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  features ? extremely small size (1.0 x 0.5 x 0.4 mm) ? 0402 industry standard footprint ? diff used optics ? operating temperature range of C40c to +85c ? compatible with ir soldering ? available in 6 colors ? available in 8 mm paper tape on 7" diameter reel ? reel sealed in zip locked moisture barrier bags applications ? lcd backlighting ? push button backlighting ? front panel indicator ? symbol backlighting ? keypad backlighting description the hsmx-c280 chipleds are designed to 0402 (1.0 x 0.5 mm) industry standard footprint. they are extremely small in size and the low 0.4 mm height makes them very suit- able for application in small portable hand held devices where real estate is a premium. six diff erent colors are available: green, red, yellow, amber, and deep red. all parts are color and inten- sity binned except red color. they come in 8 mm paper tape on a 7 inch diameter reel with 4000 units per reel which makes them compatible for automatic placement. device selection guide as alingap product number color package description HSMA-C280 amber untinted, diff used hsmc-c280 red untinted, diff used hsmt-c280 deep red untinted, diff used gap product number color package description hsmg-c280 green untinted, diff used hsms-c280 her untinted, diff used hsmy-c280 yellow untinted, diff used hsmx-c280 miniature chipled data sheet caution: hsmx-c280 leds are class 1a esd sensitive per jesd22-a114c.01. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details.
2 package dimensions notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. 1.0 (0.04) 0.16 (0.006) polarity cathode mark 0.4 (0.016) 0.30 (0.012) 0.25 (0.01) led die diffused epoxy pc board soldering terminal 0.5 (0.02) 0.4 (0.016) min. 0.30 (0.012) cathode line
3 absolute maximum ratings at t a = 25?c parameter hsma/c/t-c280 hsmg/s/y-c280 units dc forward current [1] 25 20 ma power dissipation 60 52 mw reverse voltage (i r = 100 a) 5 5 v led junction temperature 95 95 ?c operating temperature range C40 to +85 C40 to +85 ?c storage temperature range C40 to +85 C40 to +85 ?c soldering temperature see ir soldering profi le (figure 6 & 7) notes: 1. derate linearly as shown in figure 4. electrical characteristics at t a = 25?c forward voltage reverse breakdown capacitance c thermal v f (volts) v r (volts) (pf), v f = 0, resistance @ i f = 20 ma @ i r = 100 a f = 1 mhz r ? jCpin (?c/w) part number typ. max. min. typ. typ. HSMA-C280 1.9 2.4 5 11 300 hsmc-c280 1.9 2.4 5 15 300 hsmt-c280 1.9 2.4 5 45 300 hsmg-c280 2.2 2.6 5 9 250 hsms-c280 2.1 2.6 5 5 250 hsmy-c280 2.1 2.6 5 6 250 optical characteristics at t a = 25?c luminous color, viewing luminous intensity peak dominant angle effi cacy i v (mcd) wavelength wavelength 2 ? 1/2 ? v @ 20 ma [1] ? peak (nm) ? d [2] (nm) degrees [3] (lm/w) part number color min. typ. typ. typ. typ. typ. HSMA-C280 as amber 28.5 90 595 592 130 480 hsmc-c280 as red 28.5 90 637 626 130 155 hsmt-c280 as deep red 11.2 30 660 639 130 70 hsmg-c280 gap green 4.5 15 570 572 130 595 hsms-c280 her 2.8 10 630 626 130 145 hsmy-c280 gap yellow 2.8 8 589 586 130 500 notes: 1. the luminous intensity, i v , is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. the dominant wavelength, ? d , is derived from the cie chromatically diagram and represents the perceived color of the device. 3. ?? 1/2 is the off -axis angle where the luminous intensity is 1/2 the peak intensity.
4 note: 1. bin categories are established for classifi cation of products. products may not be available in all categories. please contact your avago representative for information on currently available bins. light intensity (iv) bin limits [1] intensity (mcd) bin id min. max. a 0.11 0.18 b 0.18 0.29 c 0.29 0.45 d 0.45 0.72 e 0.72 1.10 f 1.10 1.80 g 1.80 2.80 h 2.80 4.50 j 4.50 7.20 k 7.20 11.20 l 11.20 18.00 m 18.00 28.50 n 28.50 45.00 p 45.00 71.50 q 71.50 112.50 r 112.50 180.00 s 180.00 285.00 t 285.00 450.00 u 450.00 715.00 v 715.00 1125.00 w 1125.00 1800.00 x 1800.00 2850.00 y 2850.00 4500.00 tolerance: 15% note: 1. bin categories are established for classifi cation of products. products may not be available in all categories. please contact your avago representative for information on currently available bins. color bin limits [1] green color bins [1] dom. wavelength (nm) bin id min. max. a 561.5 564.5 b 564.5 567.5 c 567.5 570.5 d 570.5 573.5 e 573.5 576.5 tolerance: 1 nm. yellow/amber color bins [1] dom. wavelength (nm) bin id min. max. a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 tolerance: 1 nm.
