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| h i g h i n p u t v o l t a g e , l o w q u i e s c e n t c u r r e n t , 1 5 0 m a l d o r e g u l a t o r c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . wide input voltage range: 5.4v to 25v ultra low ground current: 10 m a high output accuracy: 2.5% excellent load/line transient low dropout voltage: 750mv @ 150ma fixed output voltages for 5v/3.3v or adjustable voltage built-in current-limit protection built-in over-temperature protection zero shutdown current internal soft-start function por scheme to prevent vout spike sot-23-5, sot-89, and sop-8p packages lead free and green devices available (rohs compliant) f e a t u r e s a p p l i c a t i o n s g e n e r a l d e s c r i p t i o n the apl5155 is a low ground current linear regulator, which operates with input voltage from 5.4v to 25v and delivers output current up to 150ma. typical dropout volt- age is only 750mv at 150ma loading. this combination of the high voltage and the low ground current makes the apl5155 ideal for usb and portable devices, using 2- cell or 3-cell li-ion battery inputs. the apl5155 is stable with aluminum, tantalum, and ceramic capacitors. it requires a 1 m f or greater capacitor for stability. the apl5155 has many protection functions, including over-temperature, current-limit and short circuit current limit protections, which prevent the device from thermal over-load and current over-load. the apl5155 regulator is available in miniature sot-23- 5, sot-89, and sop-8p packages. usb power supply keep-alive supply in notebook and portable computers logic supply for high-voltage batteries battery powered systems p i n c o n f i g u r a t i o n vout nc nc nc/adj 1 2 3 4 vin gnd nc en 8 7 6 5 = thermal pad (connected to gnd plane for better heat dissipation) sop-8p (top view) en 3 4 nc/adj vin 1 gnd 2 5 vout sot-23-5 (top view) v in v out gnd 2 1 3 tab : vin sot-89 (top view)
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 2 o r d e r i n g a n d m a r k i n g i n f o r m a t i o n n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 d f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) . symbol parameter rating unit v in , v en vin, en to gnd voltage - 0.3 to 27 v v out , v adj vout, adj to gnd voltage - 0.3 to 27 v t j maximum junction temperature 150 o c t stg storage temperature - 65 to 150 o c t sdr maximum lead soldering temperature , 10 seco nds 26 0 o c a b s o l u t e m a x i m u m r a t i n g s ( n o t e 1 ) t h e r m a l c h a r a c t e r i s t i c s symbol parameter typical value unit q ja thermal resistance - junction to ambient (note 2) sot - 23 - 5 sot - 89 sop - 8p 235 180 50 o c /w q jc thermal resistance - junction to ambient (note 2) sot - 23 - 5 sot - 89 sop - 8p 130 38 20 o c /w note 2: q ja is measured with the component mounted on a high effective thermal conductivity test board in free air. n o t e 1 : s t r e s s e s b e y o n d t h o s e l i s t e d u n d e r " a b s o l u t e m a x i m u m r a t i n g s " m a y c a u s e p e r m a n e n t d a m a g e t o t h e d e v i c e . t h e s e a r e s t r e s s r a t i n g s o n l y a n d f u n c t i o n a l o p e r a t i o n o f t h e d e v i c e a t t h e s e o r a n y o t h e r c o n d i t i o n s b e y o n d t h o s e i n d i c a t e d u n d e r " r e c o m - m e n d e d o p e r a t i n g c o n d i t i o n s " i s n o t i m p l i e d . e x p o s u r e t o a b s o l u t e m a x i m u m r a t i n g c o n d i t i o n s f o r e x t e n d e d p e r i o d s m a y a f f e c t d e v i c e r e l i a b i l i t y . package code b : sot-23-5 d : sot-89 ka : sop-8p operating ambient temperature range i : -40 to 