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data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. photocoupler ps2815-1,ps2815-4 low (ac) input current, high ctr 4, 16-pin ssop photocoupler ? nepoc series ? the mark ? shows major revised points. document no. pn10256ej02v0ds (2nd edition) date published april 2005 cp(k) printed in japan ? nec compound semiconductor devices, ltd. 2000, 2005 description the ps2815-1 and ps2815-4 are opt ically coupled isolators containing gaas light emitting diodes and an npn silicon phototransistor in a plasti c ssop for high density applications. the package is a small sop (small outline pack age) type for high density mounting applications. features ? ac input response high current transfer ratio (ctr = 200% typ. @ i f = 1 ma) high isolation voltage (bv = 2 500 vr.m.s.) small and thin package (4, 16-pin ssop, pin pitch 1.27 mm) ordering number of tape product: ps2815-1-f3, f4, ps2815-4-f3, f4 pb-free product safety standards: ps2815-1, -4 ul approved: file no. e72422 din en60747-5-2 (vde0884 pa rt2) approved (option) applications programmable logic controllers modem/fax 4 3 1 2 1. anode, cathode 2. cathode, anode 3. emitter 4. collector 12345678 16 15 14 13 12 11 10 9 1. 3. 5. 7. anode, cathode 2. 4. 6. 8. cathode, anode 9. 11. 13. 15. emitter 10. 12. 14. 16. collector pin connection (top view) ps2815-1 ps2815-4
data sheet pn10256ej02v0ds 2 ps2815-1,ps2815-4 package dimensions (unit: mm) m 0.12 1.27 0.10.1 0.10.1 4.4 7.00.3 0.50.3 0.15 +0.10 ?0.05 1.27 2.70.3 43 12 10.30.3 18 16 9 ps2815-1 ps2815-4 m 0.12 4.4 7.00.3 0.50.3 0.15 +0.10 ?0.05 2.0 +0.3 ?0.2 0.40.1 0.40.1 2.00.1 marking example 15 401 assembly lot 4 01 week assembled year assembled (last 1 digit) last number of type no. : 15 ps2815-1 n 4 01 country assembled assembly lot *1 no. 1 pin mark ps2815-4 ps2815-4 n 401 *1 week assembled year assembled (last 1 digit) ctr rank code *1 for the external plating pb-free product, l is indicated at the second digit of the rank. *1 for external plating pb-free products, perform marking to indicate that these are pb-free products. type number
data sheet pn10256ej02v0ds 3 ps2815-1,ps2815-4 ordering information part number order number solder plating specification packing style safety standard approval application part number *1 ps2815-1 ps2815-1 solder 50 pcs (tape 50 pcs cut) standard products ps2815-1 ps2815-1-f3 ps2815-1-f3 contains lead embo ssed tape 3 500 pcs/reel (ul approved) ps2815-1-f4 ps2815-1-f4 ps2815-1-v ps2815-1-v 50 pcs (tape 50 pcs cut) din en60747-5-2 ps2815-1-v-f3 ps2815-1-v-f3 embossed tape 3 500 pcs/reel (vde0884 part2) ps2815-1-v-f4 ps2815-1-v-f4 approved (option) ps2815-4 ps2815-4 magazine case 45 pcs standard products ps2815-4 ps2815-4-f3 ps2815-4-f3 embossed tape 2 500 pcs/reel (ul approved) PS2815-4-F4 PS2815-4-F4 ps2815-4-v ps2815-4-v magazine case 45 pcs din en60747-5-2 ps2815-4-v-f3 ps2815-4-v-f3 embossed tape 2 500 pcs/reel (vde0884 part2) ps2815-4-v-f4 ps2815-4-v-f4 approved (option) ps2815-1 ps2815-1-a pb-free 50 pcs (tape 50 pcs cut) standard products ps2815-1 ps2815-1-f3 ps2815-1-f3-a embossed tape 3 500 pcs/reel (ul approved) ps2815-1-f4 ps2815-1-f4-a ps2815-1-v ps2815-1-v-a 50 pcs (tape 50 pcs cut) din en60747-5-2 ps2815-1-v-f3 ps2815-1-v-f3-a embossed tape 3 500 pcs/reel (vde0884 part2) ps2815-1-v-f4 ps2815-1-v-f4-a approved (option) ps2815-4 ps2815-4-a magazine case 45 pcs standard products ps2815-4 ps2815-4-f3 ps2815-4-f3-a embossed tape 2 500 pcs/reel (ul approved) PS2815-4-F4 PS2815-4-F4-a ps2815-4-v ps2815-4-v-a magazine case 45 pcs din en60747-5-2 ps2815-4-v-f3 ps2815-4-v-f3-a embossed tape 2 500 pcs/reel (vde0884 part2) ps2815-4-v-f4 ps2815-4-v-f4-a approved (option) *1 for the application of the safety st andard, following part number should be used.
