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features applications description application circuit tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 2.75-w fixed gain mono filter-free class-d audio power amplifier wafer chip scale packaging (wcsp) maximize battery life and minimize heat ? nanofree? lead-free (pb-free: yzf) ? 0.5- m a shutdown current ? 3.0-ma quiescent current ideal for wireless handsets, pdas, and other ? high efficiency class-d mobile devices 88% at 400mw at 8 w 80% at 100mw at 8 w three fixed gain versions the tpa2032d1 (2v/v gain), tpa2033d1 (3v/v gain), and tpa2034d1 (4v/v gain) are 2.75-w high ? tpa2032d1 has a gain of 2 v/v (6db) efficiency filter-free class-d audio power amplifiers, ? tpa2033d1 has a gain of 3 v/v (9.5db) each in an approximately 1.5-mm 1.5-mm wafer ? tpa2034d1 has a gain of 4 v/v (12db) chip scale package (wcsp) that requires only one only one external component required external component. the pinout is the same as the tpa2010d1 except that the external gain setting ? internal matched input gain and feedback input resistors required by the tpa2010d1 are resistors for excellent psrr and cmrr integrated into the fixed gain tpa203xd1 family. ? optimized pwm output stage eliminates features like ?75db psrr and improved lc output filter rf-rectification immunity with a very small pcb ? psrr (?75 db) and wide supply voltage footprint (wcsp amplifier plus single decoupling (2.5 v to 5.5 v) eliminates need for a cap) make the tpa203xd1 family ideal for wireless dedicated voltage regulator handsets. a fast start-up time of 3.2 ms with minimal pop makes the tpa203xd1 family ideal for pda ? fully differential design reduces rf applications. rectification and eliminates bypass capacitor in wireless handsets, the earpiece, speaker phone, ? cmrr (?69 db)eliminates two input and melody ringer can each be driven by a tpa203xd1. the tpa203xd1 family has a low coupling capacitors 27- m v noise floor, a-weighted. thermal and short-circuit protection pinout very similar to tpa2010d1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. nanofree is a trademark of texas instruments. production data information is current as of publication date. copyright ? 2006, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. www .ti.com _+ in? in+ pwm h? bridge v o? v o+ internal oscillator to battery v dd gnd bias circuitry differential input tpa2032d1 shutdown a1 a2 a3 b1 b2 b3 c1 c2 c3 in+ gnd v o? v dd pv dd pgnd in? shutdwn v o+ 1,4 mm 9-ball wafer chip scale, yzf package, (top view of pcb) note: pin a1 is marked with a 0 . 1,55 mm 1,4 mm 1,55 mm tpa 203xd1 0402 ~ 2,5 mm ~ 1,7 mm c s c s
ordering information absolute maximum ratings recommended operating conditions package dissipation ratings tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. t a package part number symbol ?40 c to 85 c wafer chip scale packaging ? lead free (yzf) tpa2032d1yzf (1) bpx ?40 c to 85 c wafer chip scale packaging ? lead free (yzf) tpa2033d1yzf (1) bpy ?40 c to 85 c wafer chip scale packaging ? lead free (yzf) tpa2034d1yzf (1) bpz (1) the yzf package is only available taped and reeled. to order add the suffix r to the end of the part number for a reel of 3000, or add the suffix t to the end of the part number for a reel of 250 (e.g. tpa2032d1yzfr). over operating free-air temperature range