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    maruwa g eneral catalog emi filters  132  

   
      the dlm series smd compound emi filters that combined high current chip ferrite bead inductors, multilayer ceramic capacitors w ith large capacitance or multilayer chip varistors. constructing in compact size, high performance smd compound emi filter achieved the r eduction in mounting area and further noise reduction or absorption of surge. ? compact and achieve large allowable current, and can be used for dc power supply line. ? the  style circuit ,reduction noise over a wide range. ? varistor combined type, absorption of switching surge and electrostatic surge for relays. ? the gold-plated termination ensures excellent solder heat resistance and solderability. ? rohs compliant.  features ? notebook pc, digital appliance, dc power supply line of oa machinery. ? as for robot, fa machinery, it is dc power supply line of industrial use electronics.  applications  appearance  equivalent circuit  insertion loss part number dlm01-01 dlm01-02 dlm01-03 dlm02-01 dlm02-02 dlm03-01 dlm03-02 dlm03-03  part number list and specifications rated voltage dc(v) 16v 25v 50v 16v 25v 16v 25v 50v rated current dc(a) 3.5a 3.5a 3.5a 3.5a 3.5a 7.0a 7.0a 7.0a varistor voltage v1ma(v) 27v 33v maximum peak current 8/20  s (a) 160a 160a maximum clamping voltage (v) 50v 60v         dlm01,03 dlm02 (varistor combined type) 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 100 1000 0 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 100 1000 dlm02-01 dlm02-02 dlm01-01,dlm01-03 dlm01-02 dlm01 dlm02 insertion loss (db) insertion loss (db) frequency (mhz) frequency (mhz)  dimensions 0.8 7.8  0.3  5fsnjobm !" "'*, 2.9  0.2 4.8  0.3 1.4 1.0 5.6  0.3
  maruwa general catalog  emi filters 133  

   
      preheating over 3 min. over 1 min. within 10 sec. 200 250 150 100 50 220~240 c 5pqtjef  bottom side taping package qty. taping specifications (tape material:plastic) type taping qty. package qty. 1,000pcs/reel tray qty. minimum unit maximum qty. 100pcs 1,000pcs reflow soldering recommended conditions 3.2 4.8 8.4 5.0 2.0 ? ? ? ? in(+) out (-) copper foil  35  m resist ??? :termination number unit:mm, dimensions tolerance ? 0.1mm copper foil thickness : 35  m ground 2.0 ground 5.6 8.4 0.4max  1.5 4.0 with components mounted 16.0 7.5 1.75 tape drawer direction 8.0 3.5max maruwa dlm maruwa dlm maruwa dlm maruwa dlm maruwa dlm maruwa dlm  7 . 0 ?  unit : mm soldering 1.basic design recommended land pattern. please use both side of p.c.b. uispvhiipmf connected to top side matters that required attention please pay attention to the following points when soldering on a print board. (1) please use every termination and take ground as largely as possible. (the parts may not perform well depending on how the ground is taken.) (2) please wire it so that a ground of circuit side (termination ) is not connected to a ground of power side (termination ) in other parts either. for soldering, please perform a temperature pattern of the right note for reference. please do not perform heating more than 240 degrees celsius 10 seconds. i received the internal joining, but i melt, and such as a short circuit, opening, a gap of a case may occur. this part is the lead-free correspondence kind that i received. ( c) temperature gradual cooling at room temperature round feed hole


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