -51.053 -43.775 0.286 -10.877 -83.302 23.0 0.118 -18.530 74.852 35.378 30.975 30.342 0.003 -51.240 -54.194 0.268 -11.448 -92.687 23.5 0.094 -20.582 50.063 32.869 30.336 7.146 0.002 -53.496 -170.142 0.279 -11.087 -101.188 24.0 0.070 -23.065 33.219 30.641 29.726 -14.152 0.006 -44.954 125.867 0.258 -11.772 -103.724 24.5 0.082 -21.723 -23.615 29.175 29.300 -35.291 0.003 -51.886 59.279 0.283 -10.968 -109.636 25.0 0.086 -21.283 -48.577 27.913 28.916 -55.741 0.003 -50.720 -117.666 0.274 -11.231 -120.741 25.5 0.086 -21.326 -61.417 26.734 28.541 -76.327 0.002 -55.542 -174.291 0.267 -11.484 -134.054 26.0 0.086 -21.335 -72.999 25.441 28.111 -96.844 0.002 -53.122 129.172 0.252 -11.956 -141.622 26.5 0.100 -20.009 -85.033 24.006 27.607 -116.383 0.000 -70.458 -6.235 0.243 -12.272 -147.702 27.0 0.121 -18.335 -90.393 22.974 27.225 -135.333 0.002 -52.072 96.583 0.215 -13.349 -151.808 27.5 0.140 -17.079 -92.085 21.829 26.781 -153.561 0.002 -53.736 175.096 0.190 -14.435 -157.448 28.0 0.147 -16.671 -93.567 21.205 26.529 -171.261 0.003 -51.674 -150.054 0.180 -14.901 -169.765 28.5 0.168 -15.504 -104.424 20.735 26.334 170.769 0.006 -44.656 -42.304 0.169 -15.457 -174.716 29.0 0.184 -14.710 -106.694 20.656 26.301 152.609 0.003 -50.322 -50.809 0.164 -15.678 179.624 29.5 0.206 -13.734 -112.920 20.761 26.345 133.333 0.002 -55.781 -91.759 0.134 -17.439 169.927 30.0 0.217 -13.275 -114.467 20.431 26.206 114.454 0.002 -55.378 -142.825 0.095 -20.401 156.964 30.5 0.222 -13.092 -115.644 20.688 26.314 94.813 0.003 -51.486 97.286 0.097 -20.267 115.370 31.0 0.212 -13.457 -121.023 20.734 26.334 73.377 0.003 -51.134 116.486 0.093 -20.671 90.295 31.5 0.225 -12.964 -128.559 20.612 26.282 52.636 0.003 -51.287 -43.352 0.077 -22.279 45.612 32.0 0.246 -12.171 -130.429 20.304 26.152 31.050 0.001 -59.538 47.465 0.122 -18.257 4.816 33.0 0.289 -10.784 -129.264 19.283 25.703 -13.920 0.007 -42.943 -140.352 0.227 -12.866 -23.228 34.0 0.267 -11.479 -149.919 16.963 24.590 -60.335 0.006 -44.688 37.600 0.288 -10.820 -45.951 35.0 0.276 -11.175 -154.786 14.380 23.155 -106.453 0.003 -49.125 29.465 0.389 -8.194 -60.818 36.0 0.231 -12.724 -162.131 11.218 20.999 -153.267 0.003 -50.088 -115.073 0.414 -7.655 -71.849 37.0 0.215 -13.355 -179.755 8.435 18.522 161.897 0.003 -50.724 -89.514 0.502 -5.992 -87.410 38.0 0.218 -13.217 -179.314 6.181 15.821 120.672 0.006 -44.152 -113.404 0.547 -5.242 -93.971 39.0 0.162 -15.796 150.316 4.695 13.433 80.964 0.006 -44.523 10.595 0.582 -4.699 -105.709 40.0 0.188 -14.505 101.424 3.671 11.297 39.388 0.004 -47.382 -175.209 0.664 -3.554 -111.896 41.0 0.331 -9.592 20.449 2.964 9.438 -9.143 0.007 -43.734 -17.567 0.660 -3.604 -120.779 42.0 0.671 -3.471 -34.435 1.992 5.985 -70.226 0.005 -45.667 45.831 0.722 -2.826 -128.518 43.0 0.822 -1.701 -80.398 0.906 -0.862 -124.255 0.004 -48.650 77.675 0.735 -2.670 -132.437 44.0 0.744 -2.570 -102.406 0.350 -9.118 -164.509 0.012 -38.071 -38.925 0.768 -2.293 -143.230 45.0 0.745 -2.557 -120.374 0.146 -16.688 162.943 0.019 -34.517 -30.836 0.822 -1.706 -144.474 46.0 0.756 -2.425 -128.181 0.042 -27.587 142.437 0.014 -36.790 -116.379 0.778 -2.186 -154.332 47.0 0.698 -3.125 -138.988 0.039 -28.136 139.233 0.008 -41.590 4.635 0.870 -1.206 -160.348 48.0 0.716 -2.899 -145.786 0.018 -34.910 131.635 0.013 -37.614 -168.514 0.840 -1.514 -161.626 49.0 0.715 -2.916 -151.057 0.012 -38.392 -129.632 0.029 -30.658 148.528 0.856 -1.353 -170.390 50.0 0.748 -2.517 -163.929 0.020 -33.979 113.911 0.051 -25.798 -6.722 0.927 -0.657 -171.490 note: s-parameters are measured on wafer.