unless otherwise noted (1) tpa2032d1, tpa2033d1, tpa2034d1 in active mode ?0.3 v to 6 v v dd supply voltage in shutdown mode ?0.3 v to 7 v v i input voltage ?0.3 v to v dd + 0.3 v continuous total power dissipation see dissipation rating table t a operating free-air temperature ?40 c to 85 c t j operating junction temperature ?40 c to 125 c t stg storage temperature ?65 c to 150 c esd electro-static discharge tolerance - human body model (hbm) for all pins (2) 2kv (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) the output pins vo? and vo+ are tolerant to 1.5kv hbm esd min nom max unit v dd supply voltage 2.5 5.5 v v ih high-level input voltage shutdown 1.3 v dd v v il low-level input voltage shutdown 0 0.35 v v ic common mode input voltage range v dd = 2.5 v, 5.5 v 0.5 v dd ?0.8 v t a operating free-air temperature ?40 85 c derating factor t a 25 c t a = 70 c t a = 85 c package (1 / q ja ) power rating power rating power rating yzf 4.8 mw/ c (1) 480 mw 264 mw 192 mw yzf 7.5 mw/ c (2) 750 mw 412 mw 300 mw (1) derating factor measured with jedec low-k board; 1s0p - one signal layer and zero plane layers. (2) derating factor measured with jedec high k board; 1s2p - one signal layer and two plane layers. please see jedec standard 51-3 for low-k board, jedec standard 51-7 for high-k board, and jedec standard 51-12 for using package thermal information. please see jedec document page for downloadable copies: http://www.jedec.org/download/default.cfm. 2 submit documentation feedback www .ti.com
electrical characteristics operating characteristics tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 t a = 25 c (unless otherwise noted) parameter test conditions min typ max unit tpa2032d1 5 25 output offset voltage |v os | inputs ac grounded, v dd = 2.5 v to 5.5 v tpa2033d1 5 25 mv (measured differentially) tpa2034d1 5 25 psrr power supply rejection ratio v dd = 2.5 v to 5.5 v ?75 -61 db v dd = 2.5 v ?69 -52 cmrr common mode rejection ratio v ic = 0.5 v to (v dd ?0.8 v) v dd = 3.6 v ? 69 -52 db v dd = 5.5 v ?69 -52 |i ih | high-level input current v dd = 5.5 v, v i = 5.8 v 50 m a |i il | low-level input current v dd = 5.5 v, v i = ?0.3 v 5 m a v dd = 5.5 v, no load 4 5.7 i (q) quiescent current v dd = 3.6 v, no load 3 ma v dd = 2.5 v, no load 2.2 3.7 i (sd) shutdown current v ( shutdown) = 0.35 v, v dd = 2.5 v to 5.5 v 0.5 0.8 m a v dd = 2.5 v 550 static drain-source on-state r ds(on) v dd = 3.6 v 420 m w resistance v dd = 5.0 v 350 output impedance in v ( shutdown) <= 0.35 v 2 k w shutdown f (sw) switching frequency v dd = 2.5 v to 5.5 v 240 300 400 khz tpa2032d1 5.5 6 6.5 gain v dd = 2.5 v to 5.5 v tpa2033d1 9.0 9.5 10.0 db tpa2034d1 11.5 12 12.5 resistance of internal pulldown r pd resistor from shutdown pin to 300 k w gnd t a = 25 c, r l = 8 w (unless otherwise noted) parameter test conditions min typ max unit v dd = 5 v 2.75 r l = 4 w , thd + n = 10%, f = 1 khz v dd = 3.6 v 1.35 w v dd = 2.5 v 0.59 v dd = 5 v 2.25 r l = 4 w , thd + n = 1%, f = 1 khz v dd = 3.6 v 1.12 w v dd = 2.5 v 0.48 p o output power v dd = 5 v 1.68 r l = 8 w , thd + n = 10%, f = 1 khz v dd = 3.6 v 0.85 w v dd = 2.5 v 0.38 v dd = 5 v 1.37 r l = 8 w , thd + n = 1%, f = 1 khz v dd = 3.6 v 0.68 w v dd = 2.5 v 0.31 v dd = 5 v, p o = 1 w, r l = 8 w , f = 1 khz 0.18% thd+ total harmonic distortion plus v dd = 3.6 v, p o = 0.5 w, r l = 8 w , f = 1 khz 0.11% n noise v dd = 2.5 v, p o = 200 mw, r l = 8 w , f = 1 khz 0.10% v dd = 3.6 v, inputs ac grounded f = 217 hz, k svr supply ripple rejection ratio ?73 db with c i = 1 m f v (ripple) = 200 mv pp snr signal-to-noise ratio v dd = 5 v, p o = 1 w, r l = 8 w , a weighted noise 100 db 3 submit documentation feedback www .ti.com