data sheet pn10256ej02v0ds 4 ps2815-1,ps2815-4 absolute maximum ratings (unless otherwise specified, t a = 25 c) ratings parameter symbol ps2815-1 ps2815-4 unit diode forward current (dc) i f 50 ma power dissipation derating ? p d / c 0.6 0.7 mw/ c power dissipation p d 60 70 mw/ch peak forward current *1 i fp 1.0 a transistor collector to emitter voltage v ceo 40 v emitter to collector voltage v eco 5 v collector current i c 40 ma/ch power dissipation derating ? p c / c 1.2 mw/ c power dissipation p c 120 mw/ch isolation voltage *2 bv 2 500 vr.m.s. operating ambient temperature t a ? 55 to +100 c storage temperature t stg ? 55 to +150 c *1 pw = 100 s, duty cycle = 1% *2 ac voltage for 1 minute at t a = 25 c, rh = 60% between input and output. pins 1-2 shorted together, 3- 4 shorted together (ps2815-1). pins 1-8 shorted together, 9- 16 shorted together (ps2815-4).
data sheet pn10256ej02v0ds 5 ps2815-1,ps2815-4 electrical characteristics (t a = 25 c) parameter symbol conditions min. typ. max. unit diode forward voltage v f i f = 5 ma 1.15 1.4 v terminal capacitance c t v = 0 v, f = 1 mhz 30 pf transistor collector to emitter dark current i ceo i f = 0 ma, v ce = 40 v 100 na coupled current transfer ratio (i c /i f ) ctr i f = 1 ma, v ce = 5 v 100 200 400 % collector saturation voltage v ce (sat) i f = 1 ma, i c = 0.2 ma 0.3 v isolation resistance r i-o v i-o = 1 kv dc 10 11 ? isolation capacitance c i-o v = 0 v, f = 1 mhz 0.4 pf rise time *1 t r v cc = 5 v, i c = 2 ma, r l = 100 ? 4 s fall time *1 t f 5 *1 test circuit for switching time v cc v out i f r l = 100 ? 50 ? pulse input in monitor pw = 100 s duty cycle = 1/10
data sheet pn10256ej02v0ds 6 ps2815-1,ps2815-4 typical characteristics (unl ess otherwise specified, t a = 25 c) ambient temperature t a (?c) diode power dissipation p d (mw) diode power dissipation vs. ambient temperature ambient temperature t a (?c) transistor power dissipation p c (mw) transistor power dissipation vs. ambient temperature ambient temperature t a (?c) forward current i f (ma) forward current vs. ambient temperature collector to emitter voltage v ce (v) collector current i c (ma) collector current vs. collector to emitter voltage ambient temperature t a (?c) collector to emitter dark current i ceo (na) collector to emitter dark current vs. ambient temperature collector saturation voltage v ce(sat) (v) collector current i c (ma) collector current vs. collector saturation voltage 140 100 120 40 60 80 20 25 50 75 100 125 0 100 10 1 0.1 0.01 0.0 0.5 1.0 1.5 2.0 0?c ?25?c ?50?c +60?c +25?c t a = +100?c 68 4 2 010 25 20 15 10 5 10 ma 5 ma 2 ma 1 ma 0.5 ma ?25 0 25 50 75 100 1 10 100 1 000 10 000 v ce = 20 v 40 v 0.1 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 2 ma 5 ma 10 ma 1 ma i f = 0.5 ma i f = 20 ma 80 40 60 20 0 25 50 75 100 0.7 mw/?c 0.6 mw/?c ps2815-4 ps2815-1 remark the graphs indicate nominal characteristics.
