? 2008 california micro devices corp. all rights reserved. 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 1 issue b ? 06/23/08 cspemi202a 2 channel headset microphone em i filter with esd protection features ? two channels of emi filtering ? pi-style emi filters in a capacitor-resistor-capacitor (c-r-c) network ? greater than 40db attenuation at 1ghz ? 8kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) ? 15kv esd protection on each channel (hbm) ? supports bipolar signals?ideal for audio applications ? chip scale package features extremely low lead inductance for optimum filter and esd performance ? 5-bump, 0.930mm x 1.410mm footprint chip scale package (csp) ? rohs compliant (lead-free) finishing applications ? emi filtering and esd protection for headset microphone ports ? wireless handsets ? handheld pcs / pdas ? mp3 players ? digital camcorders ? notebooks ? desktop pcs product description the cspemi202a is a dual lo w-pass filter array inte- grating two pi-style filters (c-r-c) that reduce emi/rfi emissions while at the same time providing esd pro- tection. this part is custo m-designed to interface with a microphone port on a cellular telephone or similar device. each high quality filter provides more than 35db attenuation in the 800-2700 mhz range. these pi-style filters support bidire ctional filterin g, controlling emi both to and from a microphone element. they also support bipolar signals, enabling audio signals to pass through without distortion. in addition, the cspemi202a provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (esd). the diodes safely dissipate esd strikes of 8kv, the maximum requirement of the iec 61000-4-2 interna- tional standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the device provides protection for contact discharges to greater than 15kv. the cspemi202a is particula rly well-suited for porta- ble electronics (e.g., cellular telephones, pdas, note- book computers) because of its small package format and low weight. the cspemi2 02a is available in a space-saving, low-profile chip scale package with rohs compliant lead-free finishing. electrical schematic 68 47pf 47pf 68 c1 c3 a1 a3 b2 mic_out1 mic_out2 gnd mic_in2 mic_in1 47pf 47pf
? 2008 california micro devices corp. all rights reserved. 2 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com issue b ? 06/23/08 cspemi202a ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. pin descriptions pin name description a1 mic_in1 microphone input 1 (from microphone) a3 mic_in2 microphone input 2 (from microphone) b2 gnd device ground c1 mic_out1 microphone output 1 (to audio circuitry) c3 mic_out2 microphone output 2 (to audio circuitry) mic_in1 mic_in2 mic_out1 mic_out2 a1 a 3 c 3 c1 gnd b2 orient a tion m a rking a1 ad 2 3 1 c b a orient a tion m a rking package / pinout diagrams note: cspemi202a csp package top view bottom view (bumps down view) (bumps up view) 1) these drawings are not to scale. part numbering information bumps package ordering part number 1 part marking 5 csp CSPEMI202AG ad
? 2008 california micro devices corp. all rights reserved. 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 3 issue b ? 06/23/08 cspemi202a specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: clamping voltage is measured at the opposite side of the em i filter to the esd pin. for example, if esd is applied to pi n a1, then clamping voltage is measured at pin c1. note 4: these parameters are guaranteed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc power per resistor 100 mw dc package power rating 200 mw standard operating conditions parameter rating units operating temperature range -40 to +85 c electrical operat ing characteristics 1 symbol parameter conditions min typ max units r 1 resistance 61 68 75 c 1 capacitance 38 47 56 pf i leak diode leakage current v in =5.0v 1.0 a v sig signal voltage positive clamp negative clamp i load = 10ma 5 -15 7 -10 15 -5 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 notes 2 and 4 15 8 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv positive transients negative transients notes 2, 3 and 4 +15 -19 v v f c cut-off frequency z source = 50 , z load = 50 r = 68 , c = 47pf 60 mhz
? 2008 california micro devices corp. all rights reserved. 4 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com issue b ? 06/23/08 cspemi202a performance information typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 1. insertion loss vs. frequency (a1-c1 to gnd b2) figure 2. insertion loss vs. frequency (a3-c3 to gnd b2)
? 2008 california micro devices corp. all rights reserved. 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 5 issue b ? 06/23/08 cspemi202a application information refer to application note ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 3. recommended non-solder mask defined pad illustration figure 4. lead-free (snagcu) solder ball reflow profile printed circuit bo ard recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (las er cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous (183c) 60 seconds maximum soldering temperature 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2008 california micro devices corp. all rights reserved. 6 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com issue b ? 06/23/08 cspemi202a mechanical details csp mechanical specifications the cspemi202a is available in a custom chip scale package (csp). dimensions are presented below. for complete information on cm d?s chip scale packaging, see the california micro devices csp package infor- mation document. package dimensions for cspemi202a chip scale package csp tape and reel specifications figure 5. tape and reel mechanical data package dimensions package custom csp bumps 5 dim millimeters inches min nom max min nom max a1 0.885 0.930 0.975 0.0348 0.0366 0.0384 a2 1.365 1.410 1.455 0.0537 0.0555 0.0573 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.165 0.215 0.265 0.0065 0.0085 0.0104 c2 0.220 0.270 0.320 0.0087 0.0106 0.0126 d1 0.562 0.606 0.650 0.0221 0.0239 0.0256 d2 0.356 0.381 0.406 0.0140 0.0150 0.0160 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a b c 12 c1 b1 a1 b3 c2 dimensions in millimeters d1 d2 a2 bottom view side view 3 b2 b4 0.30 dia. solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cspemi202a 1.41 x 0.93 x 0. 606 1.52 x 1.07 x 0.72 8mm 178mm (7") 3500 4mm 4mm to p for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o +++
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