85 o c handling code tr : tape & reel voltage code 33 : 3.3v 50 : 5.0v blank : adjustable version assembly material g : halogen and lead free device apl5155 handling code temperature range package code apl5155 b : x - date code assembly material apl5155 d : xxxxx - date code apl5155 xxxxx apl5155 ka : xxxxx - date code apl5155 xxxxx l55x voltage code apl5155 33b : x - date code ; r - 3.3v 55rx apl5155 50b : x - date code ; z - 5.0v 55zx c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 3 r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s ( n o t e 3 ) symbol parameter range unit v in vin to gnd voltage 5.4 to 25 v i out vout source current 0 to 150 ma v out adjustable output voltage 1.24 to 20 v v en en pin input voltage 0 to 25 v c out output capacitance 1 to 4.7 m f esr the esr of output capacitance 5 to 50 m w t a ambient temperature - 40 to 85 o c t j junction temperature - 40 to 125 o c n o t e 3 : r e f e r t o t h e t y p i c a l a p p l i c a t i o n c i r c u i t . e l e c t r i c a l c h a r a c t e r i s t i c s unless otherwise noted, these specifications apply over v in =v out +3v, c in =1 m f, c out =2.2 m f, t a =-40 to 85 o c. apl5155 symbol parameter test conditions min. typ. max. unit power - on - reset (por) and supply current v in input voltage 5.4 - 25 v rising v in por threshold 4 .5 5 5.25 v v in por hysteresis - 200 - mv i out = 0 ma , en=high, adj mode - 10 20 i q quiescent current i out = 0 ma , en=high, fix mode - 15 25 m a i qshdn shutdown supply current en=low, v in =19v - 1 3 m a reference and output voltage v ref reference voltage adjustable voltage version - 1.24 - v vref voltage accuracy i out =10ma, t a = 25 o c - 2 .5 - 2 .5 % vref t emperature coefficient t j = - 40 to 125 o c - 50 - ppm fixed voltage version - 3.3 - v out output voltage fixed voltage version - 5.0 - v output voltage accuracy i out =10ma, t a = 25 o c - 2 .5 - 2 .5 % i out load current range 0 - 150 ma reg line line regulation v out + 3 v c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 6 o p e r a t i n g w a v e f o r m s t h e t e s t c o n d i t i o n i s t a = 2 5 o c u n l e s s o t h e r w i s e s p e c i f i e d . t u r n o n r e s p o n s e ch1: v en , 5v/div, dc time: 0.5m s/div v in =12v, v out =3.3v, r out =33 w , c in =1 m f/x7r, c out =2.2 m f/x7r ch2: v out , 1v/div, dc t u r n o f f r e s p o n s e time: 0.2ms /div ch2: v out , 1v/div, dc ch1: v en , 5v/div, dc v in =12v, v out =3.3v, r out =33 w , c in =1 m f/x7r, c out =2.2 m f/x7r p o w e r o n time:5m s/div ch1: v in , 2v/div, dc ch2: v out , 1v/div, dc v in =12v, v out =3.3v, r out =33 w , c in =1 m f/x7r, c out =2.2 m f/x7r p o w e r o f f time:5m s/div ch2: v out , 1v/div, dc ch1: v in , 2v/div, dc v in =12v, v out =3.3v, r out =33 w , c in =1 m f/x7r, c out =2.2 m f/x7r 1 2 v en v out 1 v en v out 2 v out v in 1,2 v in v out 1,2 c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 7 o p e r a t i n g w a v e f o r m s ( c o n t . ) t h e t e s t c o n d i t i o n i s t a = 2 5 o c u n l e s s o t h e r w i s e s p e c i f i e d . l o a d t r a n s i e n t r e s p o n s e l i n e t r a n s i e n t r e s p o n s e ch1: v out , 100mv/div, offset=3.3v ch2: i out , 100ma/div, dc time: 50 m s/div v in =12v, v out =3.3v, c in =1 m f/x7r, c out =2.2 m f/ x7r, i out =3-150-3ma, falling/rising slew rate=1a/ m s ch1: v in , 1v/div, offset=11.5v ch2: v out , 50mv/div, offset=3.3v time: 50 m s/div v in =11.5-12.5-11.5v, falling/rising=1 m s, v out =3.3v, i out =10ma, c in =1 m f/x7r, c out =2.2 m f/ x7r p i n d e s c r i p t i o n pin no. sot - 23 - 5 sot - 89 sop - 8p name function 1 2 8 v in voltage s upply i nput pin. 2 1 7 gnd ground . 