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  this is information on a product in full production. may 2012 doc id 15755 rev 2 1/10 10 x00619 0.8 a sensitive gate scr datasheet ? production data features i t(rms) = 0.8 a v drm , v rrm = 600 v i gt = 30 to 200 a applications limited gate current topologies ground fault circuit interrupters overvoltage crowbar protection in power supplies protection in electronic ballasts capacitive discharge ignitions ignitors (lighting, oven...) description the x006 scr can be used as on/off function in applications where topology does not offer high current for gate triggering. this device is optimized in forward voltage drop and inrush current capab ilities for reduced power losses and high reliabilit y in harsh environments. table 1. device summary i t(rms) 0.8 a v drm / v rrm 600 v i gt 30 to 200 a a k g to-92 x00619-ma a k g a a k g sot-223 x00619mn www.st.com
characteristics x00619 2/10 doc id 15755 rev 2 1 characteristics table 2. absolute ratings (limiting values, t j = 25 c unless otherwise specified) symbol parameter value unit i t(rms) on-state rms current (180 conduction angle) to-92 t l = 83 c 0.8 a sot-223 t c = 107 c it (av) average on-state current (180 conduction angle) to-92 t l = 83 c 0.5 a sot-223 t c = 107 c i tsm non repetitive surge peak on-state current t p = 8.3 ms t j = 25 c 10 a t p = 10 ms 9 i 2 ti 2 t value for fusing t p = 10 ms t j = 25 c 0.4 a 2 s di/dt critical rate of rise of on-state current i g = 2 x i gt , t r 100 ns f = 60 hz t j = 125 c 50 a/s i gm peak gate current t p = 20 s t j = 125 c 1 a p g(av) average gate power dissipation t j = 125 c 0.1 w t stg t j storage junction temperature range operating junction temperature range - 40 to + 150 - 40 to + 125 c table 3. electrical characteristics (t j = 25 c unless otherwise specified) symbol test conditions value unit i gt v d = 12 v, r l = 140 min. 30 a max. 200 v gt 0.8 v v gd v d = v drm, r l = 3.3 k , r gk = 1 k t j = 125 c min. 0.2 v v rg i rg = 10 a min. 5 v i h i t = 50 ma, r gk = 1 k max. 5 ma i l i g = 1 ma, r gk = 1 k max. 6 ma dv/dt v d = 67% v drm, r gk = 1 k t j = 125 c min. 40 v/s table 4. static electrical characteristics symbol test conditions value unit v tm i tm = 1 a, t p = 380 s t j = 25 c max 1.35 v v to threshold voltage t j = 125 c 0.85 v r d dynamic resistance 245 m i drm i rrm v drm = v rrm, r gk = 1 k t j = 25 c 1 a t j = 125 c 100 a
x00619 characteristics doc id 15755 rev 2 3/10 table 5. thermal resistances symbol parameter value unit r th(j-l) junction to leads (dc) to-92 max. 70 c/w r th(j-c) junction to case (dc) sot-223 30 r th(j-a) junction to ambient (dc) to-92 150 s = 5 cm 2 sot-223 60 figure 1. maximum average power dissipation versus average on-state current figure 2. average and dc on-state current versus case temperature (sot-223) p(w) 0.0 0.2 0.4 0.6 0.0 0.1 0.2 0.3 0.4 0.5 0.6 dc i (a) t(av) 360 = 30, 60, 90, 120, 180, dc i (a) t(av) 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 sot-223 t (c) l = 30, 60, 90, 120, 180, dc figure 3. average and dc on-state current versus lead temperature (to-92) figure 4. average and dc on-state current versus ambient temperature (free air convection) i (a) t(av) 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 to-92 t (c) l = 30, 60, 90, 120, 180, dc i (a) t(av) 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 to-92 s cu = 0.5 cm2 t (c) amb = 180 dc sot-223 s cu = 5 cm2