5 figure 1b. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. figure 1a. relative intensity vs. wavelength. figure 4. maximum forward current vs. ambient temperature. figure 3. luminous intensity vs. forward current. 05 15 i f C forward current C ma 0 0.4 1.0 luminous intensity (normalized at 20 ma) 20 0.6 0.2 0.8 10 30 1.4 25 1.2 gap 0 0 20 60 80 100 5 i f max. C maximum forward current C ma t a C ambient temperature C c 40 15 30 10 20 gap 25 as alingap rq j-a = 600c/w 10 30 50 70 90 wavelength C nm relative intensity 1.0 0 650 725 575 500 0.8 0.6 0.4 0.2 525 550 600 625 675 700 her gap yellow gap green 100 10 1 0 1.5 1.7 1.9 2.1 2.3 v f C forward voltage C v i f C forward current C ma lpe green her 1.6 1.8 2.0 2.2 as alingap gap yellow 05 15 i f C forward current C ma 0 0.4 1.0 luminous intensity (normalized at 20 ma) 20 0.6 0.2 0.8 10 30 1.4 25 1.2 as amber as red and deep red figure 5. relative intensity vs. angle. relative intensity C % 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 20 30 50 70 90 -90 -20 -80 -60 -40 -10 10 40 60 80 100 90 80 70 60 50 40 30 20 10 0 wavelength - nm relative intensity - % 500 550 600 650 700 as amber as orange as red as deep red
6 figure 7. recommended pb-free refl ow soldering profi le. figure 8. recommended soldering pattern for hsmx-c280. figure 9. reeling orientation. 0.5 (0.02) 0.5 (0.02) 0.5 (0.02) 0.5 (0.02) fg 6. rcommndd o oldng o l. 230c max. 10 sec. max. 4c/sec. max. over 2 min. time temperature 4c/sec. max. 140-160c C3c/sec. m fg 10. rl dmnon. 217 c 200 c 60 - 120 sec. 6 c/sec. max. 3 c/sec. max. 3 c/sec. max. 150 c 255 - 260 c 100 sec. max. (acc. to j-std-020c) 10 - 30 sec. time temperature 10.50 1.0 (0.413 0.039) 59.60 1.00 (2.346 0.039) ? 20.20 min. (? 0.795 min.) 6 ps 178.40 1.00 (7.024 0.039) 3.0 0.5 (0.118 0.020) 4.0 0.5 (0.157 0.020) 5.0 0.5 (0.197 0.020) ? 13.1 0.5 (? 0.516 0.020) 8.0 1.0 (0.315 0.039) cathode side printed label user feed direction note: 1. all dimensions in millimeters (inches).
7 figure 11. tape dimensions. figure 12. tape leader and trailer dimensions. user feed direction 1.75 (0.069) carrier tape cover tape 4.00 (0.157) 1.50 (0.059) table 1 dimensions in millimeters (inches) dim. c (see table 1) cathode dim. a 0.10 ( 0.004) dim. b 0.10 ( 0.004) part number dim. c 0.10 ( 0.004) hsmx-c280 series 1.10 (0.043) 0.60 (0.024) 0.66 (0.026) dim. b (see table 1) 4.00 (0.157) 2.00 0.05 (0.079 0.002) 3.50 0.05 (0.138 0.002) 0.23 0.05 (0.009 0.002) 8.00 0.30 (0.315 0.012) dim. a (see table 1) end start there shall be a minimum of 160 mm (6.3 inch) of empty component punched paper tape sealed with cover tape. mounted with components there shall be a minimum of 160 mm (6.3 inch) of empty punched paper tape sealed with cover tape. minimum of 230 mm (9.05 inch) may consist of paper tape and/or cover tape. notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified.
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2012 avago technologies. all rights reserved. obsoletes 5989-0393en av02-0602en - february 3, 2012 refl ow soldering: for more information on refl ow soldering, refer to application note an-1060, surface mounting smt led indicator components. storage condition: 5 to 30c @ 60%rh max. baking is required before mounting, if: 1. humidity indicator card is > 10% when read at 23 5c. 2. device expose to factory conditions <30c/60%rh more than 672 hours. recommended baking condition: 605c for 20 hours.


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