functional block diagram tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 operating characteristics (continued) t a = 25 c, r l = 8 w (unless otherwise noted) parameter test conditions min typ max unit no weighting 35 v dd = 3.6 v, f = 20 hz to 20 khz, v n output voltage noise m v rms inputs ac grounded with c i = 1 m f a weighting 27 v dd = 3.6 v, v ic = 1.0 v pp , v cm = 1.8 cmrr common mode rejection ratio f = 217 hz ?69 db v a v = 2 v/v 30.2 r i input impedance a v = 3 v/v 22.8 k w a v = 4 v/v 18.5 start-up time from shutdown v dd = 3.6 v 3.2 ms terminal functions terminal i/o description name yzf in? c1 i negative differential audio input in+ a1 i positive differential audio input v o- a3 o negative btl audio output v o+ c3 o positive btl audio output analog ground terminal. must be connected to same potential as pgnd using a direct connection gnd a2 i to a single point ground. high-current analog ground terminal. must be connected to same potential as gnd using a direct pgnd b3 connection to a single point ground. v dd b1 i power supply terminal. must be connected to same power supply as pv dd using a direct connection. voltage must be within values listed in recommended operating conditions table. high-current power supply terminal. must be connected to same power supply as v dd using a pv dd b2 i direct connection. voltage must be within values listed in recommended operating conditions table. shutdown c2 i shutdown terminal. when terminal is low the device is put into shutdown mode. 4 submit documentation feedback www .ti.com inputbuffer sc 300k
typical characteristics table of graphs test set-up for graphs tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 figure efficiency vs output power 1, 2 p d power dissipation vs output power 3, 4 supply current vs output power 5, 6 i dd supply current vs supply voltage 7 i (sd) shutdown current vs shutdown voltage 8 vs load resistance 9, 10 p o output power vs supply voltage 11 vs output power 12, 13 thd+n total harmonic distortion plus noise vs frequency 14, 15, 16, 17 vs common-mode input voltage 18 19, 20, 21, 22, 23, 24, 25, k svr supply voltage rejection ratio vs frequency 26, 27 vs time 28 gsm power supply rejection vs frequency 29 k svr supply voltage rejection ratio vs common-mode input voltage 30, 31, 32 vs frequency 33 cmrr common-mode rejection ratio vs common-mode input voltage 34 (1) c i was shorted for any common-mode input voltage measurement. all other measurements were taken with a 1- m f c i (unless otherwise noted). (2) a 33- m h inductor was placed in series with the load resistor to emulate a small speaker for efficiency measurements. (3) the 30-khz low-pass filter is required, even if the analyzer has an internal low-pass filter. an rc low-pass filter (100 w , 47-nf) is used on each output for the data sheet graphs. 5 submit documentation feedback www .ti.com tpa2032d1 in+ in ? out+ out ? v dd gnd c i c i measurement output + ? 1 m f + ? v dd load 30 khz low pass filter measurement input +?
tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 efficiency efficiency power dissipation vs vs vs output power output power output power figure 1. figure 2. figure 3. power dissipation supply current supply current vs vs vs output power output power output power figure 4. figure 5. figure 6. supply current shutdown current output power vs vs vs supply voltage shutdown voltage load resistance figure 7. figure 8. figure 9. 6 submit documentation feedback 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 po - output power - w p - power dissipation - w d v = 3.6 v, r = 4 dd l w v = 3.6 v, r = 8 dd l w class ab, 4 w class ab, 8 w www .ti.com 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 0.5 1 1.5 2 2.5 3 p - output power - w o p - power dissipation - w d v = 5 v, r = 4 dd l w class ab 4 w class ab 8 w v = 5 v, r = 8 dd l w 0 10 20 30 40 50 60 70 80 90 0 0.5 1 1.5 2 2.5 p - output power - w o efficiency - % v =2.5v dd v =3.6v dd v =5v dd class ab r =4 l w, 33 h 360320 280 240 200 160 120 8040 0 v =3.6v dd v =2.5v dd v =5v dd p - output power - w o i - supply current - ma dd r =8 ,33 h l w 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 2.5 3 3.5 4 4.5 5 5.5 v - supply voltage - v dd i - supply current - ma dd r = 8 , 33 h l w m r = 8 l w no load 650600 550 500 450 400 350 300 250 200 150 100 0 v =3.6v dd v =2.5v dd v =5v dd 0 0.5 1 1.5 3 2.5 2 p - output power - w o i - supply current - ma dd r =4 ,33 h l w 50 0 10 20 30 40 50 60 70 80 90 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 p - output power - w o efficiency - % r =8 l w, 33 h v =5v dd v =2.5v dd v =3.6v dd class ab 3.6 3.22.8 2.4 2 1.61.2 0.4 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 v = 2.5 v dd v = 5 v dd v = 3.6 v dd i - supply current - ma dd shutdown voltage - v r = no load l 0.8 p - output power - w o 0 0.5 1 1.5 2 2.5 3 3.5 4 9 14 19 24 29 r - load resistance - l w v = 3.6 v, 10% dd v = 2.5 v, 10% dd v = 5 v, 10% dd
tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 total harmonic distortion + output power output power noise vs vs vs load resistance supply voltage output power figure 10. figure 11. figure 12. total harmonic distortion + total harmonic distortion + total harmonic distortion + noise noise noise vs vs vs output power frequency frequency figure 13. figure 14. figure 15. total harmonic distortion + total harmonic distortion + total harmonic distortion + noise noise noise vs vs vs frequency frequency common mode input voltage figure 16. figure 17. figure 18. 7 submit documentation feedback www .ti.com 0 0.5 1 1.5 2 2.5 3 2.5 3 3.5 4 4.5 5 v - supply voltage - v dd 4 thd+n = 1% w 4 thd+n = 10% w 8 thd+n = 1% w 8 thd+n = 10% w p - output power - w o 0 0.5 1 1.5 2 2.5 4 9 14 19 24 29 r - load resistance - l w v = 2.5 v, 1% dd v = 3.6 v, 1% dd v = 5 v, 1% dd p - output power - w o 1 0.005 0.01 0.1 f - frequency - hz 20k 20 100 1k 10k p = 200 mw o p = 15 mw o p = 75 mw o thd+n - total harmonic distortion + noise - % r = 8 v = 2.5 v l dd w 1 0.01 0.1 f - frequency - hz 20k 20 100 1k 10k thd+n - total harmonic distortion + noise - % p = 1 w o r = 8 v = 5 v l dd w p = 50 mw o p = 250 mw o 20 0.05 0.1 1 10 3 10m 100m 1 p - output power - w o thd+n - total harmonic distortion + noise - % v = 5 v dd v = 2.5 v dd v = 3 v dd v = 3.6 v dd r = 4 l w 20 0.05 0.1 1 2 10m 100m 1 p - output power - w o thd+n - total harmonic distortion + noise - % v = 5 v dd v = 2.5 v dd v = 3 v dd v = 3.6 v dd r = 8 l w 10 1 0.01 0.1 f - frequency - hz 20k 20 100 1k 10k p = 500 mw o p = 25 mw o p = 125 mw o thd+n - total harmonic distortion + noise - % r l = 8 v = 3.6 v w dd 1 0.01 0.1 f - frequency - hz 20k 20 100 1k 10k v = 2.5 v dd v = 5 v dd v = 4 v dd v = 3.6 v dd v = 3 v dd thd+n - total harmonic distortion + noise - % r = 4 l w
tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 supply ripple rejection ratio supply ripple rejection ratio supply ripple rejection ratio vs vs vs frequency - tpa2032d1 frequency - tpa2033d1 frequency - tpa2034d1 figure 19. figure 20. figure 21. supply ripple rejection ratio supply ripple rejection ratio supply ripple rejection ratio vs vs vs frequency- tpa2032d1 frequency- tpa2033d1 frequency- tpa2034d1 figure 22. figure 23. figure 24. supply ripple rejection ratio supply ripple rejection ratio supply ripple rejection ratio vs vs vs frequency - tpa2032d1 frequency - tpa2033d1 frequency - tpa2034d1 figure 25. figure 26. figure 27. 8 submit documentation feedback www .ti.com -100 -90 -80 -70 -60 -50 -40 -30 10 100 1 k 100 k f - frequency - hz supply ripple rejection ratio - db 10 k inputs ac-grounded, c = 1 f, r = 8 , gain = 2 v/v il m w v = 5 v dd v = 2.5 v dd v = 3.6 v dd -100 -90 -80 -70 -60 -50 -40 -30 10 100 1 k 10 k 100 k f - frequency - hz supply ripple rejection ratio - db v = 3.6 v dd v = 2.5 v dd v = 5 v dd inputs ac-grounded, c = 1 f, r = 4 , gain = 2 v/v il m w -100 -90 -80 -70 -60 -50 -40 -30 10 100 1 k 10 k 100 k f - frequency - hz supply ripple rejection ratio - db v = 3.6 v dd v = 2.5 v dd v = 2.7 v dd v = 5 v dd inputs floating, r = 8 , gain = 2 v/v l w -100 -90 -80 -70 -60 -50 -40 -30 10 100 1 k 10 k 100 k f - frequency - hz supply ripple rejection ratio - db v = 2.5 v dd v = 2.7 v dd v = 3.6 v dd v = 5 v dd inputs floating, r = 8 , gain = 3 v/v l w -100 -90 -80 -70 -60 -50 -40 -30 10 100 1 k 10 k 100 k f - frequency - hz v = 2.5 v dd v = 2.7 v dd v = 3.6 v dd v = 5 v dd supply ripple rejection ratio - db inputs ac-grounded, c = 1 f, r = 8 , gain = 3 v/v il m w -100 -90 -80 -70 -60 -50 -40 -30 10 100 1 k 10 k 100 k f - frequency - hz supply ripple rejection ratio - db v = 2.5 v dd v = 2.7 v dd v = 3.6 v dd inputs ac-grounded, c = 1 f, r = 8 , gain = 4 v/v il m w v = 5 v dd -100 -90 -80 -70 -60 -50 -40 -30 10 100 1 k 10 k 100 k f - frequency - hz supply ripple rejection ratio - db vdd = 5 v vdd = 2.5 v vdd = 2.7 v vdd = 3.6 v inputs ac-grounded, c = 1 f, r = 4 , gain = 3 v/v il m w -100 -90 -80 -70 -60 -50 -40 -30 10 100 1 k 10 k 100 k f - frequency - hz supply ripple rejection ratio - db v = 2.5 v dd v = 2.7 v dd v = 3.6 v dd v = 5 v dd inputs floating, r = 8 , gain = 4 v/v l w -100 -90 -80 -70 -60 -50 -40 -30 10 100 1 k 10 k 100 k f - frequency - hz supply ripple rejection ratio - db v = 2.7 v dd v = 5 v dd v = 3.6 v dd inputs ac-grounded, c = 1 f, r = 4 , gain = 4 v/v il m w v = 2.5 v dd
tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 gsm power supply rejection gsm power supply rejection vs vs time frequency figure 28. figure 29. supply ripple rejection ratio supply ripple rejection ratio supply ripple rejection ratio vs vs vs dc common mode voltage - dc common mode voltage - dc common mode voltage - tpa2032d1 tpa2033d1 tpa2034d1 figure 30. figure 31. figure 32. common-mode rejection common-mode rejection ratio ratio vs vs frequency common-mode input voltage figure 33. figure 34. 9 submit documentation feedback www .ti.com v 200 mv/div dd v 20 mv/div out t - time - 2 ms/div -85 -80 -75 -70 -65 -60 -55 -50 -45 -40 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 v - common-mode input voltage - v ic v = 2.5 v dd v = 5 v dd cmrr - common-mode rejection ratio - db v = 3.6 v dd -85 -80 -75 -70 -65 -60 10 100 1 k 10 k 100 k f - frequency - hz cmrr - common mode rejection ratio - db v = 3.6 v, v = 1 vpp, r = 8 dd ic l w -90 -80 -70 -60 -50 -40 -30 -20 -10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 dc common-mode voltage - v supply ripple rejection ratio - db v = 2.5 v dd v = 3.6 v dd v = 5 v dd -90 -80 -70 -60 -50 -40 -30 -20 -10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 dc common-mode voltage - v supply ripple rejection ratio - db v = 2.5 v dd v = 3.6 v dd v = 5 v dd 0 -140 -120 -100 -80 -60 -40 -20 0 2k 200 400 600 800 1k 1.2k 1.4k 1.6k1.8k f - frequency - hz v - supply v oltage - dbv dd v - output v oltage - dbv o v shown in figure 22 c = 1 f, inputs ac-grounded dd i m -150 -130 -110 -90 -70 -50 -30 10 -10 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 dc common-mode voltage - v supply ripple rejection ratio - db v = 3.6 v dd v = 5 v dd v = 2.5 v dd