ammc-6232 application and usage biasing and operation the ammc-6232 is normally biased with a positive drain supply connected to the vd1 and vd2 pads through bypass capacitor as shown in figures 15 and 16. the recommended drain voltage and gate voltage for general usage is 4v and -0.95v respectively. with vdd=4v, vg=- 0.95v, the corresponding drain current is approximately 135ma. it is important to have at least 0.1upf bypass capacitor and the capacitor should be placed as close to the component as possible. aspects of the amplifer performance may be improved over a narrower bandwidth by application of additional conjugate, linearity, or low noise ( t opt) matching. after adjusting the gate bias to obtain 135ma at vdd = 4v, the ammc-6232 can be safely biased at vdd= 3v or 5v (while fxing the gate bias) as desired. at 4v, the performance is an optimal compromise between power consumption, gain and power/linearity. it is both applicable to be used as a low noise block or driver. at 3v, the amplifer is ideal as a front end low noise block where linearity is not highly required. at 5v, the amplifer can provide ~ 2db more output power for lo or transmitter driver applications where high output power and linearity are often required. the two gate voltages can be combined as shown in figure 15 or separated as in figure 16. combining the two gate voltages simplifes the usage whereas separating them provides fexibility to overall biasing scheme. in both cases, bonding wires at the input and output in the range of 0.15nh would likely improve the overall noise figure and input, output match at most frequencies. no ground wires are needed because ground connection is made with plated through-holes to the backside of the substrate. rf in pu t rf ou tp ut v d1 v d2 0. 1 uf capacito r to v dd dc supp ly am mc-623 2 to v ga te dc suppl y gold plated sh im (op tio nal ) to v dd d c suppl y rf i nput rf ou tput v d1 v d2 0.1 uf c apacito r am mc-623 2 to v g2 dc supply to v g1 dc supply figure 19. gate bias combined together figure 20. separated gate bias figure 21. simplifed high linearity lna schematic
assembly techniques the backside of the mmic chip is rf ground. for microstrip applications the chip should be attached directly to the ground plane (e.g. circuit carrier or heatsink) using electrically conductive epoxy [1,2] . for best performance, the topside of the mmic should be brought up to the same height as the circuit surrounding it. this can be accomplished by mounting a gold plated metal shim (same length as the mmic) under the chip which is of correct thickness to make the chip and adjacent circuit the same height. the amount of epoxy used for the chip or shim attachment should be just enough to provide a thin fllet around the bottom perimeter of the chip. the ground plane should be free of any residue that may jeopardize electrical or mechanical attachment. rf connections should be kept as short as reasonable to minimize performance degradation due to undesirable series inductance. a single bond wire is normally sufcient for signal connections, however double bonding with 0.7mil gold wire will reduce series inductance. gold thermo-sonic wedge bonding is the preferred method for wire attachment to the bond pads. the recommended wire bond stage temperature is 150c 2c. figure 22. bond pad locations caution should be taken to not exceed the absolute maximum rating for assembly temperature and time. the chip is 100um thick and should be handled with care. this mmic has exposed air bridges on the top surface and should be handled by the edges or with a custom collet (do not pick up the die with a vacuum on die center). bonding pads and chip backside metallization are gold. this mmic is also static sensitive and esd precautions should be taken notes: 1. ablebond 84-1 lmi silver epoxy is recommended. 2. eutectic attach is not recommended and may jeopardize reliability of the device. ordering information: AMMC-6232-W10 = 10 devices per tray ammc-6232-w50 = 50 devices per tray 0 0 410 800 0 875 1370 1510 2000 800 425 0 1600 650 130 1470 rfin rfout vd1 vd2 725 275 290 vg1 vg2 660 540 for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 200 -2008 avago technologies limited. all rights reserved. obsoletes av0-00en av02- 29 en - june 2, 2008
|