3 - 5 en enable input p in. logic low=shutdown; l ogic high=enable . 4 - 4 nc/adj nc: no connection (fixed output voltage version). adj: output v oltag e f eedback p in (adjust output voltage version). 5 3 1 v out regulator o utput p in . - - 2, 3, 6 nc no connection. v out 1 i out 2 1 2 v in v out c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 8 b l o c k d i a g r a m 1 . a d j u s t o u t p u t v o l t a g e ( s o t - 2 3 - 5 / s o p - 8 p ) 2 . f i x e d o u t p u t v o l t a g e ( s o t - 2 3 - 5 / s o p - 8 p ) por otp vin adj current- limit v ref 1.24v short-circuit current-limit vout soft- start control logic en gnd por otp vin gnd current- limit v ref 1.24v short-circuit current-limit vout soft- start control logic en c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 9 b l o c k d i a g r a m ( c o n t . ) 3 . f i x e d o u t p u t v o l t a g e ( s o t - 8 9 ) por otp vin gnd current- limit v ref 1.24v short-circuit current-limit vout soft- start control logic c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 0 t y p i c a l a p p l i c a t i o n c i r c u i t 1 . a d j u s t o u t p u t v o l t a g e ( s o t - 2 3 - 5 / s o p - 8 p ) v in v out apl5155 b apl5155 ka v in en gnd v out adj c in 1 m f c out 2.2 m f on off r1 r2 2 . f i x e d o u t p u t v o l t a g e ( s o t - 2 3 - 5 / s o p - 8 p ) v in v out v in en gnd v out c in 1 m f c out 2.2 m f on off v o u t = 1 . 2 4 v x ( r 1 + r 2 ) / r 2 3 . f i x e d o u t p u t v o l t a g e ( s o t - 8 9 ) v in v out apl5155 b apl5155 ka v in gnd v out c in 1 m f c out 2.2 m f c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 1 w h e r e t j - t a i s t h e t e m p e r a t u r e d i f f e r e n c e b e t w e e n t h e j u n c t i o n a n d a m b i e n t a i r . q j a i s t h e t h e r m a l r e s i s t a n c e b e t w e e n j u n c t i o n a n d a m b i e n t a i r . f o r c o n t i n u a l o p e r a t i o n , d o n o t e x c e e d t h e a b s o l u t e m a x i - m u m j u n c t i o n t e m p e r a t u r e r a t i n g o f t j = 1 2 5 o c . f o r e x a m p l e : i n s o t - 2 3 - 5 p a c k a g e q j a = 2 3 5 o c / w . w h e n o p e r a t e s t h e a p l 5 1 5 5 a t t a = 5 0 o c , t h e m a x i m u m p o w e r d i s s i p a t i o n c a n b e d e t e r m i n e d a s b e l o w : a p p l i c a t i o n i n f o r m a t i o n t h e r m a l p a d c o n s i d e r a t i o n ja a j ) max ( d t t p q - = p d ( m a x ) = ( 1 2 5 o c - 5 0 o c ) / ( 2 3 5 o c / w ) p d ( m a x ) = 3 1 9 . 1 m w enable/shutdown the apl5155 features an active-high enable pin that al- lows the regulator to be disabled. forcing the enable pin low disables the regulator, so current consumed by the regulator goes nearly to zero. forcing the enable pin high enables the output voltage. the enable pin can not float. input capacitor the apl5155 has high input voltage up to 25v. the input capacitor must be rated to sustain voltages that may be used on the input. an input capacitor may be required when the device is not near the source power supply or when supplied by a battery. small and surface-mounted ceramic capacitors can be used for bypassing. a larger value may be required if the source supply has high ripple. output capacitor the apl5155 requires an output capacitor for stability. the design requires 1 m f or greater on the output to main- tain stability. it is optimized by using low-esr ceramic chip capacitors. the maximum allowable esr is 3 w . more capacitance improves transient response. place the out- put capacitor as close to the vout pin as possible. x7r/x5r dielectric-type ceramic capacitors are recom- mended because of their temperature performance. x7r type