application information fully differential amplifier advantages of fully differential amplifiers component selection decoupling capacitor (c s ) input capacitors (c i ) (1) tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 the tpa2032d1 is a fully differential amplifier with differential inputs and outputs. the fully differential amplifier consists of a differential amplifier and a common-mode amplifier. the differential amplifier ensures that the amplifier outputs a differential voltage on the output that is equal to the differential input times the gain. the common-mode feedback ensures that the common-mode voltage at the output is biased around v dd /2 regardless of the common-mode voltage at the input. the fully differential tpa2032d1 can still be used with a single-ended input; however, the tpa2032d1 should be used with differential inputs when in a noisy environment, like a wireless handset, to ensure maximum noise rejection. input-coupling capacitors not required: ? the fully differential amplifier allows the inputs to be biased at voltage other than mid-supply. the inputs of the tpa2032d1 can be biased anywhere within the common mode input voltage range listed in the recommended operating conditions table. if the inputs are biased outside of that range, input-coupling capacitors are required. midsupply bypass capacitor, c (bypass) , not required: ? the fully differential amplifier does not require a bypass capacitor. any shift in the midsupply affects both positive and negative channels equally and cancels at the differential output. better rf-immunity: ? gsm handsets save power by turning on and shutting off the rf transmitter at a rate of 217 hz. the transmitted signal is picked-up on input and output traces. the fully differential amplifier cancels the signal better than the typical audio amplifier. figure 35 shows the tpa2032d1 typical schematic with differential inputs, while figure 36 shows the tpa2032d1 with differential inputs and input capacitors. figure 37 shows the tpa2032d1 with a single-ended input. the tpa2032d1 is a high-performance class-d audio amplifier that requires adequate power supply decoupling to ensure the efficiency is high and total harmonic distortion (thd) is low. for higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (esr) ceramic capacitor, typically 1 m f, placed as close as possible to the device v dd lead works best. placing this decoupling capacitor close to the tpa2032d1 is very important for the efficiency of the class-d amplifier, because any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency. for filtering lower-frequency noise signals, a 10 m f or greater capacitor placed near the audio power amplifier would also help, but it is not required in most applications because of the high psrr of this device. typically, the smaller the capacitor's case size, the lower the inductance and the closer it can be placed to the tpa2032d1. the tpa2032d1 does not require input coupling capacitors if the design uses a differential source that is biased within the common-mode input voltage range. that voltage range is listed in the recommended operating conditions table. if the input signal is not biased within the recommended common-mode input range, such as in needing to use the input as a high pass filter, shown in figure 36 , or if using a single-ended source, shown in figure 37 , input coupling capacitors are required. the same value capacitors should be used on both in+ and in? for best pop performance. the value of the input capacitor is important to consider as it directly affects the bass (low frequency) performance of the circuit. speaker response may also be taken into consideration when setting the corner frequency using input capacitors. 10 submit documentation feedback www .ti.com f c 1 2 r i c i