characteristics x00619 4/10 doc id 15755 rev 2 figure 5. relative variation of thermal impedance junction to ambient versus pulse duration figure 6. relative variation of gate trigger, holding and latching current versus junction temperature z/r th(j-a) th(j-a) 0.01 0.10 1.00 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 1.0e+03 sot-223 s cu = 5 cm2 to-92 s cu = 0.5 cm2 t (s) p i,i,i[t] / gthl j i ,i ,i [t =25c] gthl j 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 -40 -20 0 20 40 60 80 100 120 i gt i h and i l typical values t (c) j figure 7. relative variation of holding current versus gate-cathode resistance (typical values) figure 8. relative variation of dv/dt immunity versus gate-cathode resistance (typical values) i [r ] / i [ =1k ] hgk h r gk 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 r(k) gk dv/dt[r ] / dv/dt[ =1k ] gk r gk 0.1 1.0 10.0 100.0 1.0e-01 1.0e+00 1.0e+01 v d = 0.67xv drm r(k) gk figure 9. relative variation of dv/dt immunity versus gate-cathode capacitance (typical values) figure 10. surge peak on-state current versus number of cycles dv/dt[c ] / dv/dt[ =1k ] gk r gk 1 10 100 1 10 v d = 0.67xv drm r gk = 1 k c (nf) gk 0 1 2 3 4 5 6 7 8 9 10 1 10 100 1000 non repetitive t j initial=25 c repetitive t l = 25 c one cycle tp=10ms number of cycles i (a) tsm
x00619 characteristics doc id 15755 rev 2 5/10 figure 13. thermal resistance junction to ambient versus copper surface under tab (sot-223) figure 11. non repetitive surge peak on state current for a sinusoidal pulse and corresponding value of i 2 t figure 12. on-state characteristics (maximum values) i (a), i t (a s) tsm 22 0 1 10 100 0.01 0.10 1.00 10.00 i tsm i2t t j initial=25 c t(ms) p i (a) tm 0.1 1.0 10.0 0.5 1.0 1.5 2.0 2.5 3.0 t j max v to =0.85 v r d =245 m t j =125 c t j =25 c v (v) tm r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 epoxy printed circuit board fr4 copper thickness = 35 m s(cm2)
ordering information scheme x00619 6/10 doc id 15755 rev 2 2 ordering information scheme figure 14. ordering information scheme x 006 19 m a 1aa2 sensitive scr series sensitivity voltage package package current 006 = 0.8 a 2al2 = ammopac k (to-92) 5al2 = tape and reel (to-92 and sot-223) 19 = 30 a to 200 a m = 600 v a = to-92 n = sot-223 1aa2 = bulk (to-92)
x00619 package information doc id 15755 rev 2 7/10 3 package information epoxy meets ul94, v0 lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 6. to-92 (plastic) dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a - 1.35 - - 0.053 - b - - 4.70 - - 0.185 c - 2.54 - - 0.100 - d 4.40 - - 0.173 - - e 12.70 - - 0.500 - - f - - 3.70 - - 0.146 a - - 0.50 - - 0.019 a f c b a de
package information x00619 8/10 doc id 15755 rev 2 figure 15. sot-223 footprint table 7. sot-223 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a1.800.071 a1 0.02 0.10 0.001 0.004 b 0.60 0.70 0.85 0.024 0.027 0.033 b1 2.90 3.00 3.15 0.114 0.118 0.124 c 0.24 0.26 0.35 0.009 0.010 0.014 d (1) 1. do not include mold flash or protrusions. mold flas h or protrusions shall not exceed 0.15mm (0.006inches) 6.30 6.50 6.70 0.248 0.256 0.264 e 2.3 0.090 e1 4.6 0.181 e (1) 3.30 3.50 3.70 0.130 0.138 0.146 h 6.70 7.00 7.30 0.264 0.276 0.287 v 10 max a a1 e1 d b1 h e e 12 4 3 b v c 3.25 1.32 7.80 5.16 1.32 2.30 0.95
x00619 ordering information doc id 15755 rev 2 9/10 4 ordering information 5 revision history table 8. ordering information order code marking package weight base qty delivery mode X00619MA1AA2 x0619 ma to-92 0.2 g 2500 bulk x00619ma2al2 2000 ammopack x00619ma5al2 2000 tape and reel x00619mn5al2 x0 619 mn sot-223 0.12 g 1000 table 9. document revision history date revision changes 26-may-2009 1 first issue 03-may-2012 2 added sot-223 package.
x00619 10/10 doc id 15755 rev 2 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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