capacitors change capacitance by 15% over their operating temperature ranges. to use a ceramic chip capacitor with y5v dielectric, the value must be much higher than an x7r ceramic capacitor to ensure the same minimum capacitance over the equivalent operating tem- perature range. no-load stability the apl5155 will remain stable and in regulation with no load unlike many other voltage regulators. this is espe- cially important in cmos ram keep-alive applications. thermal consideration t h e t h e r m a l r e s i s t a n c e o f j u n c t i o n t o a m b i e n t c o n t r o l s t h e a p l 5 1 5 5 ' s m a x i m u m p o w e r d i s s i p a t i o n . t h e p o w e r d i s s i p a t i o n a c r o s s t h e d e v i c e i s p d = i o u t ( v i n - v o u t ) , a n d t h e m a x i m u m p o w e r d i s s i p a t i o n i s : the sop-8p is a cost-effective package which features a small size, like a standard sop-8, and a bottom thermal pad to minimize the thermal resistance of the package is applicable to high current applications. the thermal pad must be soldered down to the copper plane on circuit board. heat can be conducted away from the thermal pad through the copper plane to ambient. if the copper plane is not on the top surface of the circuit board, 4 or 6 vias should be used to thermally couple the thermal pad to the bottom plane. for good thermal conduction, the vias must be plated through and solder filled. the copper plane used to con- duct heat away from the thermal pad should be as large as practical. sop-8p layout recommendation 0.150 0.072 0.212 0.118 ground plane for t hermal pad 0.024 c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 2 a p p l i c a t i o n i n f o r m a t i o n ( c o n t . ) ? ? ? ? ? ? ? ? ? ? + = 2 1 ref out r r 1 v v where v ref =1.24v the resistors should be placed as close the device as possible to avoid noise. r e c o m m e n d e d m i n i m u m f o o t p r i n t s o t - 2 3 - 5 0 . 0 5 0.02 0 . 1 0.038 0.076 unit : inch s o t - 8 9 0 . 0 6 7 0.022 0 . 1 4 0 0.059 0.076 unit : inch 0 . 1 0 4 s o p - 8 p 0 . 2 1 2 0 . 0 7 2 0.050 0.024 1 2 3 4 8 7 6 5 0 . 1 1 8 0.138 unit : inch adjustable regulator application the output voltage of apl5155 can be adjusted from 3v to 20v by using two external resistors. the resistors set the output voltage based on the following equation: c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 3 p a c k a g e i n f o r m a t i o n s o t - 2 3 - 5 max. 0.057 0.051 0.024 0.006 0.009 0.020 0.012 l 0.30 0 e e1 e1 e d c b 0.08 0.30 0.60 0.012 0.95 bsc 1.90 bsc 0.22 0.50 0.037 bsc 0.075 bsc 0.003 min. millimeters s y m b o l a1 a2 a 0.00 0.90 sot-23-5 max. 1.45 0.15 1.30 min. 0.000 0.035 inches 8 0 8 0 b c e1 0 l view a 0 . 2 5 gauge plane seating plane a a 2 a 1 e d e e 1 see view a 1.40 2.60 1.80 3.00 2.70 3.10 0.122 0.071 0.118 0.102 0.055 0.106 note : 1. follow jedec to-178 aa. 2. dimension d and e1 do not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 10 mil per side. c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 4 p a c k a g e i n f o r m a t i o n s o t - 8 9 s y m b o min. max. millimeters sot-89 min. max. inches a c e1 e b b1 d d1 h e l e 1 1.60 0.44 0.35 0.44 4.40 4.60 1.62 1.83 0.56 2.13 a b c d d1 e e1 e e1 b1 0.36 0.48 3.00 bsc 3.94 4.25 2.29 2.60 2.29 0.118 bsc 0.063 0.017 0.014 0.019 0.014 0.017 0.173 0.181 0.064 0.072 0.084 0.155 0.167 0.090 0.102 0.090 0.022 l 0.89 0.035 h 1.50 bsc 0.059 bsc 1.40 1.20 0.047 0.055 l note : follow jedec to-243 aa. c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 5 p a c k a g e i n f o r m a t i o n s o p - 8 p thermal pad d d1 e 2 e 1 e e b a 2 a a 1 view a l 0 . 