(2) tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 application information (continued) equation 2 is reconfigured to solve for the input coupling capacitance. if the corner frequency is within the audio band, the capacitors should have a tolerance of 10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below. for a flat low-frequency response, use large input coupling capacitors (1 m f or larger). figure 35. typical tpa2032d1 application schematic with differential input for a wireless phone figure 36. tpa2032d1 application schematic with differential input and input capacitors 11 submit documentation feedback www .ti.com c i 1 2 r i f c _+ in?in+ pwm h? bridge v o? v o+ internal oscillator c s t o battery v dd gnd bias circuitry differential input tpa2032d1 filter-free class d shutdown _+ in? in+ pwm h? bridge v o? v o+ internal oscillator c s t o battery v dd gnd bias circuitry differential input tpa2032d1 filter-free class d shutdown c i c i
board layout tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 application information (continued) figure 37. tpa2032d1 application schematic with single-ended input in making the pad size for the wcsp balls, it is recommended that the layout use nonsolder mask defined (nsmd) land. with this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. figure 38 and table 1 show the appropriate diameters for a wcsp layout. the tpa2032d1 evaluation module (evm) layout is shown in the next section as a layout example. figure 38. land pattern dimensions 12 submit documentation feedback www .ti.com _+ in? in+ pwm h? bridge v o? v o+ internal oscillator c s t o battery v dd gnd bias circuitry single-ended input tpa2032d1 filter-free class d shutdown c i c i coppert race width solder maskthickness solderpad width solder mask opening copper t race thickness
component location trace width tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 application information (continued) table 1. land pattern dimensions solder pad solder mask copper stencil stencil copper pad definitions opening thickness opening thickness nonsolder mask 275 m m 375 m m 1 oz max (32 m m) 275 m m x 275 m m sq. 125 m m thick defined (nsmd) (+0.0, ?25 m m) (+0.0, ?25 m m) (rounded corners) notes: 1. circuit traces from nsmd defined pwb lands should be 75 m m to 100 m m wide in the exposed area inside the solder mask opening. wider trace widths reduce device stand off and impact reliability. 2. recommended solder paste is type 3 or type 4. 3. best reliability results are achieved when the pwb laminate glass transition temperature is above the operating range of the intended application. 4. for a pwb using a ni/au surface finish, the gold thickness should be less 0.5 m m to avoid a reduction in thermal fatigue performance. 5. solder mask thickness should be less than 20 m m on top of the copper circuit pattern. 6. best solder stencil performance is achieved using laser-cut stencils with electro polishing. use of chemically etched stencils results in inferior solder paste volume control. 7. trace routing away from wcsp device should be balanced in x and y directions to avoid unintentional component movement due to solder wetting forces. place all the external components very close to the tpa2032d1. placing the decoupling capacitor, c s , close to the tpa2032d1 is important for the efficiency of the class-d amplifier. any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency. recommended trace width at the solder balls is 75 m m to 100 m m to prevent solder wicking onto wider pcb traces. figure 39 shows the layout of the tpa2032d1 evaluation module (evm). for high current pins (v dd , gnd v o+ , and v o- ) of the tpa2032d1, use 100- m m trace widths at the solder balls and at least 500- m m pcb traces to ensure proper performance and output power for the device. for input pins (in?, in+, and shutdown) of the tpa2032d1, use 75- m m to 100- m m trace widths at the solder balls. in? and in+ traces need to run side-by-side to maximize common-mode noise cancellation. 13 submit documentation feedback www .ti.com