data sheet pn10256ej02v0ds 7 ps2815-1,ps2815-4 frequency response frequency f (khz) normalized gain gv long term ctr degradation time (hr) ctr (relative value) forward current i f (ma) current transfer ratio ctr (%) current transfer ratio vs. forward current normalized to 1.0 at t a = 25?c, i f = 1 ma, v ce = 5 v ambient temperature t a (?c) normalized current transfer ratio ctr normalized current transfer ratio vs. ambient temperature switching time t ( s) load resistance r l (k ?) switching time vs. load resistance load resistance r l (k ?) switching time vs. load resistance switching time t ( s) 1.2 1.4 ?50 1.0 0.8 0.6 0.4 0.2 0.0 ?25 025 50 75 100 100 10 1 0.1 10 k 1 k 100 10 i c = 2 ma, v cc = 5 v, ctr = 200% 0 ?5 ?10 ?15 ?20 ?25 0.1 1 10 100 1 000 100 ? 300 ? r l = 1 k ? 1.2 1.0 0.8 0.6 0.4 0.2 0 10 2 10 3 10 4 10 5 10 6 10 t a = 25?c 60?c i f = 1 ma 0.1 1 10 100 0 100 200 300 400 500 t f t r t d t s 0.1 1 10 100 1 000 i f = 1 ma, v cc = 5 v, ctr = 200% 100 1k 10 k 100 k t f t s t r t d v ce = 5 v, n = 2 sample a b remark the graphs indicate nominal characteristics.
data sheet pn10256ej02v0ds 8 ps2815-1,ps2815-4 taping specifications (unit: mm) outline and dimensions (reel) packing: 3 500 pcs/reel 2.00.5 r 1.0 13.00.2 21.00.8 tape direction ps2815-1-f3 ps2815-1-f4 outline and dimensions (tape) 1.550.1 4.00.1 2.00.1 4.00.1 1.750.1 2.8 max. 7.550.1 0.3 7.50.1 16.00.3 2.850.1 2.30.1 1.5 +0.1 ?0 3302.0 1001.0 2.0 0.5 15.9 to 19.4 outer edge of flange 21.51.0 17.51.0 15 401 15 401 15 401 15 401 15 401 15 401 15 401 15 401 15 401 15 401
data sheet pn10256ej02v0ds 9 ps2815-1,ps2815-4 tape direction ps2815-4-f3 PS2815-4-F4 outline and dimensions (reel) packing: 2 500 pcs/reel 2.00.5 r 1.0 13.00.2 21.00.8 outline and dimensions (tape) 1.550.1 12.00.1 2.00.1 4.00.1 1.750.1 16.00.3 8.30.1 2.8 max. 10.70.1 0.3 2.30.1 7.50.1 1.5 +0.1 ?0 3302.0 1001.0 2.0 0.5 15.9 to 19.4 outer edge of flange 21.51.0 17.51.0
data sheet pn10256ej02v0ds 10 ps2815-1,ps2815-4 notes on handling 1. recommended soldering conditions (1) infrared reflow soldering peak reflow temperature 260 c or below (package surface temperature) time of peak reflow temperature 10 seconds or less time of temperature higher than 220 c 60 seconds or less time to preheat temperature from 120 to 180 c 120 30 s number of reflows three flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) 12030 s (preheating) 220?c 180?c package surface temperature t (?c) time (s) recommended temperature profile of infrared reflow (heating) to 10 s to 60 s 260?c max. 120?c (2) wave soldering temperature 260 c or below (molten solder temperature) time 10 seconds or less preheating conditions 120 c or below (package surface temperature) number of times one (allowed to be dipped in solder including plastic mold portion.) flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (3) soldering by soldering iron peak temperature (l ead part temperature) 350 c or below time (each pins) 3 seconds or less flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (a) soldering of leads should be made at the poi nt 1.5 to 2.0 mm from the root of the lead. (b) please be sure that the temperatur e of the package woul d not be heated over 100 c.
data sheet pn10256ej02v0ds 11 ps2815-1,ps2815-4 (4) cautions fluxes avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. cautions regarding noise be aware that when voltage is applied suddenly bet ween the photocoupler?s i nput and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. usage cautions 1. protect against static electricity when handling. 2. avoid storage at a high te mperature and high humidity.
data sheet pn10256ej02v0ds 12 ps2815-1,ps2815-4 when the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the au thority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license . m8e 00. 4 - 0110 the information in this document is current as of april, 2005. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above).
nec compound semiconductor devices hong kong limited e-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-0 fax: +49-211-6503-1327 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0406 nec compound semiconductor devices, ltd. http://www.ncsd.necel.com/ e-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) sales division tel: +81-44-435-1588 fax: +81-44-435-1579 for further information, please contact ps2815-1,ps2815-4 caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. follow related laws and ordinanc es when disposing of the produc t. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (wit h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industria l waste and household garbage, and ensure that the product is controlled (as industria l waste subject to special c ontrol) up until final disposal. do not burn, destroy, cut, crush, or chemically di ssolve the product. do not lick the product or in any way allow it to enter the mouth.

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