july 2012 ? 2010 fairchild semiconductor corporation www.fairchildsemi.com fsusb63 ? rev. 1.0.4 fsusb63 C 3:1 high-speed usb 2.0 switch / multiplexer fsusb63 3:1 high-speed usb 2.0 switch / multiplexer features switch type 3:1 usb switch usb usb 2.0 high-speed & full-speed compliant break-before-make time 126s r on 6 ? typical c on 6pf typical bandwidth 830mhz v cc 2.7 to 4.4v v cntrl 0 to v cc operating temperature -40c to 85c i ccslp <1a i ccact 7.5a typical package 12- lead umlp 1.80 x 1.80 x 0.55mm, 0.40mm pitch top mark kg ordering information FSUSB63UMX applications ? cell phone, digital camera, notebook ? lcd monitor, tv, and set-top box ? netbook, mobile inte rnet device (mid) description the fsusb63 is a bi-directional, low-power, high-speed (hs) usb 2.0 3:1 multiplexer (mux). it is optimized for switching among three high-speed (480mbps) sources or any combination of high-speed and full-speed (12mbps) usb sources, such as an application processor, to one usb 2.0 connector. the fsusb63 has a break-before-make time to force re- enumeration by the host when switching between different hs usb 2.0 controllers and thus requires minimal software changes. the fsusb63 is compliant with the requirements of usb 2.0 and features extremely low on capacitance (c on ). the wide bandwidth exceeds the requirement to pass the third harmonic, resulting in signals with minimum edge and phase distortion. superior channel-to-channel crosstalk also minimizes interference. related resources ? for samples and questions, please contact: analog.switch@fairchildsemi.com . ? fsusb63 demonstration board typical application figure 1. analog symbol
? 2010 fairchild semiconductor corporation www.fairchildsemi.com fsusb63 ? rev. 1.0.4 10 fsusb63 C 3:1 high-speed usb 2.0 switch / multiplexer physical dimensions figure 18. 12-lead, ultrathin molded leadless package (umlp) ordering information part number top mark operating temperature range package FSUSB63UMX kg -40 to +85c 12-lead, quad, ultrathin molded leadless package (umlp), 1.8mm x 1.8mm x 0.55mm, 0.4mm pitch package drawings are provided as a service to customers considering fairchild component s. drawings may change in any manner wit hout notice. please note the revision and/or date on the drawing and contact a fairchild semi conductor representative to verify or o btain the most recent revision. package specific ations do not expand the terms of fairchild?s worldwide terms and conditi ons, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductor?s online packa ging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ . a b c seating plane recommended land pattern notes: a. package does not fully conform to jedec standard. b. dimensions are in millimeters. c. dimensions and tolerances per asme y14.5m, 1994. d. land pattern recommendation is based on fsc design only. e. drawing filename: mkt-umlp12arev4. scale : 2x lead option 1 scale : 2x lead option 2 detail a scale : 2x pin#1 ident top view bottom view 0.10 c 0.08 c 0.10 c 2x 2x side view 0.10 c 0.05 0.00 3 6 1 0.10 c a b 0.05 c 0.55 max. 12 1.80 1.80 0.40 0.25 0.15 (12x) 0.35 0.45 2.10 2.10 0.40 0.563 (11x) 0.20 (12x) 1 0.152 9 0.588 detail a pin#1 ident (11x) package edge 0.10 0.10 0.45 0.35 0.10
? 2010 fairchild semiconductor corporation www.fairchildsemi.com fsusb63 ? rev. 1.0.4 11 fsusb63 C 3:1 high-speed usb 2.0 switch / multiplexer
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