efficiency and thermal information (3) (4) tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 figure 39. close up of tpa2032d1 land pattern from tpa2032d1 evm the maximum ambient temperature depends on the heat-sinking ability of the pcb system. the derating factor for the yzf package is shown in the dissipation rating table. converting this to q ja : given q ja (from the package dissipation ratings table), the maximum allowable junction temperature (from the absolute maximum ratings table), and the maximum internal dissipation (from power dissipation vs output power figures) the maximum ambient temperature can be calculated with the following equation. note that the units on these figures are watts rms. because of crest factor (ratio of peak power to rms power) from 9?15 db, thermal limitations are not usually encountered. the tpa2032d1 is designed with thermal protection that turns the device off when the junction temperature surpasses 150 c to prevent damage to the ic. note that using speakers more resistive than 4- w dramatically increases the thermal performance by reducing the output current and increasing the efficiency of the amplifier. q ja is a gross approximation of the complex thermal transfer mechanisms between the device and its ambient environment. if the q ja calculation reveals a potential problem, a more accurate estimate should be made. please contact ti for further information. 14 submit documentation feedback www .ti.com ja 1 derating factor 375 m (+0, -25 m) 275 m (+0, -25 m) circular solder mask opening paste mask (stencil) = copper pad size 75 m 100 m 100 m 100 m 100 m 100 m 75 m 75 m t a max t j max ja p dmax
when to use an output filter tpa2032d1 tpa2033d1 tpa2034d1 slos476 ? june 2006 design the tpa2032d1 without an output filter if the traces from the amplifier to the speaker are short. wireless handsets and pdas are great applications for this class-d amplifier to be used without an output filter. the tpa2032d1 passed fcc- and ce-radiated emissions testing with no shielding with speaker trace wires 100 mm long or less. for longer speaker trace wires, a ferrite bead can often be used in the design if failing radiated emissions testing without an lc filter; and, the frequency-sensitive circuit is greater than 1 mhz. if choosing a ferrite bead, choose one with high impedance at high frequencies, but very low impedance at low frequencies. the selection must also take into account the currents flowing through the ferrite bead. ferrites can begin to loose effectiveness at much lower than rated current values. please see the evm user's guide for components used successfully by ti. figure 40 shows a typical ferrite-bead output filter. figure 40. typical ferrite chip bead filter 15 submit documentation feedback www .ti.com 1 nf ferrite chip bead v o? v o + ferrite chip bead 1 nf
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant tpa2032d1yzfr dsbga yzf 9 3000 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 tpa2032d1yzft dsbga yzf 9 250 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 tpa2033d1yzfr dsbga yzf 9 3000 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 tpa2033d1yzft dsbga yzf 9 250 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 tpa2033d1yzft dsbga yzf 9 250 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 tpa2034d1yzfr dsbga yzf 9 3000 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 tpa2034d1yzfr dsbga yzf 9 3000 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 tpa2034d1yzft dsbga yzf 9 250 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 package materials information www.ti.com 18-may-2011 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) tpa2032d1yzfr dsbga yzf 9 3000 220.0 220.0 34.0 tpa2032d1yzft dsbga yzf 9 250 220.0 220.0 34.0 tpa2033d1yzfr dsbga yzf 9 3000 190.5 212.7 31.8 tpa2033d1yzft dsbga yzf 9 250 190.5 212.7 31.8 tpa2033d1yzft dsbga yzf 9 250 220.0 220.0 34.0 tpa2034d1yzfr dsbga yzf 9 3000 220.0 220.0 34.0 tpa2034d1yzfr dsbga yzf 9 3000 190.5 212.7 31.8 tpa2034d1yzft dsbga yzf 9 250 220.0 220.0 34.0 package materials information www.ti.com 18-may-2011 pack materials-page 2

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