2 5 gauge plane seating plane q note : 1. followed from jedec ms-012 ba. 2. dimension "d" does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. dimension "e" does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 10 mil per side. 0.020 0.010 0.020 0.050 0.006 0.063 max. 0.40 l q 0 o c e e h e1 0.25 d c b 0.17 0.31 0.016 1.27 8 o c 0 o c 8 o c 0.50 1.27 bsc 0.51 0.25 0.050 bsc 0.010 0.012 0.007 millimeters min. s y m b o l a1 a2 a 0.00 1.25 sop-8p max. 0.15 1.60 min. 0.000 0.049 inches d1 2.50 0.098 2.00 0.079 e2 3.50 3.00 0.138 0.118 4.80 5.00 0.189 0.197 3.80 4.00 0.150 0.157 5.80 6.20 0.228 0.244 h x 4 5 o c see view a -t- seating plane < 4 mils c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 6 application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.30 1.75 ? 0.10 3.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sot - 23 - 5 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.0 min. 0.6+0.00 - 0.4 0 3.20 ? 0.20 3.10 ? 0.20 1.50 ? 0.20 application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.50 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sot - 89 4.0 ? 0.10 8.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 4.80 ? 0.20 4.50 ? 0.20 1.80 ? 0.20 application a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sop - 8p 4.0 ? 0.10 8.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 6.40 ? 0.20 5.20 ? 0.20 2.10 ? 0.20 (mm) c a r r i e r t a p e & r e e l d i m e n s i o n s a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 h t1 a d c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 7 d e v i c e s p e r u n i t package type unit quantity sot - 23 - 5 tape & reel 3000 sot - 89 tape & reel 1000 sop - 8p tape & reel 2500 s o t - 8 9 user direction of feed user direction of feed t a p i n g d i r e c t i o n i n f o r m a t i o n s o t - 2 3 - 5 c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 8 c l a s s i f i c a t i o n p r o f i l e user direction of feed t a p i n g d i r e c t i o n i n f o r m a t i o n s o p - 8 p c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 1 9 profile feature sn - pb eutectic assembly pb - free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 1 2 0 seconds average ramp - up rate (t smax to t p ) 3 c/second ma x. 3 c/second max. liquidous temperature ( t l ) time at l iquidous (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak package body temperature (t p ) * see classification temp in table 1 see classification temp in table 2 time (t p ) ** within 5 c of the spec ified c lassification t emperature ( t c ) 2 0 ** seconds 3 0 ** seconds average r amp - down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to p eak t emperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined a s a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. c l a s s i f i c a t i o n r e f l o w p r o f i l e s table 2. pb - free process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm ? 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c table 1. snpb eutectic process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 22 0 c 3 2.5 mm 220 c 220 c r e l i a b i l i t y t e s t p r o g r a m test item method description solderability jesd - 22, b102 5 sec, 245 c holt jesd - 22, a108 1000 hrs, bias @ t j =125 c pct jesd - 22, a102 168 hrs, 100 % rh, 2atm , 121 c tct jesd - 22, a104 500 cycles, - 65 c~150 c hbm mil - std - 883 - 3015.7 vhbm ? 2kv mm jesd - 22, a1 15 vmm ? 200v latch - up jesd 78 10ms, 1 tr ? 100ma c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - s e p . , 2 0 1 2 a p l 5 1 5 5 w w w . a n p e c . c o m . t w 2 0 c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8 |
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