H48-2 thermal conductive pad in the thermal resistance vs pressure vs defection charts H48-2 provides low thermal impedance. as the pressure increases the thermal impedance decreases. H48-2 provides good compliance and softness. good thermal conductivity ultra soft and high compressibility natural tack easy to assemble good insulator shock and vibration absorber electronic components: ic / cpu / mos led / m/b / p/s / heat sink / lcd-tv / notebook pc / pc / telecom device / wireless hub etc.... ddr ii module / dvd applications / hand-set applications etc... features applications thermal resistance v.s pressure v.s defection property l37-3 unit tolerance test method colour dark red - - visual thickness (available thickness range) 0.2 - 20 mm - astm d374 0.0078 - 0.7874 inch - astm d374 thermal conductivity 2.2 w/mk - astm d5470 flammability rating v-0 - - ul 94 dielectric breakdown voltage ?5 kv/mm - astm d149 weight loss ?1 % - astm e595 specifc gravity 2.43 g/cm 3 0.2 astm d792 working temperature -40 to 200 ?c - - volume resistance ?10 12 ohm-cm - astm d257 elongation 282 % 0.28 astm d412 tensile strength 7 kgf/cm 2 2 astm d412 standard shape - sheets 320-320mm - - hardness 10 shore a 2 astm d2240 available with an adhesive backing 1. part number 2. size x-y-z 3. adhesive backing C 0-none, 1a-one side, 2a-two sides 4. quantity thermal conductivity: 2.2 w/mk (w/mk - z axis) hardness: 10 (shore a) (shore a) properties reach compliant rosh compliant tel: +44 20 8133 2062 email: sales @ tglobaltechnology.com web: www.tglobaltechnology.com skype: tglobal.technology
|
